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| www.irf.com 1 auirlr3915 hexfet ? power mosfet pd - 97743 s d g gds gate drain source d-pak auirlr3915 automotive grade features ! "! # $ % $# ! #! &"' $ ( )% "! #" *# +, description !" # $ % & ' ' # !" ( ) ' & absolute maximum ratings stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. the thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. ambient temperature (t a ) is 25c, unless otherwise specified. hexfet ? is a registered trademark of international rectifier. * qualification standards can be found at http://www.irf.com/ parameter units i d @ t c = 25c continuous drain current, v gs @ 10v (silicon limited) i d @ t c = 100c continuous drain current, vgs @ 10v (silicon limited) a i d @ t c = 25c continuous drain current, v gs @ 10v (package limited) i dm pulsed drain current p d @t c = 25c power dissipation w linear derating factor w/c v gs gate-to-source voltage v e as single pulse avalanche energy (thermally limited) mj e as (tested ) single pulse avalanche energy tested value i ar avalanche current a e ar repetitive avalanche energy mj t j operating junction and t stg storage temperature range c soldering temperature, for 10 seconds (1.6mm from case ) thermal resistance parameter typ. max. units r ? jc junction-to-case ??? 1.3 r ? ja junction-to-ambient (pcb mount) ??? 50 c/w r ? ja junction-to-ambient ??? 110 600 200 see fig. 12a, 12b, 15, 16 120 0.77 16 max. 61 43 240 30 -55 to + 175 300 v (br)dss 55v r ds(on) typ. 12m ? max 14m ? 2 www.irf.com s d g s d g repetitive rating; pulse width limited by max. junction temperature. (see fig. 11). limited by t jmax , starting t j = 25c, l = 0.45mh, r g = 25 ? , i as = 30a, v gs =10v. part not recommended for use above this value. i sd ? 30a, di/dt ? 280a/ s, v dd ?? v (br)dss , t j ? 175c. pulse width ? 1.0ms; duty cycle ? 2%. c oss eff. is a fixed capacitance that gives the same charging time as c oss while v ds is rising from 0 to 80% v dss . limited by t jmax , see fig.12a, 12b, 15, 16 for typical repetitive avalanche performance. this value determined from sample failure population, starting t j = 25c, l = 0.45mh, r g = 25 ? , i as = 30a, v gs =10v. when mounted on 1" square pcb ( fr-4 or g-10 material ). for recommended footprint and soldering techniques refer to application note #an-994. r ? ? is measured at t j of approximately 90c. static electrical characteristics @ t j = 25c (unless otherwise specified) parameter min. typ. max. units v (br)dss drain-to-source breakdown voltage 55 ??? ??? v ? ? a ??? ??? 250 i gss gate-to-source forward leakage ??? ??? 200 na gate-to-source reverse leakage ??? ??? -200 dynamic electrical characteristics @ t j = 25c (unless otherwise specified) parameter min. typ. max. units q g total gate charge ??? 61 92 q gs gate-to-source charge ??? 9.0 14 nc q gd gate-to-drain ("miller") charge ??? 17 25 t d(on) turn-on delay time ??? 7.4 ??? t r rise time ??? 51 ??? t d(off) turn-off delay time ??? 83 ??? ns t f fall time ??? 100 ??? l d internal drain inductance ??? 4.5 ??? between lead, nh 6mm (0.25in.) l s internal source inductance ??? 7.5 ??? from package and center of die contact c iss input capacitance ??? 1870 ??? c oss output capacitance ??? 390 ??? pf c rss reverse transfer capacitance ??? 74 ??? c oss output capacitance ??? 2380 ??? c oss output capacitance ??? 290 ??? c oss eff. effective output capacitance ??? 540 ??? diode characteristics parameter min. typ. max. units i s continuous source current ??? ??? 61 (body diode) a i sm pulsed source current ??? ??? 240 (body diode) v sd diode forward voltage ??? ??? 1.3 v t rr reverse recovery time ??? 62 93 ns q rr reverse recovery charge ??? 