1/6 www.dynexsemi.com mp04xx780 pds5622-1.0 july 2003 features dual device module electrically isolated package pressure contact construction international standard footprint alumina (non-toxic) isolation medium applications power supplies rectifiers battery chargers voltage ratings key parameters v rrm 4500v i f(av) 782a i fsm (per arm) 15000a i f(rms) 1228a v isol 3000v 4500 4400 4200 4000 mp04xx780-45 mp04xx780-44 mp04xx780-42 mp04xx780-40 conditions t vj = ?0? to 150?c, v rsm = v rrm + 100v lower voltage grades available type number repetitive peak voltages v rrm v ordering information order as: mp04hb780-45 or mp04hb780-44 or mp04hb780-42 or mp04hb780-40 mp04g780-45 or MP04G780-44 or mp04g780-42 or mp04g780-40 mp04gn780-45 or mp04gn780-44 or mp04gn780-42 or mp04gn780-40 note: when ordering, please use the complete part number. please quote full part number in all correspondance. mp04xx780 dual rectifier diode module fig. 2 electrical connections - (not to scale) outline type code: mp04 (see package details for further information) code circuit hb g gn 12 3 12 3 12 3 fig.1 circuit diagrams
2/6 www.dynexsemi.com mp04xx780 half wave resistive load thermal and mechanical data dc conditions min. max. units o c/w - 0.060 halfwave t vj virtual junction temperature t stg storage temperature range - thermal resistance - junction to case (per diode) r th(j-c) symbol parameter screw torque 6 (53) - nm (lb.ins) 40 150 o c reverse (blocking) - 150 o c 3 phase - 0.066 o c/w - 0.056 o c/w symbol parameter conditions i f(av) mean forward current i f(rms) rms value units max. 782 a t case = 85 o c 712 a t case = 100 o c 596 a t case = 75 o c 1228 a t case = 85 o c 1118 a absolute maximum ratings - per arm stresses above those listed under 'absolute maximum ratings' may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum ratings for extended periods may affect device reliability. t case = 75 o c 10ms half sine; t j = 150 o c v r = 0 10ms half sine; t j = 150 o c v r = 50% v rrm i fsm surge (non-repetitive) forward current i 2 ti 2 t for fusing i fsm surge (non-repetitive) forward current i 2 t i 2 t for fusing 0.72 x 10 6 a 2 s 12 ka 1.125 x 10 6 a 2 s 15 ka v isol isolation voltage 3000 v commoned terminals to base plate ac rms, 1 min, 50hz mounting - - 12 (106) nm (lb.ins) electrical connections - 1580 g - - weight (nominal) t case = 100 o c 937 a
3/6 www.dynexsemi.com mp04xx780 note 1: the data given in this datasheet with regard to forward voltage drop is the for the calculation of the power dissipation in the semiconductor elements only. forward voltage drops measured at the power terminals will be in excess of these figures due to the impedance of the busbars from the terminals to the semiconductor. characteristics peak reverse current parameter c 2000 at t vj = 150 ? c- q s total stored charge i f = 1000a, di rr /dt = 3a/ s t case = 150 ? c, v r = 100v symbol i rrm i rr peak recovery current v to threshold voltage. see note 1. r t slope resistance. see note 1. 0.44 m ? at t vj = 150 ? c - 0.75 v -85a - at v rrm , t case = 150 o c-50ma conditions min. max. units curves fig.3 maximum (limit) forward characteristics 0.5 1.0 1.5 2.0 instantaneous forward voltage, v f - (v) 0 500 1000 1500 2000 2500 instantaneous forward current, i f - (a) measured under pulse conditions t j = 25 ? c t j = 150 ? c fig.4 power dissipation curves 0 500 1000 1500 2000 mean forward current, i f(av) - (a) 0 500 1000 1500 2000 2500 mean power dissipation - (w) dc half wave 3 phase 6 phase
4/6 www.dynexsemi.com mp04xx780 fig.5 maximum stored charge 0.1 1.0 10 100 rate of decay of on-state current, di f /dt - (a/s) 10000 1000 100 stored charge, q s - (c) conditions: t j = 150 ? c v r = 100v i f = 1000a i rm i f di f /dt q s fig.6 maximum reverse recovery current 0.1 1.0 10 100 rate of decay of forward current, di f /dt - (a/s) 1000 100 10 reverse recovery current, i rr - (a) conditions: t j = 150 ? c v r = 100v i f = 1000a fig.7 surge (non-repetitive) forward current vs time (with 50% v rrm @ t c - 150?c) 1101235102050 0 5 10 15 20 25 30 500 550 450 600 650 i 2 t value - (a 2 s x 10 3 ) ms cycles at 50hz duration peak half sine forward current - (ka) i 2 t = 2 x t 2 700 750 i 2 t fig.8 transient thermal impedance - dc 0 0.01 0.02 0.03 0.04 0.05 0.06 0.001 0.01 0.1 1 10 100 1000 time - (seconds) thermal resistance, r th(j-c) - ( c/w)
