maximum ratings all ratings: t c = 25c unless otherwise specified. caution: these devices are sensitive to electrostatic discharge. proper handling procedures should be followed. rf power mosfets n- channel enhancement mode 200v 300w 45mhz the ARF467FL is a rugged high voltage rf power transistor designed for scientific, commercial, medical and industrial rf power amplifier applications up to 45 mhz. it has been optimized for both linear and high efficiency classes of operation. ? specified 150 volt, 40.68 mhz characteristics: ? output power = 300 watts. ? gain = 16db (class ab) ? efficiency = 75% (class c) ? low cost flangeless rf package. ? low vth thermal coefficient. ? low thermal resistance. ? optimized soa for superior ruggedness. static electrical characteristics symbol bv dss r ds(on) i dss i gss g fs v gs (th) characteristic / test conditions drain-source breakdown voltage (v gs = 0v, i d = 250 a) drain-source on-state resistance 1 (v gs = 10v , i d = 6.5a ) zero gate voltage drain current (v ds = 1000v, v gs = 0v) zero gate voltage drain current (v ds = 800v, v gs = 0v, t c = 125c) gate-source leakage current (v gs = 30v, v ds = 0v) forward transconductance (v ds = 25v, i d = 6.5a) gate threshold voltage (v ds = v gs , i d = 1ma) min typ max 1000 1.0 25 250 100 469 35 unit volts ohms a na mhos volts symbol v dss v dgo i d v gs p d r jc t j ,t stg t l parameter drain-source voltage drain-gate voltage continuous drain current @ t c = 25c gate-source voltage total power dissipation @ t c = 25c junction to case operating and storage junction temperature range lead temperature: 0.063" from case for 10 sec. ARF467FL 1000 1000 12 30 425 0.35 -55 to 175 300 unit volts amps volts watts c/w c g d s ARF467FL 050-4932 rev a 5-2007 microsemi website - http://www.microsemi.com ARF467FL
dynamic characteristics ARF467FL 30 45 60 75 90 105 120 frequency (mhz) figure 1, typical gain vs frequency class c v dd = 150v p out = 150w 30 25 20 15 10 5 0 gain (db) symbol c iss c oss c rss t d(on) t r t d(off) t f characteristic input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time test conditions v gs = 0v v ds = 50v f = 1 mhz v gs = 15v v dd = 500 v i d = 12a @ 25c r g = 1.6 ? min typ max 1900 230 40 12 8 41 10 unit pf ns functional characteristics symbol g ps test conditions f = 40.68 mhz v gs = 2.5v v dd = 150v p out = 300w no degradation in output power characteristic common source amplifier power gain drain efficiency electrical ruggedness vswr 10:1 min typ max 14 16 70 75 unit db % 1 pulse test: pulse width < 380s, duty cycle < 2% microsemi reserves the right to change, without notice, the specifications and information contained herein. 1 10 100 1000 35 30 25 20 15 10 5 0 02 4 6810 capacitance (pf) v ds , drain-to-source voltage (volts) figure 2, typical capacitance vs. drain-to-source voltage 4,000 1,000 500 100 50 10 .1 1 10 100 200 i d , drain current (amperes) v ds , drain-to-source voltage (volts) figure 4, typical maximum safe operating area v gs , gate-to-source voltage (volts) figure 3, typical transfer characteristics i d , drain current (amperes) v ds > i d (on) x r ds (on)max. 250sec. pulse test @ <0.5 % duty cycle t j = -55c t j = -55c t j = +125c t j = +25c t c =+25c t j =+175c single pulse operation here limited by r ds (on) c iss c oss c rss 48 10 5 1 .5 .1 1ms 10ms 100ms 100us 050-4932 rev a 5-2007
ARF467FL typical performance curves 050-4932 rev a 5-2007 t c , case temperature (c) figure 5, typical threshold voltage vs temperature v ds , drain-to-source voltage (volts) figure 6, typical output characteristics 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 -50 -25 0 25 50 75 100 125 150 25 20 15 10 5 0 0 5 10 15 20 25 30 i d , drain current (amperes) v gs(th) , threshold voltage (normalized) 7v 5v 6v v gs = 9v 8v figure 7b, transient thermal impedance model note: duty factor d = t 1 / t 2 peak t j = p dm x z jc + t c t 1 t 2 p dm single pulse z jc , thermal impedance (c/w) 10 -5 10 -4 10 -3 10 -2 10 -1 1.0 rectangular pulse duration (seconds) figure 7a, maximum effective transient thermal impedance, junction-to-case vs pulse duration 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 0.5 0.1 0.3 0.7 d = 0.9 0.05 table 1 - typical class ab large signal input - output impedance freq. (mhz) z ol ( ? ) 2.0 13.5 27.1 40.7 65 18 - j 11 1.3 - j 5 .40 - j 2.6 .20 - j 1.6 .11 + j 0.6 30 - j 1.7 25.7 - j 9.8 18 - j 13.3 12 - j 12.6 6.2 - j 8.9 z in - gate shunted with 25 ? i dq = 100ma z ol - conjugate of optimum load for 300 w output at v dd = 150v z in ( ? ) 0.126 0.170 0.0535 0.00748f 0.0556f 0.657f dissipated power (watts) t j ( c) t c ( c) z ext are the external thermal impedances: case to sink, sink to ambient, etc. set to zero when modeling only the case to junction. z ext
ARF467FL 050-4932 rev a 5-2007 microsemi?s products are covered by one or more of u.s.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 and foreign patents. us and foreign patents pendin g. all rights reserved. thermal considerations and package mounting: the rated power dissipation is only available when the package mounting surface is at 25 c and the junction tem- perature is 175 c. the thermal resistance between junc- tions and case mounting surface is 0.3 c/w. when instal- led, an additional thermal impedance of 0.17 c/w between the package base and the mounting surface is typical. in- sure that the mounting surface is smooth and flat. thermal j oint compound must be used to reduce the effects of small surface irregularities. use the minimum amount necessary to coat the surface. the heatsink should incorporate a cop- per heat spreader to obtain best results. the package design clamps the ceramic base to the heatsink. a clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the base and the heat sink. four 4-40 (m3) screws provide the required mounting force. torque the mounting screws to 6 in-lb (0.68 n-m). hazardous material warning the white ceramic portion of the device between leads and mounting surface is beryllium oxide, beo. beryllium oxide dust is to xic when inhaled. care must be taken during handling and mounting to avoid damage to this area. these devices must never be thrown away with general industrial or domesti c waste. l1 c1 r1 r3 r4 r5 ARF467FL l2 l3 c3 c4 c7 c6 r2 c2 c8 c9 l4 150v + - rf output rf input 40.68 mhz test circuit + - bias 0-12v c5 tl1 c1 -- 2200pf atc 700b c2-c5 -- arco 465 mica trimmer c6-c8 -- .1 f 500v ceramic chip c9 -- 3x 2200pf 500v chips cog l1 -- 3t #22 awg .25"id .25 "l ~55nh l2 -- 5t #16 awg .312" id .35"l ~176nh l3 -- 10t #24 awg .25"id ~.5uh l4 -- vk200-4b ferrite choke 3uh r1- r3 -- 1k ? 0.5w r4- r5 -- 1 ? 1w smt tl1 -- 40 ? t-line 0.15 x 2" c1 is ~1.75" from r4-5. .330 .210 .210 .325 +/- .01 .570 ARF467FL 1.500 .100 .100 .300 .200 .005 .040 .320 1.250 .125r 4 pls .125dia 4 pls t3 package outline d s s s s g
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