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page 1 ? high rf performance: - up to 123.5 db rf link budget - rx sensitivity: -97 dbm and -103.5 dbm - rf tx power:+6 dbm and +20 dbm ? scalable data rate: 250 kbps, 500 kbps and 1mbps ? miniature footprint: 1 x 1.350 (25.4 mm x 34.3 mm) ? voice codec support: -law/a-law/adpcm ? 4 level power management scheme w/ deep sleep mode (0.3 a) ? integrated pcb trace antenna ? 16 rf channels ? up to 12,000 feet of range ? aes 128-bit encryption ? fcc, ce and ic certifcations ? rohs compliant features meshconnect? module series description c el's meshconnect? module series provides high performance and low cost 2.4 ghz ieee 802.15.4 / zigbee modules for a broad range of wireless networks. the meshconnect certifed and quali - fed modules, enable customer to accelerate time to market by greatly reducing design and certifcation phases of development. cel's meshconnect? radio modules leverage the advanced features of the meshconnect? integrated circuit (ic). the ic is a true single-chip solution, compliant with zigbee specifcations and ieee 802.15.4, a complete wireless solution for all zigbee applications. the ic consists of an rf transceiver with baseband modem, a hardwired mac and an embedded 8051 microcon - troller with internal flash memory. the device provides numerous general-purpose i/o pins, peripheral functions such as timers and uarts and is one of the frst devices to provide an embedded voice codec. this device is also ideal for low power applications. the original meshconnect module delivers excellent performance at a surprisingly low cost. the modules +6dbm output power means better range, more reliable transmission and fewer nodes in your network. it also makes these modules ideal for applica - tions where cost and power constraints do not allow for external power amplifers or peripheral range extension components. the meshconnect extended range module adds a power ampli - fer (pa) and low noise amplifer (lna) to increase range to over two miles - plus more reliable transmission and fewer nodes in your network. it is especially useful for open outdoor applica - tions where the nodes are physically far apart, or for indoor use where the nodes have to operate in a noisy rf environment. the extended range modules outstanding +123 dbm budget link ensures high quality connections even in such harsh environments. integrated transceiver modules for zigbe e / ieee 802.15. 4 development kits available: zicm2410p0-kit2-1, zicm2410p2-kit1-1 the information in this document is subject to change without notice, please confrm data is current document no: 0007-00-07-00-000 (issue c) date published: april 7, 2010 data sheet ordering information part number order number description meshconnect ? module zicm2410p0-1 +6 dbm output power, pcb trace a ntenna zicm2410p0-1 -sn +6 dbm output power, pcb trace a ntenna, snap software ZICM2410P0-1C +6 dbm output power, with u .fl connector for external antenna ZICM2410P0-1C -sn +6 dbm output power, with u .fl connector for external antenna, snap software zicm2410p0-kit2-1 +6 dbm engineering development kit meshconnect ? extended range module zicm2410p2-1 +20 dbm output power, pcb trace a ntenna zicm2410p2-1 -sn +20 dbm output power, pcb trace a ntenna, snap software zicm2410p2-1c +20 dbm output power, with u.fl connector for external antenna zicm2410p2-1c -sn +20 dbm output power, with u .fl connector for external antenna, snap software zicm2410p2-kit1 -1 evaluation board for +20 dbm module home & building automation ? security ? hvac control ? lighting control ? thermostats industrial controls ? food processing controls ? traffc management ? sensor networks ? asset management ? barcode reader ? patient monitoring ? glucose monitor applications ? 96 kb flash memory ? 8 kb sram ? 8051 mcu core ? up to 22 gpio pins ? spi (master/slave) + uarts ? i 2 s/pcm interface with two 128-byte fifos ? -law/a-law/adpcm voice codec ? 4-channel 8-bit adc m e sh c o n n ect ? module series module and extended range module
meshconnect ? module series page 2 module block diagram meshconnect? ic module 16 mhz xtal radio micro processor ant castellation edge connecto r pwr reg meshc onnec t? ic lna ex tended r ange module pa development kit cel's meshconnect development kit assist users in both evaluation and development. as a stand-alone radio system, the kit allows users to place the modules in to the target environment and evaluate performance on-site. the meshconnect development kit also serves as an invalu - able aid in application development. through the many interface headers on the board, the user has access to all the meshconnect module pins enabling easy connection to target systems for application development. the key components of the meshconnect development kits are the cels meshconnect radio module and the interface board. the meshconnect module contains the cel transceiver ic, crystals, power regulator and an integrated pcb antenna with a connector for an external antenna (optional). the interface board features a serial com - munication interface, a power management module, and peripherals such as potentiometers, leds, and gpio headers. for more detail information regarding meshconnect development kits, refer to the respective development kit user guides documents. (available at cels website http://www.cel.com ) order number description zicm2410p0-kit2-1 +6 dbm engineering development kit zicm2410p2-kit1 - 1 evaluation board for +20 dbm module kit contents: ? evaluation boards w/module (3) ? network analyzer (1) ? antennas (1) ? usb cables (2) ? jumpers (10) ? aa batteries (4) ? universal ac/dc power supply (2) ? software & technical information cd (2) meshconnect ? module development kit kit contents: ? evaluation boards w/module (1) ? usb cables (1) ? jumpers (2) ? software & technical information cd (2) meshconnect ? extended range module development kit 16 mhz pwr reg xtal radio micro processor ant castellation edge connector
