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TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 1 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? applications ? vsat ? point-to-point radio ? test equipment & sensors 28-pin 5x5 mm qfn package product features functional block diagram ? rf frequency range: 17 ? 27 ghz ? if frequency: dc ? 4 ghz ? lo frequency: 6.5 ? 15.5 ghz ? lo input power: 2 to 9 dbm ? conversion gain: 15 db ? noise figure: 2.5 db ? package dimensions: 5.0 x 5.0 x 1.3 mm general description pin configuration the triquint TGC4610-SM is a k-band image reject downconverter. the TGC4610-SM operates over an rf frequency range of 17 to 27 ghz and lo from 6.5 to 15.5 ghz with if outputs from dc to 4 ghz. this part is designed using triquint?s phemt production process. the TGC4610-SM integrates an lna, and image reject mixer driven by a multiplier. it typically provides an input ip3 of 3 dbm at ?25 dbm input power per tone and has a conversion gain of 15 db and noise figure of 2.5 db or less. the TGC4610-SM is available in a low-cost, surface mount 28 lead 5x5 mm qfn package and is ideally suited for point-to-point radio, and k- band vsat ground terminal applications. lead-free and rohs compliant. evaluation boards are available upon request. pin # function label 1, 7, 8, 14, 15, 21, 22, 28 gnd 2, 4, 5, 6, 12, 16, 18, 20, 25, 26 nc 3 rf in 9 lo in 10 vdlo1 11 vgx 13 vdlo23 17 if1 19 if2 23 vdrf4v 24 vdrf 27 vgrf ordering information part no. eccn description TGC4610-SM ear99 k-band downconverter standard t/r size = 500 pieces on a 13? reel. 4 6 1 0 1 2 3 2 6 4 2 5 x2
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 2 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? specifications absolute maximum ratings parameter rating vdrf 6 v vdlo 6 v idrf 150 ma idlo 375 ma vgx, vgrf -3 to 0 v power dissipation 1.6 w rf input power, 50 , t = 25 c 10 dbm channel temperature, tch 200 c storage temperature -65 to 125 c operation of this device outside the parameter rang es given above may cause permanent damage. recommended operating conditions parameter min typ max units operating temp. range -40 +25 +85 c vdrf 3 v idrf 68 ma vdlo 3 v idlo 160 ma vgrf -0.65 v vgx -1.1 v lo input power 2 9 dbm electrical specifications are measured at specified test conditions. specifications are not guaranteed ove r all recommended operating conditions. electrical specifications test conditions unless otherwise noted: if input power = -25 dbm, lo input power = 5.5 dbm , vgx = -1.1 v, vdlo = 3 v, idlo = 160 ma, vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. parameter conditions min typ max units rf frequency range 17 27 ghz lo frequency range 6.5 15.5 ghz if frequency range dc 4 ghz lo input power 2 9 dbm drain current, lo (idlo) 160 ma drain current, rf (idrf) 68 ma conversion gain 15 db input third order intercept point (iip3) 3 dbm image rejection (imr) 20 db noise figure 2.5 db
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 ? 2012 triquint semiconductor, inc. specifications thermal and reliability information parameter thermal resistance, jc , measured to back of package channel temperature (tch), and median lifetime (tm ) channel temperature (tch), and median lifetime (tm) under rf drive - 3 of 26 - disclaimer: subject to change without notice connecting the digital world to the global network thermal and reliability information condition , measured to back of package tbase = 85 c channel temperature (tch), and median lifetime (tm ) tbase = 85 c, vdrf = 3 v, idrf = 68 ma vdlo = 3 v, idlo = 1 60 ma pdiss = 0.68 w temperature (tch), and median lifetime (tm) tbase = 85 c vdrf = 3 v, idrf = 68 ma vdlo = 3 v, idlo = 220 ma pin = -25 dbm pdiss = 0.86 w disclaimer: subject to change without notice digital world to the global network ? rating jc = 73.5 c/w 60 ma tch = 135 c tm = 5.8 e+6 hours tch = 148 c tm = 1.3 e+6 hours
