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| 1. general description the cbt3253a is a dual 1-of-4 high-speed ttl-compatible fet multiplexer/demultiplexer. the low on-resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. 1 oe, 2 oe, s0, and s1 select the appropriate b output for the a-input data. the cbt3253a is characterized for operation from - 40 c to +85 c. 2. features n 5 w switch connection between two ports n ttl-compatible input levels n minimal propagation delay through the switch n esd protection exceeds 2000 v hbm per jesd22-a114, 200 v mm per jesd22-a115 and 1000 v cdm per jesd22-c101 n latch-up testing is done to jedec standard jesd78 which exceeds 100 ma 3. ordering information [1] also known as qsop16. cbt3253a dual 1-of-4 fet multiplexer/demultiplexer rev. 02 8 february 2007 product data sheet table 1. ordering information t amb = - 40 c to +85 c type number topside mark package name description version cbt3253ad cbt3253ad so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 cbt3253adb c3253a ssop16 plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 cbt3253ads ct3253a ssop16 [1] plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm sot519-1 cbt3253apw ct3253a tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1
cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 2 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 4. functional diagram fig 1. logic diagram of cbt3253a (positive logic) 002aab828 2b4 13 2b3 12 2b2 11 2b1 10 1b4 3 1b3 4 1b2 5 1b1 6 1a 7 cbt3253a 2a 9 14 s0 2 s1 1 1oe 15 2oe cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 3 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 5. pinning information 5.1 pinning 5.2 pin description [1] b outputs are inputs if a inputs are outputs. fig 2. pin con?guration for so16 fig 3. pin con?guration for ssop16 fig 4. pin con?guration for ssop16 (qsop16) fig 5. pin con?guration for tssop16 cbt3253ad v cc s1 2oe 1b4 s0 1b3 2b4 1b2 2b3 1b1 2b2 1a 2b1 gnd 2a 002aab824 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 1oe s1 2oe 1b4 s0 1b3 2b4 1b2 2b3 1b1 2b2 1a 2b1 2a 1oe cbt3253adb v cc gnd 002aab825 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 s1 2oe 1b4 s0 1b3 2b4 1b2 2b3 1b1 2b2 1a 2b1 2a 1oe cbt3253ads v cc gnd 002aab826 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 s1 2oe 1b4 s0 1b3 2b4 1b2 2b3 1b1 2b2 1a 2b1 2a 1oe gnd cbt3253apw v cc 002aab827 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 table 2. pin description symbol pin description 1 oe 1 output enable (active low) s1 2 select-control input 1b4, 1b3, 1b2, 1b1 3, 4, 5, 6 b outputs [1] 1a 7 a input gnd 8 ground (0 v) 2a 9 a input 2b1, 2b2, 2b3, 2b4 10, 11, 12, 13 b outputs s0 14 select-control input 2 oe 15 output enable (active low) v cc 16 positive supply voltage cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 4 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 6. functional description refer to figure 1 logic diag r am of cbt3253a (positiv e logic) 6.1 function selection 7. limiting values [1] the input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. 8. recommended operating conditions table 3. function selection h = high state; l = low state; x = dont care inputs function 1 oe 2 oe s1 s0 x h x x disconnect 1a and 2a h x x x disconnect 1a and 2a llll1a to 1b1 and 2a to 2b1 lllh1a to 1b2 and 2a to 2b2 l l h l 1a to 1b3 and 2a to 2b3 l l h h 1a to 1b4 and 2a to 2b4 table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v v i input voltage - 0.5 [1] +7.0 v i ccc continuous current through each v cc or gnd pin - 128 ma i ik input clamping current v i <0v - - 50 ma t stg storage temperature - 65 +150 c table 5. operating conditions all unused control inputs of the device must be held at v cc or gnd to ensure proper device operation. symbol parameter conditions min typ max unit v cc supply voltage 4.5 - 5.5 v v ih high-level input voltage 2 - - v v il low-level input voltage - - 0.8 v t amb ambient temperature operating in free air - 40 - +85 c cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 5 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 9. static characteristics [1] all typical values are at v cc =5v, t amb =25 c. [2] this is the increase in supply current for each input that is at the speci?ed ttl voltage level rather than v cc or gnd. [3] measured by the voltage drop between the a and the b terminals at the indicated current through the switch. on-state resista nce is determined by the lowest voltage of the two (a or b) terminals. 10. dynamic characteristics [1] the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the speci?ed l oad capacitance, when driven by an ideal voltage source (zero output impedance). [2] output enable time to high and low level. [3] output disable time from high and low level. table 6. static characteristics t amb = - 40 c to +85 c symbol parameter conditions min typ [1] max unit v ik input clamping voltage v cc = 4.5 v; i i = - 18 ma - - - 1.2 v v pass pass voltage v i =v cc = 5.5 v; i o = - 100 m a 3.4 3.6 3.9 v i li input leakage current v cc =5v; v i = 5.5 v or gnd - - 1 m a i cc quiescent supply current v cc = 5.5 v; i o = 0 ma; v i =v cc or gnd --3 m a d i cc additional quiescent supply current (control inputs) v cc = 5.5 v; one input at 3.4 v; other inputs at v cc or gnd [2] - - 2.5 ma c i input capacitance (control pins) v i = 3 v or 0 v - 4.5 - pf c io(off) off-state input/output capacitance a port; v o = 3 v or 0 v; oe = v cc - 11.4 - pf b port; v o = 3 v or 0 v; oe = v cc - 3.8 - pf c io(on) on-state input/output capacitance a port and b port - 18.6 - pf r on on-state resistance [3] v cc = 4.5 v; v i =0v; i i =64ma - 5 7 w v cc = 4.5 v; v i =0v; i i =30ma - 5 7 w v cc = 4.5 v; v i = 2.4 v; i i = - 15 ma - 10 15 w table 7. dynamic characteristics v cc = +5.0 v 0.5 v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit t pd propagation delay from input (na or nbn) to output (nbn or na) [1] - - 0.25 ns from input (sn) to output (na or nbn) 1.2 - 6.2 ns t en enable time [2] from input (sn) to output (na or nbn) 1.3 - 6.3 ns from input (n oe) to output (na or nbn) 1.4 - 6.4 ns t dis disable time [3] from input (sn) to output (na or nbn) 1.1 - 7.2 ns from input (n oe) to output (na or nbn) 1.0 - 7 ns cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 6 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 10.1 ac waveforms v i = gnd to 3.0 v. t plz and t phz are the same as t dis . t pzl and t pzh are the same as t en . t plh and t phl are the same as t pd . fig 6. input to output propagation delay (1) waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. (2) waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. fig 7. 