infrared led chip gaalas/gaa s 1. material substrate gaas (n type) epitaxial layer gaala s (p/n type) 2. electrode n(cathode) side gold alloy p(anode) side gold alloy 3. electro-optical parameter s ymbo l min typ max unit condition characteristics forward voltage v f 1.4 1.5 v if=100ma reverse voltage v r 8 v ir=10ua power p o 25 30 mw if=100ma p 940 nm if=20ma ? 45 nm if=20ma note : power is measured by sorter e/t system with bare chip. 4. mechanical data (a) emission area -------------------------- - 16.5mil x 16.5mil (b) bottom area -------------------------- - 17.5mil x 17.5mil (c) bonding pad -------------------------- - 110um (d) chip thickness -------------------------- - 11mil (e) junction height -------------------------- - 7.6mil e pi e pi p n p s ide electrode n s ide electrode eoyang factory,513-5 eoyang-dong, iksan, 570-210, korea tel. +82 63 839 1111 fax. +82 63 835 8259 www.auk.co.kr OPA9445F wavelength auk corp. (a) (b) (e) (d) substrate (c)
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