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| HV895 Liquid Lens Driver Features Drives capacitive loads up to 200pF Programmable drive amplitude (up to 60VRMS) On-chip boost converter No external inductor www..com I2C interface Low operating current (20mA) Low standby current (1.0A) Controlled drive edge reduces EMI 1.0mm x 6.0mm flip-chip General Description The HV895 is designed to drive liquid lenses of up to 200pF with a 1.5kHz waveform at amplitudes up to 60VRMS, controlled via an I2C interface. A single byte (AMP) written to the HV895 controls the operation of the driver. Setting AMP = 01h to FFh controls output amplitude in 255 monotonic steps. Setting AMP = 00h causes the HV895 to go into low power standby mode, consuming less than 1.0A. When active, the HV895 draws less than 20mA. A charge pump boost converter integrated on-chip provides the high voltage necessary for driving the lens. No external inductors or diodes are needed. Two ceramic 0402 size capacitors are the only external components required for a complete lens driver circuit. The narrow die size and only 2 small external components allow an entire lens driver circuit to be incorporated inside a camera module. An H-bridge output stage provides AC drive to the lens, allowing the use of a single high voltage boost converter while providing alternating polarity to the lens. Controlled rising and falling edges on the drive waveform reduces EMI. The HV895 is offered in a 1.0mm x 6.0mm lead-free solderbumped flip-chip. Applications Cell phone and PDA cameras Bar code readers Web and laptop cameras Biometric scanners Ultracompact cameras Typical Application Circuit I2C bus VDD 1.7 -2.95V VDD OUT1 SDA SCL HV895 OUT2 HV GND1 GND2 Liquid Lens 100 -200pF VIN 2.65 - 5.5V CIN 2.2F 6.3V VIN1 VIN2 CHV 4.7nF 100V HV895 Ordering Information Device HV895BD This product is RoHS compliant (`Green') VDD VIN2 SDA GND2 SCL HV Ball Configuration Die Option Lead-free solder-bumped die DUM1 DUM2 VIN1 GND1 www..com OUT2 OUT1 Absolute Maximum Ratings Parameter VIN, VDD SDA, SCL Operating temperature Storage temperature Value -0.5V to 6.5V -0.5V to 6.5V -40C to +85C -65C to +150C Orientation mark Solder-bumped Die (bottom view) Product Marking H L V L 8 L 9 L 5 L B L D L L Y L W L Device may not meet specifications, but will incur no damage. Y = Year W = Week L = Lot Number Solder-bumped Die (top view) Recommended Operating Conditions Sym VIN VDD tVIN CIN CHV CLOAD fSCL TA Parameter Supply voltage I2C logic level reference Time for VIN to ramp to 90% Supply bypass capacitor High voltage storage capacitor Load (lens) capacitance I C clock Ambient temperature 2 (1) Min 2.65 1.70 24 100 -25 Typ 2.2 150 - Max 5.5 2.95 2.0 200 400 +85 Units V V ms F x CLOAD pF kHz O Conditions --------100V rating ------- C Notes: 1. To assure the driver powers up in standby state. No damage will occur if ramped up slower. Electrical Specifications (Over recommended operating conditions @ 25 C unless otherwise specified) O Sym IIN IDD HV Parameter VIN supply current VDD supply current Output voltage of internal boost converter Min 71 Typ 8.0 9.0 75 Max 500 20 500 12 79 Units nA mA nA A V Conditions AMP = 00h, SDA = VDD, SCL = VDD AMP = FFh, SDA = VDD, SCL = VDD AMP = 00h, SDA = VDD, SCL = VDD AMP = FFh, SDA = VDD, SCL = VDD CLOAD = 0pF 2 HV895 Electrical Specifications (cont.)