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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys. 1/ 25 tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22 111 ? 14 ? 001 standard lcd segment driver BU9797FUV-M max 144 segments (seg36com4) features ? integrated ram for display data (ddram): 36 x 4 bit (max 144 segment) ? lcd drive output: 4 common output, max 36 segment output ? integrated buffer amp for lcd driving ? integrated oscillator circuit ? no external components ? low power consumption design applications ? telephone ? fax ? portable equipment (pos, ecr, pda etc.) ? dsc ? dvc ? car audio ? home electrical appliance ? meter equipment etc. key specifications supply voltage rang e: +2.5v to +5.5v operating temperature range: -40c to +85c max segments: 144segments display duty: 1/4 bias: 1/2, 1/3 selectable interface: 2wire serial interface package w (typ) x d (typ) x h (max) typical application circ uit using internal oscillator fi gure 1. typical application circuit bu9797fuv tssop-c48v 8.1mm x 12.5mm x 1.0mm controller vdd vlcd sda scl oscin test 1 vss com 0 com 1 com 2 com 3 seg 0 seg 1 segment lcd vdd seg 35 ? ? ? ? ? ? ? ? ? ? ? ? ? ? datashee t downloaded from: http:///
2/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 seg31 seg30 seg32 seg29 seg33 seg28 seg34 seg27 seg35 seg26 com0 seg25 com1 seg24 com2 seg23 com3 seg22 vlcd seg21 vdd seg20 vss seg19 test1 seg18 oscin seg17 scl seg16 sda seg15 nc seg14 seg0 seg13 seg1 seg12 seg2 seg11 seg3 seg10 seg4 seg9 seg5 seg8 seg6 seg7 block diagram / pin configuration / pin description bu9797fuv figure 2. block diagram figure 3. pin configuration (top view) table 1. pin description pin name pin no. i/o function test1 13 i test input (rohm use only) must be connect to vss nc 17 open terminal oscin 14 i external clock input external clock and internal clock can be selected by comm and must be connect to vss when use internal oscillat or sda 16 i/o serial data in-out terminal scl 15 i serial clock for data transfer terminal vss 12 ground vdd 11 power supply vlcd 10 power supply for lcd driving seg0 to 35 18 - 48, 1-5 o segment output for lcd driving com0 to 3 6-9 o common output for lcd driving lcd bias selector common driver segment driver oscillator power on reset sda scl vlcd oscin vss com 0 com 3 seg 0 seg 35 if filter serial interface command register common counter ddram lcd voltage generator command data decoder blink timing generator vdd downloaded from: http:///
3/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25c , vss=0v) parameter symbol ratings unit remarks power supply voltage1 vdd -0.5 to +7.0 v power supply power supply voltage2 vlcd -0.5 to vdd v lcd drive voltage power dissipation pd 0.64 w when use more than ta=25c, subtract 6.4mw per degree. (package only) input voltage range vin -0.5 to vdd+0.5 v operational temperature range topr -40 to +85 c storage temperature range tstg -55 to +125 c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in ca se the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to +85c , vss=0v) parameter symbol ratings unit remarks min typ max power supply voltage1 vdd 2.5 - 5.5 v power supply power supply voltage2 vlcd 0 - vdd-2.4 v lcd drive voltage , vdd-vlcd ? 2.4v electrical characteristics dc characteristics (vdd=2.5v to 5.5v, vlcd=0v, vss=0v, ta=-40c to 85c, unless othe rwise specified) parameter symbol limits unit conditions min typ max h level input voltage v ih 0.7vdd - vdd v sda,scl l level input voltage v il vss - 0.3vdd v sda,scl h level input current i ih - - 1 a sda,scl l level input current i il -1 - - a sda,scl s da l level output voltage v ol_sda 0 - 0.4 a iload = 3ma lcd driver on resistance seg r on - 3 - k iload=10a com r on - 3 - k standby current i dd1 - - 5 a display off, oscillation off operating power consumption i dd2 - 7.5 20 a vdd=3.3v, vlcd=0v, ta=25 c power save mode1, fr=71hz 1/3 bias, frame inverse oscillation characteristics (vdd=2.5v to 5.5v, vlcd=0v, vss=0v, ta=- 40 c to 85 c, unless otherwise specified) parameter symbol limits unit conditions min typ max frame frequency1 f clk1 56 80 104 hz fr = 80hz setting, vdd=2.5v to 5.5v , ta=-40c to 85c frame frequency2 f clk2 70 80 90 hz fr = 80hz setting, vdd=3.5v, ta=25c frame frequency3 f clk3 77.5 87.5 97.5 hz fr = 80hz setting, vdd=5.0v, ta=25c frame frequency4 f clk4 67.5 87.5 102 hz fr = 80hz setting, vdd=5.0v, ta=-40c to 85c external frequency f exclk 15 - 300 khz external clock use case (note1) (note1) disctl 80hz setting: frame frequency [hz] = external clock [hz] 512 disctl 71hz setting: frame frequency [hz] = external clock [hz] 576 disctl 64hz setting: frame frequency [hz] = external clock [hz] 648 disctl 53hz setting: frame frequency [hz] = external clock [hz] 768 downloaded from: http:///
