BGF117 high-speed mini-/micro-sd card esd protection and emi filter data sheet, v2.0, january 2010 rf & protection devices
edition 2010-01-15 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2010. all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the app lication of the device, infi neon technologies hereby disclaims any and all warranties a nd liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology , delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain da ngerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safe ty or effectiveness of that device or system. life support devices or systems are intended to be implanted in the hu man body, or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGF117 revision history: 2010-01-15, v2.0 previous version:2009-09-28, v1.2 page subjects (major change s since last revision) all target status removed BGF117 data sheet 3 v2.0, 2010-01-15
data sheet 4 v2.0, 2010-01-15 BGF117 high-speed mini-/micro-sd card esd protection and emi filter high-speed mini-/micro-sd card esd protection and emi filter features ? bidirectional esd protection and emi filter for high-speed mini-/micro-sd card interface ? esd protection according to iec61000-4 -2 for 15 kv contact discharge on all external ios ? esd protection according to iec61000-4-2 for 2 kv contact discharge on all internal ios ? very good emi filtering and very low cross talk due to small package parasitics ? suitable for high speed applications du e to low line capacitance of typical 8 pf ? very low voltage dependen cy of line capacitance ? very low leakage currents ? integrated pull up resistors to enable proper line biasing ? application requires very low pcb area using an optimized i/o arrangement ?400 m solder ball pitch ? rohs and weee co mpliant package ? complies with following standards: sd card specification v2.0, mi crosd card specification v1.0 wlp-16-4-n BGF117 _schematic_mini_ micro_ sd.vsd sddat 3/cd gnd sddat 2 sddat 1 sddat 0 sdcmd sdclk dat 2 dat 1 dat 0 cmd clk v cc r1, 40 r7, 25k r11, 25k r2, 40 r3, 40 r4, 40 r5, 40 r6, 40 r8, 25k r9, 25k r10, 25k b1 c1 a1 a2 d2 d1 b3, c2, c3 b2 b4 c4 a4 a3 d3 d4 int. ios ext. ios ho st card dat 3/ cd figure 1 schematic description BGF117 is an esd protection and emi f ilter circuit for a high speed multi me dia card and mini-/micro-sd interface with integrated pull up resistors. ex ternal pins are protected for 15 kv contact discharge according to iec61000- 4-2. due to the low electrical capacitance of each line bg f117 is well suited for high speed applications. the wafer level package is a green lead-free and halogen-free package with a size of only 1.55 mm x 1.55 mm and a total height of 0.6 mm. type package marking chip BGF117 wlp-16-4 17 n0740
table 1 maximum ratings parameter symbol values unit note / test condition min. typ. max. voltage at all pins to gnd v p 0 5.5 v operating temperature range t op -40 +85 c storage temperature range t stg -65 +150 c external ios: a3, a4 , b2, b4, c4, d3, d4 v e -15 15 kv contact discharge internal ios: a1, a2, b1, c1, d1, d2 v i -2 2 kv contact discharge table 2 electrical characteristics 1) 1) at t a = 25 c parameter symbol values unit note / test condition min. typ. max. resistors r 1 ... r 6 r 1...6 36 40 44 resistors r 7 ... r 11 r 7...11 20 25 30 k reverse current of esd protection diodes i r 5 100 na v r = 3 v breakdown voltage of esd diodes 2) after snap-back 2) v (br) ? 18.5 -12.5 ? v i (br) = 1 ma i (br) = -1 ma line capacitance 3) b2 is connected to gnd for measurement 3) capacitance of each line to gnd c t 8 9.5 pf v r = 0 v BGF117 high-speed mini-/micro-sd card esd protection and emi filter data sheet 5 v2.0, 2010-01-15 electrostatic discharge according to iec61000-4-2
data sheet 6 v2.0, 2010-01-15 BGF117 high-speed mini-/micro-sd card esd protection and emi filter typical electrical characteristics typical forward transmission of line b1 - b4 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 100e+3 1e+6 10e+6 100e+6 1e+9 10e+9 f [hz] s21 [db] figure 2 typical filter characteristics of one filter channel ( z s = z l = 50 ohm, v r =0v) typical line capacitance to gnd 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 012345 v line [v] c line [pf] figure 3 typical line capacitance versus bias voltage
BGF117 high-speed mini-/micro-sd card esd protection and emi filter data sheet 7 v2.0, 2010-01-15 application & signal routing sd card contact spring top layer second layer sd card contacts face down gnd dat0 dat1 clk vcc cmd dat3 dat2 dat 2 dat 3 cmd clk dat 0 dat 1 vcc sd-host BGF117 solder balls face down figure 4 application example with signal routing pull-up resistors for the data and command lines are integrat ed in BGF117 (r7 to r11) to prevent bus floating in case no card is inserted or all card drivers are in high impedance mode. package outline pin 1 corner index area 2) 1) dimension is measured at the maximum solder ball diameter, parallel to primary datum c 3) primary datum c and seating plane are defined by the spherical crowns of the balls 2) pin 1 corner identified by marking wlp-16-4-n-po v01 0.2 0.05 standoff c 0.1 0.6 0.05 16x coplanarity 0.08 c seating plane c 3) a1 a2 a3 b1 b2 b3 c1 c2 c3 a4 b4 c4 d1 d3 d2 d4 3 x 0.4 = 1.2 3 x 0.4 = 1.2 ) 0.05 1.55 b 0.05 1.55 a 16x 1) 0.04 0.25 ?0.05 m a b 0.4 0.4 0.05 (0.175 ) 0.05 (0.175 ) 0.05 (0.175 ) 0.05 (0.175 figure 5 package outline for wlp-16-4 (dimensions in mm)
data sheet 8 v2.0, 2010-01-15 BGF117 high-speed mini-/micro-sd card esd protection and emi filter footprint wlp-16-4-n-fp v01 0.4 1.2 0.4 1.2 0.25 figure 6 recommended pcb pad design for reflow soldering (dimensions in mm) tape wlp-16-4-n-tp v01 4 1.8 8 1.8 0.23 0.8 pin 1 corner index area figure 7 tape for BGF117 / wlp-16-4 (dimensions in mm)
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