3-state output enable and disable times 002aab665 3.0 v 0 v v oh v ol t plh t phl 1.5 v 1.5 v input output 1.5 v 1.5 v 002aab666 3 v 3.5 v t plz 1.5 v 1.5 v output control (low-level enabling) output waveform 1 s1 at 7 v (1) 1.5 v t pzl v ol 0 v v ol + 0.3 v v oh 0 v 1.5 v v ol - 0.3 v output waveform 2 s1 open (2) t pzh t phz cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 7 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 11. test information test data are given in t ab le 8 . all input pulses are supplied by generators having the following characteristics: prr 10 mhz; z o =50 w ; t r 2.5 ns; t f 2.5 ns. the outputs are measured one at a time with one transition per measurement. c l = load capacitance includes jig and probe capacitance. r l = load resistance. fig 8. test circuit table 8. test data test load switch c l r l t pd 50 pf 500 w open t plz , t pzl 50 pf 500 w 7v t phz , t pzh 50 pf 500 w open c l 50 pf 002aab667 r l 500 w from output under test 7 v open gnd s1 r l 500 w cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 8 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 12. package outline fig 9. package outline sot109-1 (so16) x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1 cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 9 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer fig 10. package outline sot338-1 (ssop16) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o o 0.13 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot338-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 q a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 a max. 2 cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 10 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer fig 11. package outline sot519-1 (ssop16) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p z y w v q references outline version european projection issue date iec jedec jeita mm 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 5.0 4.8 4.0 3.8 0.635 1 6.2 5.8 0.89 0.41 0.18 0.05 8 0 o o 0.18 0.2 0.09 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. sot519-1 99-05-04 03-02-18 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 q a a 1 a 2 l p detail x l (a ) 3 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm sot519-1 a max. 1.73 cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 11 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer fig 12. package outline sot403-1 (tssop16) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 12 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 13. soldering this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 13.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus pbsn soldering 13.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 13 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 13.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 13 ) than a pbsn process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 9 and 10 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 13 . table 9. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 10. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 14 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 14. abbreviations msl: moisture sensitivity level fig 13. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 11. abbreviations acronym description cdm charged device model esd electrostatic discharge fet field-effect transistor hbm human body model mm machine model prr pulse rate repetition rc resistor-capacitor network ttl transistor-transistor logic cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 15 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 15. revision history table 12. revision history document id release date data sheet status change notice supersedes cbt3253a_2 20070208 product data sheet - cbt3253a_1 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? t ab le 5 oper ating conditions : C changed (v ih ) high-state input voltage to high-level input voltage C changed (v il ) low-state input voltage to low-level input voltage ? t ab le 6 static char acter istics : C c io(off) , a port: changed typ. value from 23.5 pf to 11.4 pf C c io(off) , b port: changed typ. value from 6.5 pf to 3.8 pf C added c io(on) speci?cation cbt3253a_1 (9397 750 12919) 20051024 product data sheet - - cbt3253a_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 8 february 2007 16 of 17 nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation. nxp semiconductors cbt3253a dual 1-of-4 fet multiplexer/demultiplexer ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 8 february 2007 document identifier: cbt3253a_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 6.1 function selection. . . . . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 4 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 10.1 ac waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.1 introduction to soldering . . . . . . . . . . . . . . . . . 12 13.2 wave and re?ow soldering . . . . . . . . . . . . . . . 12 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 13.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17 contact information. . . . . . . . . . . . . . . . . . . . . 16 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 |
Price & Availability of CBT3253ADS118
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