110 170 nc t on forward turn-on time intrinsic turn-on time is negligible (turn-on is dominated by ls+ld) t j = 25c, i f = 30a, v dd = 25v di/dt = 100a/ s t j = 25c, i s = 30a, v gs = 0v showing the integral reverse p-n junction diode. conditions v gs = 0v, i d = 250 a reference to 25c, i d = 1ma v gs = 10v, i d = 30a mosfet symbol v dd = 28v i d = 30a r g = 8.5 ? conditions v gs = 10v v gs = 0v ? = 1.0mhz, see fig. 5 v gs = 0v, v ds = 0v to 44v v gs = 0v, v ds = 44v, ? = 1.0mhz v gs = 0v, v ds = 1.0v, ? = 1.0mhz v ds = 25v, i d = 30a i d = 30a v ds = 44v v gs = 16v v gs = -16v v gs = 10v v ds = 55v, v gs = 0v v ds = 55v, v gs = 0v, t j = 125c m ? v ds = 25v v gs = 5.0v, i d = 26a conditions v ds = v gs , i d = 250 a www.irf.com 3 - *# + . +# / + 0 . 1 !223 +3"2 -- 4 '! 5+ 6 4 * 7 8# " 8# + ! 3 --- ) ! 3 qualification information ? d-pak msl1 qualification level automotive (per aec-q101) ?? comments: this part number(s) passed automotive qualification. ir?s industrial and consumer qualification level is granted by extension of the higher automotive level. charged device model class c5 (+/- 2000v) ??? aec-q101-005 moisture sensitivity level rohs compliant yes esd machine model class m2 (+/- 200v) ??? aec-q101-002 human body model class h1b (+/- 1000v) ??? aec-q101-001 4 www.irf.com fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) 0.001 0.01 0.1 1 10 100 1000 10000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) 2.0v 20 s pulse width tj = 25c vgs top 15v 10v 5.0v 3.0v 2.7v 2.5v 2.25v bottom 2.0v 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) 2.0v 20 s pulse width tj = 175c vgs top 15v 10v 5.0v 3.0v 2.7v 2.5v 2.25v bottom 2.0v 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 v gs , gate-to-source voltage (v) 0.10 1.00 10.00 100.00 1000.00 i d , d r a i n - t o - s o u r c e c u r r e n t ? ? ) t j = 25c t j = 175c v ds = 25v 20 s pulse width fig 4. typical forward transconductance vs. drain current 0 102030405060 i d ,drain-to-source current (a) 0 10 20 30 40 50 60 70 g f s , f o r w a r d t r a n s c o n d u c t a n c e ( s ) t j = 25c t j = 175c www.irf.com 5 fig 8. maximum safe operating area fig 6. typical gate charge vs. gate-to-source voltage fig 5. typical capacitance vs. drain-to-source voltage fig 7. typical source-drain diode forward voltage 1 10 100 v ds , drain-to-source voltage (v) 10 100 1000 10000 100000 c , c a p a c i t a n c e ( p f ) v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd c oss c rss c iss 0 10 20 30 40 50 60 70 0 2 4 6 8 10 12 q , total gate charge (nc) v , gate-to-source voltage (v) g gs i = d 30a v = 11v ds v = 27v ds v = 44v ds 0.1 1 10 100 1000 0.0 0.5 1.0 1.5 2.0 v ,source-to-drain voltage (v) i , reverse drain current (a) sd sd v = 0 v gs t = 175 c j t = 25 c j 1 10 100 1000 v ds , drain-to-source voltage (v) 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) tc = 25c tj = 175c single pulse 1msec 10msec operation in this area limited by r ds (on) 100 sec nce 6 www.irf.com fig 11. maximum effective transient thermal impedance, junction-to-case fig 9. maximum drain current vs. case temperature 25 50 75 100 125 150 175 0 10 20 30 40 50 60 70 t , case temperature ( c) i , drain current (a) c d limited by package 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thjc c p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thjc 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response) fig 10. normalized on-resistance vs. temperature -60 -40 -20 0 20 40 60 80 100 120 140 160 180 0.0 0.5 1.0 1.5 2.0 2.5 t , junction temperature ( c) r , drain-to-source on resistance (normalized) j ds(on) v = i = gs d 10v 61a www.irf.com 7 q g q gs q gd v g charge d.u.t. v ds i d i g 3ma v gs .3 ? f 50k ? .2 ? f 12v current regulator same type as d.u.t. current sampling resistors + - 7 9 fig 13b. gate charge test