IPD75N04S4-06 optimos ? -t2 power-transistor features ? n-channel - enhancement mode ? aec qualified ? msl1 up to 260c peak reflow ? 175c operating temperature ? green product (rohs compliant) ? 100% avalanche tested maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25c, v gs =10v 75 a t c =100c, v gs =10v 2) 53 pulsed drain current 1) i d,pulse t c =25c 300 avalanche energy, single pulse 1) e as i d =35a 72 mj avalanche current, single pulse i as - 75 a gate source voltage v gs - 20 v power dissipation p tot t c =25c 58 w operating and storage temperature t j , t stg - -55 ... +175 c iec climatic category; din iec 68-1 - - 55/175/56 value v ds 40 v r ds(on),max 5.9 m ? i d 75 a product summary pg-to252-3-313 type package marking IPD75N04S4-06 pg-to252-3-313 4n0406 rev. 1.1 page 1 2010-07-15
IPD75N04S4-06 parameter symbol conditions unit min. typ. max. thermal characteristics 1) thermal resistance, junction - case r thjc - - - 2.6 k/w thermal resistance, junction - ambient, leaded r thja ---62 smd version, device on pcb r thja minimal footprint - - 62 6 cm 2 cooling area 2) --40 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0v, i d = 1ma 40 - - v gate threshold voltage v gs(th) v ds = v gs , i d =26a 2.0 3.0 4.0 zero gate voltage drain current i dss v ds =40v, v gs =0v, t j =25c - 0.015 1 a v ds =18v, v gs =0v, t j =85c 2) -120 gate-source leakage current i gss v gs =20v, v ds =0v - - 100 na drain-source on-state resistance r ds(on) v gs =10v, i d =75a - 5.0 5.9 m ? values rev. 1.1 page 2 2010-07-15
IPD75N04S4-06 parameter symbol conditions unit min. typ. max. d y namic characteristics 1) input capacitance c iss - 1960 2550 pf output capacitance c oss - 490 640 reverse transfer capacitance c rss -1535 turn-on delay time t d(on) -7-ns rise time t r -9- turn-off delay time t d(off) -6- fall time t f -8- gate char g e characteristics 1) gate to source charge q gs - 11.7 15.2 nc gate to drain charge q gd - 3.5 8.1 gate charge total q g - 24.5 32 gate plateau voltage v plateau - 5.9 - v reverse diode diode continous forward current 1) i s - - 75 a diode pulse current 1) i s,pulse - - 300 diode forward voltage v sd v gs =0v, i f =75a, t j =25c - 0.9 1.3 v reverse recovery time 1) t rr v r =20v, i f =50a, d i f /d t =100a/s -36-ns reverse recovery charge 1) q rr -31-nc 1) defined by design. not subject to production test. 2) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. t c =25c values v gs =0 v, v ds =25 v, f =1 mhz v dd =20v, v gs =10v, i d =75a, r g =3.5 ? v dd =32v, i d =75a, v gs =0 to 10v rev. 1.1 page 3 2010-07-15
IPD75N04S4-06 1 power dissipation 2 drain current p tot = f( t c ); v gs 6 v i d = f( t c ); v gs 6 v 3 safe operating area 4 max. transient thermal impedance i d = f( v ds ); t c = 25 c; d = 0 z thjc = f( t p ) parameter: t p parameter: d = t p / t single pulse 0.01 0.05 0.1 0.5 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 -2 10 -1 10 0 10 1 t p [s] z thjc [k/w] 1 s 10 s 100 s 1 ms 1 10 100 1000 0.1 1 10 100 v ds [v] i d [a] 0 10 20 30 40 50 60 0 50 100 150 200 t c [c] p tot [w] 0 10 20 30 40 50 60 70 80 0 50 100 150 200 t c [c] i d [a] rev. 1.1 page 4 2010-07-15
IPD75N04S4-06 5 typ. output characteristics 6 typ. drain-source on-state resistance i d = f( v ds ); t j = 25 c r ds(on) = f( i d ); t j = 25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. drain-source on-state resistance i d = f( v gs ); v ds = 6v r ds(on) = f( t j ); i d = 75 a; v gs = 10 v parameter: t j 3 4 5 6 7 8 9 -60 -20 20 60 100 140 180 t j [c] r ds(on) [m ? ] 5 v 5.5 v 6 v 6.5 v 7 v 10 v 0 40 80 120 160 200 240 280 01234 v ds [v] i d [a] 5.5 v 6 v 6.5 v 7 v 10 v 4 6 8 10 12 14 0 40 80 120 i d [a] r ds(on) [m ? ] -55 c 25 c 175 c 0 50 100 150 200 34567 v gs [v] i d [a] rev. 1.1 page 5 2010-07-15
IPD75N04S4-06 9 typ. gate threshold voltage 10 typ. capacitances v gs(th) = f( t j ); v gs = v ds c = f( v ds ); v gs = 0 v; f = 1 mhz parameter: i d 11 typical forward diode characteristicis 12 avalanche characteristics if = f(v sd ) i a s = f( t av ) parameter: t j parameter: t j(start) 25 c 175 c 10 3 10 2 10 1 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 v sd [v] i f [a] 26 a 150 a 1.5 2 2.5 3 3.5 4 -60 -20 20 60 100 140 180 t j [c] v gs(th) [v] ciss coss crss 10 2 10 3 10 4 0 5 10 15 20 25 30 v ds [v] c [pf] 10 1 25 c 100 c 150 c 0.1 1 10 100 0.1 1 10 100 1000 t av [s] i av [a] 25 c 175 c 10 3 10 2 10 1 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 v sd [v] i f [a] rev. 1.1 page 6 2010-07-15
IPD75N04S4-06 13 avalanche energy 14 drain-source breakdown voltage e as = f( t j ) v br(dss) = f( t j ); i d = 1 ma parameter: i d 15 typ. gate charge 16 gate charge waveforms v gs = f( q gate ); i d = 75 a pulsed parameter: v dd v gs q gate v gs(th) q g(th) q gs q gd q sw q g 36 38 40 42 44 46 -55 -15 25 65 105 145 t j [c] v br(dss) [v] 8 v 32 v 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 q gate [nc] v gs [v] 75 a 35 a 17 a 0 40 80 120 160 25 75 125 175 t j [c] e as [mj] rev. 1.1 page 7 2010-07-15
IPD75N04S4-06 published by infineon technologies ag 81726 munich, germany ? infineon technologies ag 2010 all rights reserved. legal disclaime r the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev. 1.1 page 8 2010-07-15
IPD75N04S4-06 revision history version revision 1.0 revision 1.1 changes final data sheet update of gate charge diagram date 06.04.2010 15.07.2010 rev. 1.1 page 9 2010-07-15
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