meshconnect ? module series page 3 introduction and overview description .............................................................................................................................................................................................. 1 features .................................................................................................................................................................................................. 1 applications ............................................................................................................................................................................................ 1 ordering information ............................................................................................................................................................................. 1 module block diagram ........................................................................................................................................................................... 2 development kit ..................................................................................................................................................................................... 2 system level function transceiver ic ......................................................................................................................................................................................... 4 modes of operation (tx, rx, sleep) ...................................................................................................................................................... 5 power amplifer ....................................................................................................................................................................................... 6 interface .................................................................................................................................................................................................. 6 software tools ........................................................................................................................................................................................ 6 electrical specifcation absolute maximum ratings ................................................................................................................................................................... 8 recommended (operating condition) .................................................................................................................................................. 8 dc characteristics .................................................................................................................................................................................. 8 rf characteristics .................................................................................................................................................................................. 8 pin signal & interfaces pin signals i/o confguration ................................................................................................................................................................ 9 i/o pin assignment ................................................................................................................................................................................. 9 module dimensions ................................................................................................................................................................................ 11 processing 13 agency certifcations 14 shipment, storage & handling 15 references & revision history 16 table of contents
meshconnect ? module series page 4 transceiver ic a true monolithic solution, the meshconnect ic incorporates the rf transceiver with baseband modem, a hardwired mac, and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all ieee 802.15.4 / zigbee applications. with an industry best +8 dbm output power, the meshconnect ic will support a wide a variety of applications without the need for external amplifcation. combined with a highly sensitive -98 dbm receiver the meshconnect ic leads the industry with 106 db link budget. in addition to excellent rf performance at zigbee (250 kbps) data rates, the ic adds high speed modes, turbo (500 kbps) and premium (1 mbps), for networks looking for increased throughput. the device provides numerous general-purpose i/o pins, peripheral functions such as timers and uarts and is one of the frst devices to provide an embedded voice codec. cel provides its customers with the cel zigbee stack as part of the software library. also available are the hardware & software tools required to develop custom applications. the combination of industry leading link budget, high speed rf, and integrate voice codec make the ic a truly distinct single chip solution. the extended range module adds both an pa and lna to maximize rf performance. the nec upg2250 pa enable the extended range module to output up to +20 dbm transmit power. in the receive path the addition of the upc8233 lna boosts the already sensitive receiver up to -103.5 dbm. the extended range link budget boasts a very robust 123.5 dbm enabling a line of sight range over 2 miles. ps/2 uart/2 spi wdt gpio/2 4 ti mer/4 pwm/2 quad key scan digital regulator rc oscillator clock pll por rf tx rf rx pll t emp. sensor bat monitor adc (4ch) analog regulator 3v ciruitry mcu (8051) flash 96kb modem mac dma adpcm v oice fiffo aes engine a-law ?-law da ta 8kb rom
