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SMD
FYLS 1204B HR/UBC FYLS-1204BUHR/UBC 04
Features:
Compatible with automatic placement equipment Compatible with reflow solder process.
Radiation pattern.
Applications:
Automotive-Telecommumication Indicators Lcd Back-lights Illuminations
Descriptions:
Dice material: RAlGaAs. BInGaN Emitting Color: RRed. BBlue Lens Color: Water clear.
Relative Lumionous Intensity(LOP @max=1)
ratings(Ta=25 25 Absolute maximun ratings(Ta=25)
Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current Derating Linear From 25 Operating Temperature Range Storage Temperature Range MAX. Unit
R B 100 30 0.4
50 70
mW mA mA mA/
-30 to +80 85 -40 to +85
characteristics(Ta=25 Electrical and optical characteristics(Ta=25) Parameter
Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength
Symbol
IV R B
Min.
--100 625 465 620 463 25 23 ---
Typ.
80 38 110 630 470 625 468 30 28 2.1 3.2
Max.
--120 635 475 630 473 35 33 2.4 3.6 10
Unit
mcd Deg nm
Test Condition
21/2 p R B R B R B R B IR
d
nm
IF=20mA
Spectral Line Half-Width
nm
Forward Voltage Reverse Current
VF
V A VR=5V
SMD
Electrical Typical Electrical Characteristics Curves (25 (25 Ambient Temperature Unless Otherwise Noted)
Spectral Reduance
(1) (2)
Normalized Response
(1)peak@470nm /Blue (2)peak@630nm /Red
Wave Length(nm)
Forward Current Vs Forward Voltage
50
Relative Luminous intensity vs Forward current
3.0
Relative Intensity (Lop@20mA=1)
Forward Current(mA)
40
2.5 2.0 1.5 1.0 0.5 0 50
30
20
10
0 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9
0
10
Forward
20
Current IF(mA)
30
40
Forward Voltage(V)
Forward Current Derating Curve 60 50 Forward Current(mA) 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 InGaN/SiC AlGaInP I n G a N / A l 2 O3 Relative Luminous Intensity
Luminous Intensity Vs. Ambient Temperature
2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 80 100
Ambient Temperature TA( C)
Ambient Temperature TA( C )
SMD
Precautions For Use
Over-current-proof
Customer must apply resistors for protection,otherwise slight voltage shift will cause big current chang(Burn out will happen)
Storage 1. The operation of temperature and R.H are:5 ---30,R.H.60% Max. 2. Once the package is opened ,the products should be used within a week. Otherwise,they
Should be kept in a dampproof box with desccating regent.Considering the tape life,we Suggest our customers to use our products within 1.5year (form production date).
3. It's recommended to bake before soldering when the package is unsealed after 72hrs.The
Condition is: 60 5 for 15 hrs.
Soldering Iron:
Temperature at tip of iron:300 Max.(25W Max) Soldering time:31sec.
Reflow Temp./Time:
Temperature Time
SMD
Package Package Dimensions of Device
Soldering Terminal
1.0
Cathode mark
0.65
5.0 1.0
LED Die
3.2
PCB
only tor fixed
Resin
1.5
2.0
1.5
0.5 1.5
0.65
Unit:mm
Tape Specification: 3000pcs Per Reel. Packing
Item Spec. Tolerance Item Spec. Tolerance
W P1 E F
Size
D0 D1 P0
1.0
0.9
Unit
mm mm
8.00 0.20 10P0 40.00 0.20
4.00 0.10 P2 2.00 0.05
1.75 0.10 A0 2.80 0.10
3.50 0.05 B0 3.35 0.10
1.50 +0.1/-0 K0 1.65 0.10
1.00 0.05 T 0.23 0.05
4.00 0.05
Unit
mm mm
Cathode
D0
P2
P0
A'
E
K0
5 P1 A0
A' SEC:A-A'
Package Dimensions of Reel:
60+0.5/-0
13.50.2
1781.0
Unit:mm
120.15 90.1
B0 t
D1
F W
SMD
Packing Packing and Shipping Spec.
L1
sb
sb
Zip-lock
Desiccant Antistatic Bag
W1
Desiccant Spec.
Spec. 203.0.
Spec. 198.0
Unit:mm
Box Dimension(cm):30 * 19* 11.5
s) pc Y( 'T Q . NO
RT PA
10 Reels per box
CARTON Dimension(cm):39*32*38 6boxs/carton 0603B/0603/0805: 4000pcs*10Reels*6boxs 0805B/1206B/1206 1210/1204: 3000pcs*10Reels*6boxs* 3528:2000pcs*10Reels*6boxs 5050:1000pcs*8Reels*6boxs
S KG KG W M G. 8C *3 W 31 N. 8* :3 AS S
C/NO
ME

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