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pe42723 document category: product specification ultracmos? spdt rf switch, 5C1794 mhz ?2015C2016, peregrine semiconductor corporation. all rights reserv ed. ? headquarters: 9380 carroll park drive, san diego, ca, 9 2121 product specification doc-64524-5 C (01/2016) www.psemi.com features ? supports docsis 3.0/1 requirements ? exceptional harmonics ? 2fo of ?121 dbc @ 17 mhz ? 3fo of ?140 dbc @ 17 mhz ? best in class linearity across frequency band ? low insertion loss and high isolation performance ? insertion loss of 0.3 db @ 1218 mhz ? isolation of 54 db @ 204 mhz ? high esd performance of 3 kv hbm ? packaging ? 12-lead 3 3 0.75 mm qfn applications ? broadband market (docsis 3.0/1) ? cable modem ? set-top box ? residential gateway ? filter bank switching ? relay replacement between docsis 3.0 and docsis 3.1 configurations product description the pe42723 is a harp? technology-enhanced reflective spdt rf switch designed for use in cable applica- tions including docsis 3.0/1 cable modem, set-top box and residential gateway. it delivers high linearity and excellent harmonics performance in the 5?1794 mhz band. it also features low insertion loss and high isolation performance making the pe42723 ideal for docsis 3.1 applications. the pe42723 is manufactured on peregrine?s ultracmos ? process, a patented variation of silicon-on-insulator (soi) technology on a sapphire substrate, offering the perf ormance of gaas with the economy and integration of conventional cmos. figure 1 ? pe42723 functional diagram rfc cmos control driver rf2 rf1 v1
pe42723 spdt rf switch page 2 doc-64524-5 C (01/2016) www.psemi.com absolute maximum ratings exceeding absolute maximum ratings listed in table 1 may cause permanent damage. operation should be restricted to the limits in table 2 . operation between operating range maximum and absolute maximum for extended periods may reduce reliability. esd precautions when handling this ultracmos device, observe the same precautions as with any other esd-sensitive devices. although this device contains circuitry to protect it fr om damage due to esd, precautions should be taken to avoid exceeding the rating specified in table 1 . latch-up immunity unlike conventional cmos devices, ultracmos devices are immune to latch-up. table 1 ? absolute maximum ratings for pe42723 parameter/condition min max unit supply voltage, v dd ?0.3 5.5 v digital input voltage, v1 ?0.3 3.6 v rf input power, 75 ? 86 dbmv storage temperature range ?65 +150 c esd voltage hbm (1) , all pins 3000 v esd voltage cdm (2) , all pins 500 v notes: 1) human body model (mil-std 883 method 3015). 2) charged device model (jedec jesd22-c101).
pe42723 spdt rf switch doc-64524-5 C (01/2016) page 3 www.psemi.com recommended operating conditions table 2 lists the recommended operating conditions for the pe42723. devices should not be operated outside the operating conditions listed below. table 2 ? recommended operating conditions for pe42723 parameter min typ max unit supply voltage, v dd 2.3 3.3 5.5 v supply current, i dd 130 200 a digital input high, v1 1.17 3.6 (1) v digital input low, v1 ?0.3 0.6 v rf input power, cw (2) 80 dbmv rf input power, peak (3) 85 dbmv operating temperature range ?40 +25 +85 c notes: 1) maximum digital input voltage is limited to v dd and cannot exceed 3.6v. 2) 100% duty cycle, 75 ? . 3) ofdma docsis 3.1, single channel, 75 ? .