meshconnect ? module series page 5 cel's meshconnect modules include an integrated printed circuit board (pcb) trace antenna. an optional u.fl connector can be specifed, providing connection to a 50-ohm external antenna of the users choice. see ordering information on page 1. the pcb antenna employs an f-antenna topology that is compact and supports an omni-directional radiation pattern. to maximize antenna effciency, an adequate ground plane must be provided on the host pcb. correctly positioned, the ground plane on the host pcb will contribute signifcantly to the antenna performance (it should not be directly under the f-antenna). the position of the module on the host board and overall design of the product enclosure contribute to antenna perfor mance. poor design affects radiation patterns and can result in refection, diffraction, and/or scattering of the transmitted signal. here are some design guidelines to help ensure antenna performance: ? never place the ground plane or route copper traces directly underneath the antenna portion of the module. ? never place the antenna close to metallic objects. ? in the overall design, ensure that wiring and other components are not placed near the antenna. ? do not place the antenna in a metallic or metalized plastic enclosure. ? keep plastic enclosures 1cm or more from the antenna in any direction. for optimum antenna performance, the meshconnect modules should be mounted with the pcb trace antenna overhanging the edge of the host board. to further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. the installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. cel can provide assistance with your pcb layout. there are three power down modes in the ic. each mode can be set using the pdmode [1:0] bits in the pdcon register and power down modes can be started by setting the pdstart bit to 1. each mode has a different current consumption and wake-up sources, please refer to the ic datasheet for further information on the available power down modes. table 8 describes the three power down modes. table 8 C power down modes pdmode [1:0] description wake-up source regulator for digital block 0 active (normal operation) - - 1 pm1 mode hardware reset, sleep timer interrupt, external interrupt on 2 pm2 mode hardware reset, sleep timer interrupt, external interrupt off (after wake-up, register confguration is required) 3 pm3 mode hardware reset, external interrupt off (after wake-up, register confguration is required) antenna modes of operation
meshconnect ? module series page 6 power amplifier voice codec software tools the orginal meshconnect module does not incorporate an external power amplifer and therefore the rf output port is connected directly (through matching components) to the rf antenna. as cels ic ieee 802.15.4 / zigbee transceiver already offers the industrys best link budget at 106 db, even without an external pa the meshconnect can maintain wireless connection over long distance (3,000 ft line-of-sight). the extended range module adds both an pa and lna to optimize rf performance. the nec upg2250 pa enable the extended range module to output up to +20 dbm transmit power. in the receive path the addition of the upc8233 lna boosts the already sensitive receiver up to -103.5 dbm. the extended range link budget boasts a very robust 123.5 dbm enabling a line of sight range over 2 miles. interface the meshconnect has all major communication interfaces routed from the ic to the module edge connectors: ? uart1 & uart 2 ? i 2 s ? spi the meshconnect ic includes three voice codec algorithms: -law, a-law and adpcm. the -law algorithm is a companding algorithm primarily used in the digital telecommunication systems of north america and japan. as with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. in the analog domain this can increase the signal-to-noise ratio (snr) achieved during transmission and in the digital domain, it can reduce the quantization error (hence increasing signal to quantization noise ratio). these snr improvements can be traded for reduced bandwidth and equivalent snr instead. the a-law algorithm is a standard companding algorithm used in european digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing. the a-law algorithm provides a slightly larger dynamic range than the -law at the cost of worse proportional distortion for small signals. adaptive dpcm (adpcm) is a variant of dpcm [differential (or delta) pulse-code modulation] that varies the size of the quantization step, allowing further reduction of the required bandwidth for a given signal-to-noise ratio. dpcm encodes the pcm values as differences between the current and the previous value. for audio applications this type of encoding reduces the number of bits required per sample by about 25% compared to pcm. cel offers complete sw tools for meshconnect that customers need to create their zigbee application. profile builder ? profle builder allows for easy creation of custom zigbee profles for use in end-user applications. ? uses the input requirements to modify a set of c source fles which include the necessary zigbee functions. ? output fles will contain the zigbee device object (zdo) descriptors and the zigbee device profle (zdp) descriptors. ? the zdo and zdp defne the zigbee node and functionality. the output fles can be seamlessly integrated with the cel zigbee stack libraries.
