dual color led lamps 19 - mar. doc. no : qw0905- rev. : date : b - 2007 leg42292/s2-pf leg42292/s2-pf data sheet ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation leg42292/s2-pf part no. package dimensions 1/6 page 1.anode green 2.common cathode 3.anode orange 2 1 3 g e 3 2 1 3.0 0.5 2.0typ 5.2 6.7 0.5 1.5 max 2.0typ 4.0 3.0 4.2 0.5 typ
unit symbol parameter min. 1.7 forward voltage @20ma(v) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part no leg42292/s2-pf 45 635 white diffused gaasp/gap orange color material emitted spectral halfwidth nm wave length nm lens p peak 70 20 2.68.0 10 viewing angle 2 1/2 (deg) luminous intensity @ ma(mcd) typ. max. min. -40 ~ +100 typical electrical & optical characteristics (ta=25 ) storage temperature tstg peak forward current duty 1/10@10khz power dissipation reverse current @5v operating temperature forward current 100 pd t opr -40 ~ +85 ir10 i fp 30 i f 120 e mw a ma ma ligitek electronics co.,ltd. property of ligitek only part no. absolute maximum ratings at ta=25 ratings 2/6 page g 30 120 100 gap green 565301.72.68.02070 leg42292/s2-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 wavelength (nm) 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 10 1.0 1000 e chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 0.5 forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 700750 3/6 page leg42292/s2-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 4/6 page leg42292/s2-pf part no.
page 5/6 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) temp( c) 120 260 5 /sec max 260 c3sec max 100 150 time(sec) 2 /sec max 50 25 0 0 preheat 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) leg42292/s2-pf part no.
ligitek electronics co.,ltd. property of ligitek only reference standard description reliability test: test item test condition the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. operating life test high temperature storage test low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 page6/6 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test solder resistance test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 leg42292/s2-pf part no.
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