in the thermal resistance vs pressure vs defection charts H48-2K provides low thermal impedance. as the pressure increases the thermal impedance decreases. H48-2K provides good compliance and softness. 1. part number 2. size x-y-z 3. adhesive backing C 0-none, 1a-one side, 2a-two sides 4. quantity H48-2K thermal conductive pad on rolls thermal conductivity: 1.8 w/m.k (w / m.k - z axis) hardeness: 60 (shore a) (shore a) no carrier low contact thermal impedance non-oil blead high dielectric breakdown voltage electronic components: ic / cpu / mos led / m/b / p/s / heat sink / lcd-tv / notebook pc / pc / telecom device / wireless hub etc.... ddr ii module / dvd applications / hand-set applications etc... features applications properties reach compliant rohs compliant property H48-2K unit test method thickness 0.1/ 0.15 / 0.2 / 0.3 mm - color dark red - visual construction silicone based with ceramic fllers (non-silicone oil) - - opt.temp. range -45 to 200 ?c - density 2.1 g/cm 3 astm d792 thermal conductivity 1.8 w/m.k astm d5470 hardness shore a 60 - astm d2240 thermal impedance astm d5470 10psi 0.21/0.37/0.57 k- in 2 /w - 50psi 0.20/0.33/0.51 k- in 2 /w - 100psi 0.17/0.31/0.46 k- in 2 /w - percent defection astm d575 10psi 2 % - 50psi 5 % - 100psi 11 % - breakdown voltage 1.2 / 2.5 / 3.5 kv astm d149 tml ? 0.5% % astm e595 tensile strength 200 psi astm d412 elongation 50 % astm d412 ul fammability v-0 - ul 94 roll length / width 50 - 320 metres / mm - available with an adhesive backing tel: +44 20 8133 2062 email: sales@ tglobaltechnology.com web: www.tglobaltechnology.com skype: tglobal.technology
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