meshconnect ? module series page 7 software tools (continued) device programmer ? device programmer is used to program the application frmware to the on-chip flash program memory of the ic device. ? device programmer supports: ? isp mode : download the frmware from the host pc via serial communication through the ics uart1 interface. ? the evaluation boards utilize a usb -> serial converter. ? ota mode : download the frmware from the host pc using wireless communication (over-the-air). ? this requires two nodes, the host (connected to a pc) and the target device to be programmed. device programmer can read / write hardware information (i.e. ieee address, channel #, etc) directly via the aforementioned communication modes. profile simulator ? profle simulator is used to simulate and test a zigbee network consisting of a coordinator , router and / or end devices. ? profle simulator includes: ? device manager : setting parameters of a zigbee node. ? bind manager : managing bindings in a zigbee network. ? zstack manager : setting parameters of a zigbee network. ? zigbee device wizard : selects network confguration during zigbee network formation. can be used to generate zigbee standard primitive functions for mac, nwk and aps layers and the zdo and app. packet analyzer and wireless network analyzer ? packet analyzer monitors traffc over a wireless network channel by capturing rf packet data in real-time. ? packet analyzer requires the wireless network analyzer to sniff the rf packets. ? packet analyzer also includes diagnostic tools: ? energy scan : evaluates the received signal power within the bandwidth of an ieee 802.15.4 channel yielding available channels. ? active scan : scanning for active coordinators and routers broadcasting a beacon frame. ? packet analyzer is capable of displaying network confguration (i.e. tree vs. star), network nodes, packet details, etc. ? can be used in conjunction with any ieee 802.15.4 or zigbee network. keil 8051 development tools (evaluation version provided in development kit). ? supports all 8051 derivatives and variants. ? easy-to-use vision integrated development environment (ide) supports the complete development cycle. ? supports memory banking for code and variables beyond the 64 kbyte threshold. numerous optimization levels yield the ability to place more features into less memory providing the utmost code density .
meshconnect ? module series page 8 absolute maximum ratings description meshconnect ? module meshconnect ? extended range module unit min max min max power supply voltage (vcc) -0.3 3.3 -0.3 3.3 vdc voltage on any digital pin -0.3 3.3 -0.3 3.3 vdc input rf level 10 -6 dbm storage temperature -55 125 -55 125 c refow soldering temperature 250 250 c note: exceeding the maximum ratings may cause permanent damage to the module or devices. recommended (operating conditions) description meshconnect ? module meshconnect ? extended range module unit min typ max operating ambient temperature range, t a -40 25 85 c operating supply voltage 2.1 3.0 vdc input frequency 2.405 2.48 ghz dc characteristics ( 25c, v cc 3.0v unless otherwise noted) description meshconnect ? module meshconnect ? extended range module unit min typ max min typ max vcc supply (vcc) 2.1 3.3 2.1 3.3 vdc r x mode current (vcc = 3.0v) 35 38 38 42 ma tx mode current (vcc = 3.0v, pout max) 44 48 175 ma tx mode current (vcc = 2.1v, pout max) 44 48 120 ma tx mode current (vcc = 3.0v, 0 dbm) 31 75 ma sleep mode (deep) current 1 4 a rf characteristics ( 25c, v cc 3.0v unless otherwise noted) description meshconnect ? module meshconnect ? extended range module unit min typ max min typ max frequency band (16 C 5mhz wide channels) 2.405 2.480 2.405 2.480 ghz r x sensitivity for 1% per -97 -85 -103.5 -85 dbm saturation (maximum input level) 5 -11 dbm tx output power (v cc = 3.0v) 4.5 6.0 20 dbm tx output power (v cc = 2.1v) 4.5 6.0 15.5 dbm error vector magnitude 17 35 15 35 % adjacent channel rejection +/- 5 mhz +/- 10 mhz 35 35 47 51 35 35 47 51 db frequency error tolerance -96.2 96.2 -96.2 96.2 khz output power control range 55 55 db over the air data rate 250 1000 250 1000 kbps harmonics (2 nd & 3 rd ) -41.2 -41.2 dbm/mhz