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 4 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 0 10 20 30 40 50 60 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 0 10 20 30 40 50 60 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 5 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. if lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 0 10 20 30 40 50 60 70 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. if lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 0 10 20 30 40 50 60 70 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. if lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 0 10 20 30 40 50 60 70 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. if lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. if lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 6 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 0 10 20 30 40 50 60 70 6 8 10 12 14 16 3 x lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. if lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 0 10 20 30 40 50 60 70 6 8 10 12 14 16 3 x lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. if lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 ghz 2 ghz 3 ghz 4 ghz 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 10 12 14 16 18 20 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 17 ghz 22 ghz 27 ghz 10 12 14 16 18 20 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 17 ghz 22 ghz 27 ghz
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 7 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb 85 c 25 c -40 c 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85 c 25 c -40 c 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb 85 c 25 c -40 c 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85 c 25 c -40 c -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85 c 25 c -40 c -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb 85 c 25 c -40 c
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 8 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 m a, vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb 85 c 25 c -40 c 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb 85 c 25 c -40c 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb 85 c 25 c -40c -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85 c 25 c -40 c 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85 c 25 c -40c 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85 c 25 c -40c
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 9 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85 c 25 c -40 c 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. temperature if = 1 ghz, lo = 2.0 dbm, vgx = -1.1 v, lsb 85 c 25 c -40 c 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb 85c 25 c -40 c 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf vs. temperature if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb 85c 25 c -40 c
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 10 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 55 to 82 ma, vgrf = -0.7 to -0 .6 v. data taken with external if hybrid. 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 11 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 55 to 82 ma, vgrf = -0.7 to -0 .6 v. data taken with external if hybrid. -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 12 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 55 to 82 ma, vgrf = -0.7 to -0 .6 v. data taken with external if hybrid. 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 3 x lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 3 x lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 55 ma 68 ma 82 ma 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf vs. idrf if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 55 ma 68 ma 82 ma
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 13 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 14 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 2 x lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 15 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v 0 1 2 3 4 5 6 17 19 21 23 25 27 noise figure (db) rf frequency (ghz) noise figure vs. rf vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 3 x lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. vgx if = 1 ghz, lo = 5.5 dbm, usb, 25 c 1.1 v 1.2 v 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 3 x lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. vgx if = 1 ghz, lo = 5.5 dbm, lsb, 25 c 1.1 v 1.2 v