circuit fig 13a. basic gate charge waveform fig 12c. maximum avalanche energy vs. drain current fig 12b. unclamped inductive waveforms fig 12a. unclamped inductive test circuit t p v (br)dss i as fig 14. threshold voltage vs. temperature r g i as 0.01 ? t p d.u.t l v ds + - v dd driver a 15v 20v v gs 25 50 75 100 125 150 175 0 100 200 300 400 500 starting tj, junction temperature ( c) e , single pulse avalanche energy (mj) as i d top bottom 12a 21a 30a -75 -50 -25 0 25 50 75 100 125 150 175 200 t j , temperature ( c ) 0.5 1.0 1.5 2.0 v g s ( t h ) g a t e t h r e s h o l d v o l t a g e ( v ) i d = 250 a 8 www.irf.com fig 15. typical avalanche current vs.pulsewidth fig 16. maximum avalanche energy vs. temperature notes on repetitive avalanche curves , figures 15, 16: (for further info, see an-1005 at www.irf.com) 1. avalanche failures assumption: purely a thermal phenomenon and failure occurs at a temperature far in excess of t jmax . this is validated for every part type. 2. safe operation in avalanche is allowed as long ast jmax is not exceeded. 3. equation below based on circuit and waveforms shown in figures 12a, 12b. 4. p d (ave) = average power dissipation per single avalanche pulse. 5. bv = rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. i av = allowable avalanche current. 7. ? t = allowable rise in junction temperature, not to exceed t jmax (assumed as 25c in figure 15, 16). t av = average time in avalanche. d = duty cycle in avalanche = t av f z thjc (d, t av ) = transient thermal resistance, see figure 11) p d (ave) = 1/2 ( 1.3bvi av ) = t/ z thjc i av = 2 t/ [1.3bvz th ] e as (ar) = p d (ave) t av 1.0e-08 1.0e-07 1.0e-06 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 tav (sec) 0.1 1 10 100 1000 a v a l a n c h e c u r r e n t ( a ) 0.05 duty cycle = single pulse 0.10 allowed avalanche current vs avalanche pulsewidth, tav assuming ? tj = 25c due to avalanche losses 0.01 25 50 75 100 125 150 175 starting t j , junction temperature (c) 0 20 40 60 80 100 120 140 160 180 200 220 e a r , a v a l a n c h e e n e r g y ( m j ) top single pulse bottom 10% duty cycle i d = 30a www.irf.com 9 fig 17. : 2 # for n-channel hexfet power mosfets ????? ???? ???? p.w. period di/dt diode recovery dv/dt ripple ? 5% body diode forward drop re-applied voltage reverse recovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period , , + - + + + - - - ??? ??? ! "#"" ??? $ % % ??? "#""& # v ds 90% 10% v gs t d(on) t r t d(off) t f '( ???? ) $ ??????? + - fig 18a. switching time test circuit fig 18b. switching time waveforms 10 www.irf.com * + , -. /0 ' .11 &&1(1 d-pak part marking information ;< ; ==< = : =: < #"( $ >#". / www.irf.com 11 ! "# $ * + , tr 16.3 ( .641 ) 15.7 ( .619 ) 8.1 ( .318 ) 7.9 ( .312 ) 12.1 ( .476 ) 11.9 ( .469 ) feed direction feed direction 16.3 ( .641 ) 15.7 ( .619 ) trr trl notes : 1. controlling dimension : millimeter. 2. all dimensions are shown in millimeters ( inches ). 3. outline conforms to eia-481 & eia-541. notes : 1. outline conforms to eia-481. 16 mm 13 inch -. /0 ' .11 &&1(1 12 www.irf.com ordering information base part number package type standard pack complete part number form quantity auirlr3915 dpak tube 75 auirlr3915 tape and reel 2000 AUIRLR3915TR tape and reel left 3000 AUIRLR3915TRl tape and reel right 3000 AUIRLR3915TRr www.irf.com 13 2 ( / 0 3 ' +/0, ( & ' 425 ) 1 $ & '6 /07 ( & /0 ' /07 & $ $ ) /0 & ) ' $ & /0 ' & 3 ' /0 & # ( $ & 0 /0 /0 '( ' ' & 0 % ' & /0 ' ' & / ' '6 & 0 /0 ' ' /0 ) /0 ' & /0 ' ' & /0 # ' /0 6 & 8 /0 # 8 / 0 ' '% ) ' 6 # /0 & " ' * 9 +*9, 2 * * *9 $ ' & 8 ( /0 ' *9 % $ 8 7 ( ' $ & /0 /0 ' /0 /"1 :;<=< $ ' ' 425& 8 ( % /0 ' ' $ & $ #!! ( ! /0 !1223 +3"2 +2 ! " # $ % # &! %! ' ( )* + ,- |
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