5/6 www.dynexsemi.com mp04xx780 package details for further package information, please contact customer services. all dimensions in mm, unless stated otherwise. do not scale. recommended fixings for mounting: m6 socket head cap screws. nominal weight: 1580g module outline type code: mp04 mounting recommendations adequate heatsinking is required to maintain the base temperature at 75 ? c if full rated current is to be achieved. power dissipation may be calculated by use of v t(to) and r t information in accordance with standard formulae. we can provide assistance with calculations or choice of heatsink if required. the heatsink surface must be smooth and flat; a surface finish of n6 (32 in) and a flatness within 0.05mm (0.002") are recommended. immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, scotch brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. care should be taken to ensure no foreign particles remain. an even coating of thermal compound (eg. unial) should be applied to both the heatsink and module mounting surfaces. this should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. after application of thermal compound, place the module squarely over the mounting holes, (or t slots) in the heatsink. fit and finger tighten the recommended fixing bolts at each end. using a torque wrench, continue to tighten the fixing bolts by rotating each bolt in turn no more than 1/4 of a revolution at a time, until the required torque of 6nm (55lbs.ins) is reached on all bolts at both ends. it is not acceptable to fully tighten one fixing bolt before starting to tighten the others. such action may damage the module.
www.dynexsemi.com power assembly capability the power assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. we offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today . the assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. using the latest cad methods our team of design and applications engineers aim to provide the power assembly complete solution (pacs). heatsinks the power assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of dynex semiconductors. data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. for further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer services. customer service tel: +44 (0)1522 502753 / 502901. fax: +44 (0)1522 500020 sales offices benelux, italy & switzerland: tel: +33 (0)1 64 66 42 17. fax: +33 (0)1 64 66 42 19. france: tel: +33 (0)2 47 55 75 52. fax: +33 (0)2 47 55 75 59. germany, northern europe, spain & rest of world: tel: +44 (0)1522 502753 / 502901. fax: +44 (0)1522 500020 north america: tel: (440) 259-2060. fax: (440) 259-2059. tel: (949) 733-3005. fax: (949) 733-2986. these offices are supported by representatives and distributors in many countries world-wide. ?dynex semiconductor 2003 technical documentation ?not for resale. produced in united kingdom headquarters operations dynex semiconductor ltd doddington road, lincoln. lincolnshire. ln6 3lf. united kingdom. tel: +44-(0)1522-500500 fax: +44-(0)1522-500550 this publication is issued to provide information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. no warranty or guarantee express or implied is made regard ing the capability, performance or suitability of any product or service. the company reserves the right to alter without prior notice the specification, design or price of any product or service. information con cerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. it is the user's responsibility to fully deter mine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. these products are not suitable for use in any me dical products whose failure to perform may result in significant injury or death to the user. all products and materials are sold and services provided subject to the company's conditions of sale, w hich are available on request. all brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respec tive owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
|