pe42723 spdt rf switch page 4 doc-64524-5 C (01/2016) www.psemi.com electrical specifications table 3 provides the pe42723 key electrical specifications @ +25 c, v dd = 3.3v, z s = z l = 75 ? , unless otherwise specified. table 3 ? pe42723 electrical specifications parameter path condition min typ max unit operating frequency 5 1794 mhz insertion loss (1) rfc?rfx 5?204 mhz 204?1218 mhz 1218?1794 mhz 0.10 0.30 0.40 0.20 0.45 db db db isolation all paths 5?204 mhz 204?612 mhz 612?1218 mhz 1218?1794 mhz 50 40 36 54 44 38 34 db db db db return loss (1) rfc?rfx 5?204 mhz 204?612 mhz 612?1218 mhz 1218?1794 mhz 25 18 30 22 14 13 db db db db 2nd harmonic, 2fo rfx fo = 17 mhz average p cw = 65 dbmv fo = 170 mhz average p cw = 65 dbmv fo = 900 mhz average p cw = 65 dbmv ?121 ?121 ?121 dbc dbc dbc 3rd harmonic, 3fo rfx fo = 17 mhz average p cw = 65 dbmv fo = 170 mhz average p cw = 65 dbmv fo = 900 mhz average p cw = 65 dbmv ?140 ?132 ?135 dbc dbc dbc input 0.1db compression point (2) rfc?rfx 5?1218 mhz 87 dbmv switching time 50% ctrl to 90% or 10% rf 35 s notes: 1) high frequency performance can be improved by external matching (see figure 12 ? figure 15 ). 2) the input 0.1db compression point is a linearity figure of merit. refer to table 2 for the operating rf input power (75 ? ).
pe42723 spdt rf switch doc-64524-5 C (01/2016) page 5 www.psemi.com switching frequency the pe42723 has a maximum 10 khz switching frequency. switching frequency describes the time duration between switching events. switching time is the time duration between the point the control signal reached 50% of the final value and the point the output signal reaches within 10% or 90% of its target value. spurious performance the pe42723 spur fundamental occurs around 10 mhz. its typical performance is ?154 dbm/hz (v1 = h) and ?165 dbm/hz (v1 = l), with 100 khz bandwidth. thermal data psi-jt ( ? jt ), junction top-of-package, is a thermal metric to estimate junction temperature of a device on the customer application pcb (jedec jesd51-2). ? jt = (t j ? t t )/p where ? jt = junction-to-top of package characterization parameter, c/w t j = die junction temperature, c t t = package temperature (top surface, in the center), c p = power dissipated by device, watts control logic table 5 provides the control logic truth table for the pe42723. table 4 ? thermal data for pe42723 parameter typ unit maximum junction temperature, t jmax (rf input power, cw = 80 dbmv, +85c ambient) 90 c ? jt 21 c/w table 5 ? truth table for pe42723 state v1 rfc?rf1 h rfc?rf2 l
pe42723 spdt rf switch page 6 doc-64524-5 C (01/2016) www.psemi.com typical performance data figure 2 ? figure 11 show the typical performance data @ +25 c, v dd = 3.3v, z s = z l = 75 ? , unless otherwise specified. figure 2 ? insertion loss vs temperature (rfcCrfx) (*) note: * high frequency performance can be impr oved by external matching (see figure 12 ? figure 15 ). 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?4 ?3.5 ?3 ?2.5 ?2 ?1.5 ?1 ?0.5 0 insertion loss (db) frequency (ghz) ?40 oc +25 oc +85 oc figure 3 ? insertion loss vs v dd (rfcCrfx) (*) note: * high frequency performance can be impr oved by external matching (see figure 12 ? figure 15 ). 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?4 ?3.5 ?3 ?2.5 ?2 ?1.5 ?1 ?0.5 0 insertion loss (db) frequency (ghz) 2.3v 3.3v 5.5v
pe42723 spdt rf switch doc-64524-5 C (01/2016) page 7 www.psemi.com figure 4 ? rfc port return loss vs temperature (*) note: * high frequency performance can be impr oved by external matching (see figure 12 ? figure 15 ). figure 5 ? rfc port return loss vs v dd (*) note: * high frequency performance can be impr oved by external matching (see figure 12 ? figure 15 ). 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?50 ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 0 return loss (db) frequency (ghz) ?40 oc +25 oc +85 oc 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?50 ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 0 return loss (db) frequency (ghz) 2.3v 3.3v 5.5v