meshconnect ? module series page 9 pin signals i/o port configuration meshconnect i/o pin assignments meshconnect module has 56 edge i/o interfaces for connection to the users host board. the meshconnect module dimensions shows the layout of the 56 edge castellations. pin # meshconnect ? module meshconnect ? extended range module type description functionality ic pin # 1 gnd gnd gnd-rf ground ground n/a 2 gnd gnd gnd-rf ground ground n/a 3 ms1 nc static control line mode select, bit #1. active low internal voltage regulator enable: 0: internal voltage regulator enabled 1: internal voltage regulator disabled, supply analog and digital supply voltages externally no connect 14 4 gnd gnd gnd-rf ground ground n/a 5 gnd nc gnd gnd ground 13 6 nc nc nc no connect no connect n/a 7 gnd gnd gnd-logic ground ground 49 8 gnd gnd gnd-logic ground ground 49 9 gnd gnd gnd-logic ground ground 49 10 gnd gnd gnd-logic ground ground 49 11 gnd gnd gnd-logic ground ground 49 12 ach0 ach0 analog input 1.5v level analog adc0 input adc input 8 13 ach1 ach1 analog input 1.5v level analog adc1 input adc input 9 14 ach2 ach2 analog input 1.5v level analog adc2 input adc input 10 15 ach3 ach3 analog input 1.5v level analog adc3 input adc input 11 16 p1_7 (1) nc digital i/o port p1.7 digital i/o 20 17 p1_6 (1) nc digital i/o port p1.6 digital i/o 21 18 p1_4 p1_4 digital i/o port p1.4 / quadzb / sleep timer osc buffer input digital i/o or dedicated function port 22 19 p1_3 p1_3 digital i/o port p1.3 / quadza / sleep timer osc buffer output / rtclkout digital i/o or dedicated function port 23 20 gnd gnd gnd-logic ground ground 49 21 gnd gnd gnd-logic ground ground 49 22 gnd gnd gnd-logic ground ground 49 23 p1_1 p1_1 digital i/o port p1.1 / txd1 digital i/o or dedicated function port 24 24 vcc_3v vcc_3v power 3.0v power supply for analog internal voltage regulator power input 7 25 p1_0 p1_0 digital i/o port p1.0 / rxd1 digital i/o or dedicated function port 26 26 p3_7 p3_7 digital i/o port p3.7 / 12ma drive capability / pwm3 / cts1 / spicsn digital i/o with high current capability 27 27 p3_6 p3_6 digital i/o port p3.6 / 12ma drive capability /pwm2 / rts1 / spiclk digital i/o with high current capability 28 note: 1 . pin used on extended range module to control on board power amplifer . 2 . digital 1.5v regulator output. sources little current. if it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade rf performance.
meshconnect ? module series page 10 meshconnect i/o pin assignments (continued) 28 p3_5 p3_5 digital i/o port p3.5 / t1 / cts0 / quadyb / spido digital i/o or dedicated function port 29 29 p3_4 p3_4 digital i/o port p3.4 / t0 / rts0 / quadya / spidi digital i/o or dedicated function port 30 30 gnd gnd gnd-logic ground ground 49 31 p3_3 p3_3 digital i/o port p3.3 / int1 (active low) digital i/o or dedicated function port 31 32 p3_2 p3_2 digital i/o port p3.2 / int0 (active low) digital i/o or dedicated function port 32 33 gnd gnd gnd-logic ground ground 49 34 p3_1 p3_1 digital i/o port p3.1 / txd0 / quadxb digital i/o or dedicated function port 33 35 p3_0 p3_0 digital i/o port p3.0 / rxd0 / quadxa digital i/o or dedicated function port 35 36 gnd gnd gnd-logic ground ground 49 37 p0_7 p0_7 digital i/o gpio 8051 port p0.7 / i2stx_mclk digital i/o 36 38 p0_6 p0_6 digital i/o gpio 8051 port p0.6 / i2stx_bclk digital i/o 37 39 p0_5 p0_5 digital i/o gpio 8051 port p0.5 / i2stx_lrclk digital i/o 38 40 p0_4 p0_4 digital i/o gpio 8051 port p0.4 / i2stx_do digital i/o 39 41 p0_3 p0_3 digital i/o gpio 8051 port p0.3 / i2srx_mclk digital i/o 40 42 p0_2 p0_2 digital i/o gpio 8051 port p0.2 / i2srx_bclk digital i/o 41 43 p0_1 p0_1 digital i/o gpio 8051 port p0.1 / i2srx_lrck digital i/o 42 44 p0_0 p0_0 digital i/o gpio 8051 port p0.0 / i2srx_di digital i/o 43 45 dvdd_1_5 (2) nc power output of digital internal voltage regulator (1.5v) / 1.5v power supply for digital core(input mode @ no reg) selected as internal regulator output or regulated voltage supply input 19 46 isp isp digital input mode select, bit #2. active high in-system programming (isp) input: 0: normal mode 1: isp mode programming 15 47 reset reset control reset (active low) hardware reset 17 48 avdd_1_5 (2) nc power output of analog internal voltage regulator (1.5v) / 1.5v power supply for mixer, vga, and lpf (input mode @ no reg) selected as internal regulator output or regulated voltage supply input 6 49 gnd gnd gnd-logic ground ground 49 50 gnd gnd gnd-logic ground ground 49 51 gnd gnd gnd-logic ground ground 49 52 gnd gnd gnd-logic ground ground 49 53 gnd gnd gnd-logic ground ground 49 54 nc nc nc no connect no connect n/a 55 gnd gnd gnd-rf ground ground n/a 56 gnd gnd gnd-rf ground ground n/a pin # meshconnect ? module meshconnect ? extended range module note: 1 . pin used on extended range module to control on board power amplifer . 2 . digital 1.5v regulator output. sources little current. if it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade rf performance.
