la44b/sbi.g-pf doc. no : qw0905-l rev. : a date : 17 - jan. - 2008 a44b/sbi.g-pf data sheet ligitek electronics co.,ltd. property of ligitek only led array pb lead-free parts
2.54 0.5 0.5 typ 5.05 0.5 2.54typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lsbi2640-1-pf lg2640-1-pf + - 3.4x2 3.0x2 la44b/sbi.g-pf part no. 5.0 sbi 2.65 3.0 0.5 g 4.4 package dimensions page 1/6 9.65 9.0 2.5 0.5 ligitek electronics co.,ltd. property of ligitek only 0.5 typ 25.0min 1.0min 2.54typ 4.3 3.3 2.9 3.1 1.5max + -
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) la44b/sbi.g-pf part no. 2/6 page absolute maximum ratings at ta=25 ligitek electronics co.,ltd. property of ligitek only electrostatic discharge( * ) operating temperature storage temperature tstg -30 ~ +100 t opr esd -20 ~ +80 500 v peak forward current duty 1/10@10khz power dissipation reverse current @5v forward current parameter ratings mw a ma ma unit pd ir i fp 120 50 70 i f symbol 30 sbi static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * --- 10 100 30 120 g peak wave length pnm viewing angle 2 1/2 (deg) forward voltage @ ma(v) dominant wave length dnm spectral halfwidth nm luminous intensity @20ma(mcd) emitted la44b/sbi.g-pf ingan/sicblue part no material 40 430 blue diffused lens 465 color max. 4.7 653.8 typ . 2850 min. typ. 20 green emitted material part no gap viewing angle 2 1/2 (deg) spectral halfwidth nm peak wave length pnm 30 green diffused lens 565 1.72.6 min.max. 20 1250 typ. min. color forward voltage @20ma(v) luminous intensity @10ma(mcd) la44b/sbi.g-pf
fig.2 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y ( % ) wavelength (nm) typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a d c ) ligitek electronics co.,ltd. property of ligitek only sbi chip 580 0 10 15 5 20 680 0 0.5 430 380 480 630 530 25 30 1.0 13 245 page 3/6 lead temperature ( ) forward current (ma dc) fig.3 relative intensity vs. forward current r e l a t i v e i n t e n s i t y ( % ) fig.4 relative intensity vs. lead temperature r e l a t i v e i n t e n s i t y 0 10 fig.5 forward current vs. ambient temperature ambient temperature ( ) f o r w a r d c u r r e n t ( m a d c ) 0 25 50 75 100 125 0 5 10 1520 2530 3540 45 1 0 255075100 0 255075100 0 10 20 30 40 part no. la44b/sbi.g-pf
4/6 page 3.5 ligitek electronics co.,ltd. property of ligitek only 3.0 2.5 fig.2 relative intensity vs. forward current 1000 10 forward current(ma) 100 2.0 1.0 1.5 0.0 5.0 3.0 2.0 forward voltage(v) 4.0 0.5 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a g chip 1000 1.0 10 0.1 f o r w a r d c u r r e n t ( m a ) 100 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 1.0 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 80100 60 -20 40 20 0 ambient temperature( ) 0.0 80100 -2002040 ambient temperature( ) 60-40 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 1.2 1.1 0.9 1.0 0.8 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength -40 600 550 650 wavelength (nm) 0.5 0.0 500 r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 part no. la44b/sbi.g-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 25 120 50 100 150 preheat time(sec) 2 /sec max 260 temp( c) 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2.wave soldering profile page 5/6 ligitek electronics co.,ltd. property of ligitek only part no. la44b/sbi.g-pf
mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. thermal shock test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test test itemtest condition reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. description reference standard ligitek electronics co.,ltd. property of ligitek only page 6/6 part no. la44b/sbi.g-pf
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