(Over recommended operating conditions @ 25 C unless otherwise specified) O Sym VOUT(AC) VOUT(DC) DNL fOUT DX tSU tA VIL VIH VOL IL IH CLI dV/dt Parameter AC output voltage DC output offset voltage Differential non-linearity (guaranteed monotonic) Output frequency Transition time (fraction of period) Output slope Startup time to 90% amplitude Amplitude response time1 Logic low input voltage Logic high input voltage Logic low output voltage Logic low input current Logic high input current Logic input capacitance 1 Min 9.0 55.0 -2.0 -0.5 1.0 0.7 - Typ 0 9.6 59.7 0 1.5 4.7 4.7 - Max 10.0 62.7 +2.0 +0.5 2.0 20 5.0 0.30 0.2 10 10 10 Units VRMS V LSB kHz % V/s ms ms x VDD x VDD x VDD A A pF Conditions AMP = 00h AMP = 01h AMP = FFh --------CLOAD = 150pF, VIN = 3.8V AMP = 00h FFh, CHV = 4.7nF Over any 1-step AMP increment or decrement (except 00h) ----ILOAD = 3.0mA VDD = 1.70 - 2.95V VDD = 1.70 - 2.95V VDD = 1.70 - 2.95V, grounded or open www..com Notes: 1. Measured from the rising edge of the I2C acknowledge bit that terminates transmission of the AMP data byte. Block Diagram and Typical Application CHV 4.7nF 100V VIN2 VANA 2.65 - 5.50V VIN1 CIN 2.2F 6.3V GND1 HV HV895 DC/DC DAC OUT1 VDIG 1.70 - 2.95V VDD SDA I2C bus SCL 8 Host Controller Control amp enable H-bridge driver OUT2 CLENS 100 - 200pF Osc GND2 3 HV895 Output Waveform AMP=FFh DX dV/dt (all edges) VOUT AMP www..com Applications Information I2C The HV895 is a write-only fast mode I2C device. Logic voltages are referenced to VDD. Address The HV895 recognizes a 7-bit address. The device is pre-programmed with an I2C address of 0100011b. For other addresses, please contact the factory. Data A single byte written to the HV895 controls the operation of the lens driver. See the Command Table below. The MSB is clocked-in first. Command Table AMP Description Low power standby mode. When in standby mode, the internal boost converter and H-bridge oscillator are shut down, and the OUT pins are held at ground. 00h Any AMP value other than 00h brings the HV895 out of standby mode. The time it takes the HV895 to exit standby mode and achieve full output amplitude is less than 20ms with a 4.7nF capacitor on the HV pin. Faster startup times may be achieved by lowering CHV at the expense of possible waveform distortion. Controls output amplitude according to: 01h-FFh VOUT(RMS) = 9.4VRMS + (AMP * 197mVRMS) where AMP is an integer from 1 to 255 Supplies VIN must be ramped up in less than 2.0ms to assure the driver starts-up in standby mode. If brought up slower, the driver may not start-up in standby mode, with output amplitude at an indeterminate level. In this case, writing AMP = 00h brings the driver to standby mode. No damage will occur if ramped slower than 2.0ms. 4 HV895 Die Dimensions +0 1000-75 DUM2 DUM1 VIN1 GND1 500 25 VDD www..com +0 6000 -196 SDA GND2 SCL VIN2 HV 124-137 OUT2 0 442.8 143.3 0 Orientation mark this end, top side 100 25 OUT1 Y X Note: All dimensions in m Bottom View Side View Bump Coordinates and Descriptions (XY coordinates reference center of bump and are in m. Tolerance is 15m.) Bump VIN1 VIN2 VDD GND1 GND2 SCL SDA HV OUT1 OUT2 DUM1 DUM2 X 353.4 675.4 12.7 353.4 -14.8 12.7 12.7 722.4 666.3 0 3.9 702.9 Y 5201.7 2424.6 2891.0 4397.6 1844.0 1594.0 2171.2 1006.6 0.0 0 5334.2 5334.2 Description VIN1 supplies the DC-DC converter. VIN2 supplies the rest of the IC. They must be tied together. To minimize conducted EMI, bypass with a 2.2F ceramic capacitor to ground close to the IC. Externally supplied reference voltage for the I2C logic levels. Connect to the I2C bus supply. GND1 is the ground for the for the DC-DC converter, while GND2 is for the rest of the IC. Connect both to system ground. Serial clock for the I2C interface. The HV895 is a Fast Mode device (fSCL 400kHz). Serial data for the I2C interface. The HV895 is a write-only device, with a single 8-bit command byte (AMP, see page 4). High voltage DC output of the internal boost converter. Connect a 4.7nF, 100V ceramic capacitor to ground close to the IC. Outputs of the H-bridge driver. The liquid lens connects between these two bumps. When disabled (AMP = 00h), both of these outputs are held at ground. These bumps are for mechanical support only. Provide pads on the PCB for these solder bumps. No electrical connections should be made to these bumps. Doc.# DSFP-HV895 NR031408 5 |
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