meshconnect ? module series page 11 pin # meshconnect ? module meshconnect ? extended range module type description functionality ic pin # module dimensions 1.000 0.195 0.895 1.413 0.062 0.120 rf shield r6 r7 u1 r1 c7 c7b l4 l3 c11 r10 c21 c20 l5 r11 c23 c22 r8 c5b c24 c13 c6a c1 c2 r5 l6 c6b c6 l2 c14 c10 c9 r2 r9 c15 c16 r4 c17 c4a xt al1 zicm2410p0 0007000000001 j2 pin 1 pin 19 pin 38 pin 56 0r c25 zic2410 qn48 1.000 0.195 0.895 1.413 0.062 rf shield r6 r7 u1 r1 c7 c7b l4 l3 c11 r10 c21 c20 l5 r11 c23 c22 r8 c5b c24 c13 c6a c1 c2 r5 l6 c6b c6 l2 c14 c10 c9 r2 r9 c15 c16 r4 c17 c4a xt al1 zicm2410p0 0007000000001 j2 pin 1 pin 19 pin 38 pin 56 0r c25 zic2410 qn48 for layout recommendation for optimum antenna performance , refer to antenna section in this document. meshconnect ? module / meshconnect ? extended range module w/p cb trace antenna meshconnect ? module / meshconnect ? extended range module w / u.fl connector for external antenna
meshconnect ? module series page 12 module land footprint note: unless otherwise specifed. dimensions are in inches [mm]. 1.100 [27.94] 1.000 [25.41] 0.890 [22.61] 0.7489 [19.02] 0.105 [2.67] ? 0.147 keepout 0.050 [1.27 ] c opper keepout 0.361 [9.17] 0.940 [23.88] 1.055 [26.80] 0.9277 [23.56] 0.050 [1.27] pitc h 56 x 0.040 [1.02 ] 56 x 0.100 [2.54]
meshconnect ? module series page 13 processing recommended refow profle parameters values ramp up rate (from tsoakmax to tpeak) 3o/sec max minimum soak temperature 150oc maximum soak temperature 200oc soak time 60-120 sec tliquidus 217oc time above tl 60-150 sec tpeak 260 + 0oc time within 5o of tpeak 20-30 sec time from 25o to tpeak 8 min max ramp down rate 6oc/sec max achieve the brightest possible solder fllets with a good shape and low contact angle. pb-free soldering paste use of no clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. note: the quality of solder joints on the castellations (half vias) where they contact the host board should meet the appropriate ipc speci - fcation. see ipc-a-610-d " acceptability of electronic assemblies, section 8.2.4 castellated terminations. cleaning in general, cleaning the populated modules is strongly discouraged. residuals under the module cannot be easily removed with any cleaning process. ? cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. the combination of soldering fux residuals and encapsulated water could lead to short circuits between neighboring pads. water could also damage any stickers or labels. ? cleaning with alcohol or a similar organic solvent will likely food soldering fux residuals into the two housings, which is not accessible for post-washing inspection. the solvent could also damage any stickers or labels. ? ultrasonic cleaning could damage the module permanently. the best approach is to consider using a no clean soldering paste and eliminate the post-soldering cleaning step. optical inspection after soldering the module to the host board, consider optical inspection to check the following: ? proper alignment and centering of the module over the pads. ? proper solder joints on all pads. ? excessive solder or contacts to neighboring pads, or vias. repeating refow soldering only a single refow soldering process is encouraged for host boards. wave soldering if a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged.