pe42723 spdt rf switch page 8 doc-64524-5 C (01/2016) www.psemi.com figure 6 ? active port return loss vs temperature (*) note: * high frequency performance can be improved by external matching (see figure 12 ? figure 15 ). 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?50 ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 0 return loss (db) frequency (ghz) ?40 oc +25 oc +85 oc figure 7 ? active port return loss vs v dd (*) note: * high frequency performance can be improved by external matching (see figure 12 ? figure 15 ). 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?50 ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 0 return loss (db) frequency (ghz) 2.3v 3.3v 5.5v
pe42723 spdt rf switch doc-64524-5 C (01/2016) page 9 www.psemi.com figure 8 ? isolation vs temperature (rfxCrfx) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 frequency (ghz) isolation (db) ?40 oc +25 oc +85 oc figure 9 ? isolation vs v dd (rfxCrfx) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 frequency (ghz) isolation (db) 2.3v 3.3v 5.5v
pe42723 spdt rf switch page 10 doc-64524-5 C (01/2016) www.psemi.com figure 10 ? isolation vs temperature (rfcCrfx) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 frequency (ghz) isolation (db) ?40 oc +25 oc +85 oc figure 11 ? isolation vs v dd (rfcCrfx) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 frequency (ghz) isolation (db) 2.3v 3.3v 5.5v
pe42723 spdt rf switch doc-64524-5 C (01/2016) page 11 www.psemi.com high frequency performance with external matching high frequency insertion loss and return loss can be improved by inductive matching on the rf ports in the customer application board layout. figure 12 is a matching network using a 2.2 nh inductor on each rf port. the inductor needs to be placed as close to the device under test (dut) as possible. figure 13 ? figure 15 show the insertion loss and return loss improvement using a 2.2 nh inductor on rfc port and a 2.2 nh on rf1, rf2 and rfc ports, respectively. figure 12 ? pe42723 matching network spdt pe42723 rf1 rfc l = 2.2 nh l = 2.2 nh l = 2.2 nh rf2 dut figure 13 ? insertion loss (rfcCrfx) with or without matching (*) note: * for reference only. -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 insertion loss (db) frequency (ghz) no matching rfc matched only all rf ports matched
pe42723 spdt rf switch page 12 doc-64524-5 C (01/2016) www.psemi.com figure 14 ? rfc port return loss with or without matching (*) note: * for reference only. -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 return loss (db) frequency (ghz) no matching rfc matched only all rf ports matched figure 15 ? active port return loss with or without matching (*) note: * for reference only. -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 return loss (db) frequency (ghz) no matching rfc matched only all rf ports matched
pe42723 spdt rf switch doc-64524-5 C (01/2016) page 13 www.psemi.com evaluation kit the pe42723 evaluation board was designed to ease customer evaluation of the pe42723 rf switch. the rf common port is connected through a 75 ? transmission line via the f-type connector, j3. rf1 and rf2 ports are connected through 75 ? transmission lines via f-type connectors j1 and j2, respectively. a 75 ? through trans- mission line is available via f-type connectors j4 (thru left) and j5 (thru right), which can be used to de- embed the loss of the pcb. j6 provides dc and digital inputs to the device. figure 16 ? evaluation kit layout for pe42723
pe42723 spdt rf switch page 14 doc-64524-5 C (01/2016) www.psemi.com pin information this section provides pinout information for the pe42723. figure 17 shows the pin map of this device for the available package. table 6 provides a description for each pin. figure 17 ? pin configuration (top view) exposed ground pad gnd rf1 gnd nc v dd v1 gnd rfc gnd 1 3 2 gnd rf2 gnd 9 4 5 6 12 11 10 7 8 pin 1 dot marking table 6 ? pin descriptions for pe42723 pin no. pin name description 1, 3, 7, 9, 10, 12 gnd ground 2 rf1 (*) rf port 1 4 nc do not connect 5 v dd supply voltage (nominal 3.3v) 6 v1 digital control logic input 1 8 rf2 (*) rf port 2 11 rfc (*) rf common pad gnd exposed pad: ground for proper oper- ation note: * rf pins 2, 8 and 11 must be at 0 vdc. the rf pins do not require dc blocking capacitors for pr oper operation if the 0 vdc require- ment is met.