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 16 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. lo if = 1 ghz, vgx = -1.1 v, lsb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 10 12 14 16 18 20 16 18 20 22 24 26 28 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. lo if = 1 ghz, vgx = -1.1 v, usb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. lo if = 1 ghz, vgx = 1.1 v, usb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 10 15 20 25 30 35 40 16 18 20 22 24 26 28 image rejection (db) rf frequency (ghz) image rejection vs. rf vs. lo if = 1 ghz, vgx = -1.1 v, lsb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. lo if = 1 ghz, vgx = -1.1 v, lsb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm -4 -2 0 2 4 6 8 10 16 18 20 22 24 26 28 input ip3 (dbm) rf frequency (ghz) input ip3 vs. rf vs. lo if = 1 ghz, vgx = 1.1 v, usb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 17 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. lo if = 1 ghz, vgx = -1.1 v, lsb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. lo if = 1 ghz, vgx = -1.1 v, lsb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. lo if = 1 ghz, vgx = -1.1 v, lsb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo vs. lo if = 1 ghz, vgx = -1.1 v, usb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) 2 x lo isolation vs. lo vs. lo if = 1 ghz, vgx = -1.1 v, usb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm -10 -5 0 5 10 15 16 18 20 22 24 26 28 rf isolation (db) rf frequency (ghz) rf isolation vs. rf vs. lo if = 1 ghz, vgx = -1.1 v, usb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 18 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. 0 10 20 30 40 50 60 70 80 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. lo if = 1 ghz, vgx = -1.1 v, usb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 0 10 20 30 40 50 60 70 80 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) 3 x lo isolation vs. lo vs. lo if = 1 ghz, vgx = -1.1 v, lsb, 25 c 2.0 dbm 5.5 dbm 9.0 dbm 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 x lo 2 x lo 3 x lo 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 2 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 x lo 2 x lo 3 x lo 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 1 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 x lo 2 x lo 3 x lo 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 2 ghz, lo = 5.5 dbm, vgx = 1.1 v, usb, 25 c 1 x lo 2 x lo 3 x lo
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 19 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? typical performance if input power = -25 dbm, vdlo = 3 v, idlo = 160 ma , vdrf = 3 v, idrf = 68 ma, vgrf = -0.65 v. data taken with external if hybrid. m x n spurious outputs for usb 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 3 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 x lo 2 x lo 3 x lo 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 4 ghz, lo = 5.5 dbm, vgx = -1.1 v, lsb, 25 c 1 x lo 2 x lo 3 x lo 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 3 ghz, lo = 5.5 dbm, vgx = 1.1 v, usb, 25 c 1 x lo 2 x lo 3 x lo 0 10 20 30 40 50 60 70 4 6 8 10 12 14 16 lo isolation (db) lo frequency (ghz) lo isolation vs. lo frequency if = 4 ghz, lo = 5.5 dbm, vgx = -1.1 v, usb, 25 c 1 x lo 2 x lo 3 x lo rf/lo 0 1 2 3 -3 --- 49 52 51 -2 --- 56 57 63 -1 --- 28 0 26 0 --- 12 0 14 1 10 44 23 47 2 52 50 51 --- if = 2.0 ghz; rf = 17 - 27 ghz; lo = 7.5 - 12.5 ghz rf/lo 0 1 2 3 -3 --- 47 50 --- -2 --- 53 56 56 -1 --- 30 0 32 0 --- 10 -2 13 1 10 39 21 49 2 51 51 51 --- if = 4.0 ghz; rf = 17 - 27 ghz; lo = 6.5 - 11.5 ghz
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 20 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? pin description top view pin symbol description 1, 2, 4, 5, 6, 7, 8, 12, 14,15, 16, 20, 21, 22, 25, 26, 28 gnd internal grounding; must be grounded on pcb. 3 rf in rf input matched to 50 ohms, ac coupled. 9 lo in lo input, matched to 50 ohms, ac coupled. 10 vdlo1 lo drain voltage. bias network is required; see ap plication circuit on page 21 as an example. 11 vgx lo gate voltage. bias network is required; see appl ication circuit on page 21 as an example. 13 vdlo23 lo drain voltage. bias network is required; see application circuit o n page 21 as an example. 17 if1 if output matched to 50 ohms, dc coupled. 18 nc no internal connection; should be left open. 19 if2 if output matched to 50 ohms, dc coupled. 23 vdrf4v rf drain voltage for 4 v operation. bias network is required; see application circuit on page 21 as an example. 24 vdrf rf drain voltage. bias network is required; see app lication circuit on page 21 as an example. 27 vgrf rf gate voltage. bias network is required; see appl ication circuit on page 21 as an example. 29 gnd backside paddle. multiple vias should be employed to minimize inductance and thermal resistance; see mounting con figuration on page 24 for suggested footprint.