meshconnect ? module series page 14 processing (continued) agency certifications hand soldering hand soldering is possible. use a soldering iron temperature setting equivalent to 350c, follow ipc recommendations/ reference document ipc-7711. rework the meshconnect module can be unsoldered from the host board. use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. avoid overheating. warning never attempt a rework on the module itself, e.g. replacing individual components. such actions will terminate warranty coverage. additional grounding attempts to improve module or system grounding by soldering braids, wires, or cables onto the module rf shield cover is done at the customer's own risk. the numerous ground pins at the module perimeter should be suffcient for optimum im munity to external rf interference. fcc compliance statement (part 15.19) section 7.15 of rss-gen this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: 1. this device may not cause harmful interference. 2. this device must accept any interference received, including interference that may cause undesired operation. warning (part 15.21) changes or modifcations not expressly approved by cel could void the user's authority to operate the equipment. 20 cm separation distance to comply with fcc/ic rf exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. oem responsibility to the fcc rules and regulations the meshconnect module has been certifed per fcc part 15 rules for integration into products without further testing or certifcation. to fulfll the fcc certifcation requirements, the oem of the meshconnect module must ensure that the information provided on the meshconnect label is placed on the outside of the fnal product. the meshconnect module is labeled with its own fcc id number. if the fcc id is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording such as the following: contains transmitter module fcc id: w7z-icp0 or contains fcc id: w7z-icp0 the oem of the meshconnect module must only use the approved antenna, (pcb trace antenna) that has been certifed with this module. the oem of the meshconnect module must test their fnal product confguration to comply with uninten - tional radiator limits before declaring fcc compliance per part 15 of the fcc rules.
meshconnect ? module series page 15 agency certifications (continued) shipment, handling, and storage shipment the meshconnect modules are delivered in trays of 28. handling the meshconnect modules are designed and packaged to be processed in an automated assembly line. warning the meshconnect modules contain highly sensitive electronic circuitry . handling without proper esd protection may destroy or damage the module permanently. warning according to jedec isp, the meshconnect modules are moisture-sensitive devices. appropriate handling instruc - tions and precautions are summarized in section 2.1. read carefully to prevent permanent damage due to moisture intake. moisture sensitivity level (msl) msl 3, per j-std-033 storage storage/shelf life in sealed bags is 12 months at <40c and <90% relative humidity . ic certifcation industry canada statement the term "ic" before the certifcation / registration number only signifes that the industry canada technical specifcations were met. section 14 of rss-210 the installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit rf feld in excess of health canada limits for the general population. consult safety code 6, obtainable from health canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php ce certifcation europe the meshconnect rf module has been tested and certifed for use in the european union. oem responsibility to the european union compliance rules if the meshconnect module is to be incorporated into a product, the oem must verify compliance of the fnal product to the european harmonized emc and low-voltage / safety standards. a declaration of conformity must be issued for each of these standards and kept on fle as described in annex ii of the r&tte directive. the manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining european union compliance. if any of the specifcations are exceeded in the fnal product, the oem is required to make a submission to the notifed body for compliance testing. oem labeling requirements the `ce' mark must be placed on the oem product in a visible location. the ce mark shall consist of the initials ce with the following form: if the ce marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. the ce mark must be a minimum of 5mm in height the ce marking must be affxed visibly, legibly, and indelibly. since the 2400 - 2483.5 mhz band is not harmonized by a few countries throughout europe, the restriction sign must be placed to the right of the ce marking as shown in the picture
meshconnect ? module series page 16 references & revision history previous versions changes to current version page(s) 0007-00-07-00-000 (issue a) february 05, 2009 initial preliminary datasheet. n/a 0007-00-07-00-000 (issue b) june 11, 2009 updated development kit and agency certifcation 2, 14, 15 0007-00-07-00-000 (issue c ) october 6 , 2009 added new meshconnect extended range module all 0007-00-07-00-000 (issue c) january 29 , 20 10 removed "prelimary" from datasheet and "pending" from agency certifcation all 0007-00-07-00-000 (issue c) april 7 , 2010 added snap enabled modules to ordering information , updated module land footprint 1 disclaimer ? the information in this document is current as of the published date. the information is subject to change without notice. for actual design-in, refer to the latest publications of cel data sheets or data books, etc., for the most up-to-date specifcations of cel products. not all products and/or types are available in every country. please check with an cel sales representative for availability and additional information. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of cel. cel assumes no responsibility for any errors that may appear in this document. ? cel does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of cel products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of cel or others. ? descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customers equipment shall be done under the full responsibility of the customer. cel assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. ? while cel endeavors to enhance the quality, reliability and safety of cel products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely . to minimize risks of damage to property or injury (including death) to persons arising from defects in cel products, customers must incorporate suffcient safety measures in their design, such as redundancy, fre-containment and anti-failure features.

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ZICM2410P0-1C	California Eastern Laboratories (CEL)			146

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