pe42723 spdt rf switch doc-64524-5 C (01/2016) page 15 www.psemi.com packaging information this section provides packaging data including the moisture sensitivity level, package drawing, package marking and tape-and-reel information. moisture sensitivity level the moisture sensitivity level rating for the pe42723 in the 12-lead 3 3 0.75 mm qfn package is msl1. package drawing figure 18 ? package mechanical drawing for 12-lead 3 3 0.75 mm qfn 0.10 c 0.10 c (2x) (2x) a b top view bottom view recommended land pattern pin #1 corner 9 10 6 7 12 1 4 3 3.00 3.00 1.600.05 1.600.05 0.50 0.400.05 (x12) 0.230.05 (x12) (x8) 9 10 6 7 12 1 4 3 1.65 1.65 0.25 (x12) 0.85 (x12) 0.50 (x8) 2.90 ref. 2.90 ref. 0.750.05 0.05 max 0.10 c a b 0.05 c c 0.10 c 0.05 c seating plane all features 0.20 side view third angle projection unless otherwise specified dimensions are in millimeters decimal x.x 0.1 x.xx 0.05 x.xxx 0.030 interpret dimensions and tolerance per asme y14.5 ? 1994 angular 1
pe42723 spdt rf switch page 16 doc-64524-5 C (01/2016) www.psemi.com top-marking specification tape and reel specification figure 19 ? package marking specifications for pe42723 figure 20 ? tape and reel specifications for 12-lead 3 3 0.75 mm qfn = yy = ww = zzzzzz = pin 1 indicator last two digits of assembly year assembly work week assembly lot code (maximum six characters) 42723 yyww zzzzzz t k0 a0 b0 p0 p1 d1 a section a-a a direction of feed d0 e w0 p2 see note 3 see note 1 f see note 3 a0 b0 k0 d0 d1 e f p0 p1 p2 t w0 3.30 3.30 1.10 1.50 + 0.1/ -0.0 1.5 min 1.75 0.10 5.50 0.05 4.00 8.00 2.00 0.05 0.30 0.05 12.00 0.3 device orientation in tape pin 1 notes: 1. 10 sprocket hole pitch cumulative tolerance 0.2 2. camber in compliance with eia 481 3. pocket position relative to sprocket hole measured as true position of pocket, not pocket hole
pe42723 spdt rf switch product specification www.psemi.com doc-64524-5 C (01/2016) document categories advance information the product is in a formative or design stage. the datasheet contains design target specifications for product development. specifications and features may change in any manner without notice. preliminary specification the datasheet contains preliminary data. additional data may be added at a later date. peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. product specification the datasheet contains final data. in the event peregrine decides to change the specifications, peregri ne will notify customers of the intended changes by issuing a cnf (customer notification form). product brief this document contains a shortened version of the datasheet. for the full datasheet, contact sales@psemi.com. not recommended for new designs (nrnd) this product is in production but is not recommended for new designs. end of life (eol) this product is currently going th rough the eol process. it has a specific last-time buy date. obsolete this product is discontinued. orde rs are no longer accepted for this product. sales contact for additional information, contact sales at sales@psemi.com. disclaimers the information in this document is believed to be reliable. ho wever, peregrine assumes no liability for the use of this inform ation. use shall be entirely at the user?s own risk. no patent rights or licenses to any circuits described in this document are implied or granted to any third party. peregrine?s products are not designed or intended for use in devi ces or systems intended for surgical implant, or in other appl ications intended to support or sustain life, or in any applicati on in which the failure of the peregrine product could create a situation in which personal injury or death might occur. peregrine assumes no liability for damages, incl uding consequential or incidental damages, aris ing out of the use of its products in such applications. patent statement peregrine products are protected under one or more of the following u.s. patents: patents.psemi.com copyright and trademark ?2015?2016, peregrine semiconductor corporation. all rights reserv ed. the peregrine name, logo, utsi and ultracmos are register ed trade- marks and harp, multiswitch and dune are tr ademarks of peregrine semiconductor corp. ordering information table 7 lists the available ordering codes for the pe42723 as well as available shipping methods. table 7 ? order codes for pe42723 order codes description packaging shipping method pe42723a-z pe42723 spdt rf switch 12-lead 3 3 0.75 mm qfn 3000 units/t&r EK42723-01 pe42723 evaluation kit evaluation kit 1/box

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