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 21 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? application circuit biasing procedures bias up bias down set vgx to -1.1 v turn off rf signal set vdlo to 3 v set vdrf to 0 v set vgrf to -1.5 v set vdlo to 0 v set vdrf to 3 v set vgrf to 0 v increase vgrf to get idrf = 68 ma set vgx to 0 v apply rf signal . lo input 4610 yyww xxxx rf input vdrf4v vdlo23 vgrf if output usb lsb vgx vdlo1 if output vdrf vdlo1 vdlo23 vdrf open 4 v vdrf4v 4 v operation 3 v operation vdrf vdrf4v open vdlo23 vdlo1 3 v
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 22 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? application circuit pc board layout board material is ro4003 0.008? thickness with ? oz copper cladding. for further technical information, refer to the TGC4610-SM product information page . note: for 4 v operation, r3 = 22 and r4 = 8.2 . bill of material ref des value description manufacturer part number c1 ? c6 100 pf cap, 0402, 50v, 5%, npo various c7 ? c12 0.01 f cap, 0603, 25v, 5%, cog various c13 ? c18 1 f cap, 0805, 25v, 5%, x5r various r1 50 res, 0402, 0.05w, 0.1%, smd various r2 ? r4 0 res, 0402, 0.01w, smd various x1 power splitter mini-circuits qcn-19+ or qcn45+ u1 k-band downconverter triquint TGC4610-SM u1 r1 r2 x1 r3 r4 c1 c2 c3 c7 c9 c8 c12 c13 c14 c5 c6 c4 c10 c11 c12 c16 c18 c17 r1 r2 x1 lsb configuration
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 23 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? mechanical information package information and dimensions all dimensions are in millimeters. the TGC4610-SM will be marked with the ?4610? desig nator and a lot code marked below the part designat or. the ?yy? represents the last two digits of the year the part was manufactured, the ?ww? is the work we ek, and the ?xxxx? is an auto-generated number. this package is lead-free/rohs-compliant with a cop per alloy base (cda194), and the plating material o n the leads is nipdau. it is compatible with lead-free (m aximum 260 c reflow temperature) soldering process es.
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 24 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? mechanical information pcb mounting pattern all dimensions are in millimeters . notes: 1. the pad pattern shown has been developed and tes ted for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary fro m company to company, careful process development is recommended . 2. ground / thermal vias are critical for the proper p erformance of this device. vias should use a .35mm diameter drill and have a final plated thru diameter of .25 mm. tape and reel information tape and reel specifications for this part are also available on the triquint website in the ?applicat ion notes? section. standard t/r size = 500 pieces on a 13? reel. material cavity (mm) distance between centerline (mm) carrier tape (mm) cover tape (mm) vendor vendor p/n length (a0) width (b0) depth (k0) pitch (p1) length direction (p2) width direction (f) width (w) width (w) advantek bcc5x5-b 5.25 5.25 1.8 8.0 2.00 5.50 12.0 9.20
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 ? 2012 triquint semiconductor, inc. product compliance information esd information esd rating: 1a value: passes 250 v and < 500v test: human body model (hbm) standard: jedec standard jesd22 msl rating moisture sensitivity level (msl) msl1 at 260c reflow per jedec standard ipc/jedec j recommended soldering temperature profile - 25 of 26 - disclaimer: subject to change without notice connecting the digital world to the global network product compliance information 500v . model (hbm) jedec standard jesd22 -a114 solderability compatible with lead- free soldering processes, 260 maximum reflow temperature package lead plating: nipdau the use of no- clean solder to avoid washing after soldering is recommended. this package is not compatible with solder containing lead. rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free at 260c convection ipc/jedec j -std-020. recommended soldering temperature profile disclaimer: subject to change without notice digital world to the global network ? free soldering processes, 260 maximum reflow temperature . package lead plating: nipdau clean solder to avoid washing after compatible with solder compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and this product also has the following attributes: halogen free (chlorine, bromine) ) free
TGC4610-SM k-band downconverter preliminary data sheet: rev a 10/11/12 - 26 of 26 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the digital world to t he global network ? contact information for the latest specifications, additional product i nformation, worldwide sales and distribution locati ons, and information about triquint: web: www.triquint.com tel: +1.972.994.8465 email: info-sales@tqs.com fax: +1.972.994.8504 for technical questions and application information : email: info-networks@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding t he information contained herein. triquint assumes no responsibility or liability whatsoever for any of t he information contained herein. triquint assumes no responsibili ty or liability whatsoever for the use of the infor mation contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is ent irely with the user. all information contained her ein is subject to change without notice. customers should obtain and verify the latest relevant information before plac ing orders for triquint products. the information contained herei n or any use of such information does not grant, ex plicitly or implicitly, to any party any patent rights, license s, or any other intellectual property rights, wheth er with regard to such information itself or anything described by su ch information. triquint products are not warranted or authorized f or use as critical components in medical, life-savi ng, or life- sustaining applications, or other applications wher e a failure would reasonably be expected to cause s evere personal injury or death.

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