4/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 electrical characteristics - continued mpu interface characteristics (vdd=2.5v to 5.5v, vlcd=0v, vss=0v, ta=- 40 c to 85 c, unless otherwise specified) parameter symbol limits unit conditions min typ max input rise time tr - - 0.3 s input fall time tf - - 0.3 s scl cycle time tscyc 2.5 - - s h scl pulse idth tshw 0.6 - - s l scl pulse idth tslw 1.3 - - s sda setup time tsds 100 - - s sda hold time tsdh 100 - - us buss free time tbuf 1.3 - - s start condition hold time thd;sta 0.6 - - s start condition setup time tsu;sta 0.6 - - s stop condition setup time tsu;sto 0.6 - - s fi gure 4. interface timing i/o equivalence circuit figure 5. i/o equivalence circuit tbuf sda scl tsdh sda thd; sta ts lw tr ts hw tf tsds tsu; sta tsu; sto tscyc vdd vlcd vss vdd te st1 vss vdd seg/com vss sda vss vdd vss scl vss vdd oscin vss downloaded from: http:///
5/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 example of recommended circuit internal oscillator circuit mode external clock input mode figure 6. example of recommended circuit controller vdd vlcd sda scl oscin test 1 vss com 0 com 1 com 2 com 3 seg 0 seg 1 segment lcd vdd seg 35 ? ? ? ? ? ? ? ? ? ? ? ? ? ? controller vdd vlcd sda scl oscin test 1 vss com 0 com 1 com 2 com 3 seg 0 seg 1 segment lcd vdd seg 35 ? ? ? ? ? ? ? ? ? ? ? ? ? ? downloaded from: http:///
6/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 functional descriptions command /data transfer method this device is controlled by 2wire signal (sda, scl). figure 7. 2 wire command/data transfer format it has to generate the condition such as start condition and stop condition in 2wire serial interface transfer method. figure 8 . interface protcol method of how to transfer command and data is shown as follows. (1) generate start condition. (2) issue slave address. (3) transfer command and display data. acknowledge (ack) data format is 8bits and return acknowledge after transfer 8bits dat a. when scl 8 th =?l? after transfer 8bit data (slave address, command, di splay data), output ?l? and open sda line. when scl 9 th =?l?, sto p output function. (as output format is nmos-open- drain, can?t output ?h? level.) if no need acknowledge function, please input ?l? lev el from scl 8 th =?l? to scl 9 th =?l?. figure 9. acknowledge timing start condition s to p condition sda scl slave address s 0 1 1 1 1 1 0 m a c 0 command display data a a p acknowledge start condition command or data judgment bit stop condition r/w sda scl 1-7 8 9 1-7 8 9 1-7 8 9 slave address ack data ack data ack s p start condition stop condition downloaded from: http:///
7/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 command transfer method issue sla ve address (01111100 for rite mode or 01111101 for read mode) after generate start condition. 1byte after slave address always becomes command input. the least significant bit (lsb of the slave address det ermines if the operation to be done is rit e or read operation. msb (command or data judge bit) of command decide to next data is command or display data. hen set command or data judge bit=?1?, next byte wil l be command. hen set command or data judge bit=?0?, next byte dat a is display data. slave address a 1 s command a 1 command a 1 command a 0 command a p display data once it becomes display data transfer condition, it cannot inp ut command. hen want to input command again, please generate st art condition once. if start condition or stop condition are inputted in th e middle of command transmission, command will be canceled. if slave address is continuously inputted following st art condition, it will be in command input condition. please input slave address in the first data transmissio n after start condition. when slave address cannot be recognized in the first data transmission, acknowledge does not return and next transmission will be invalid. hen data transmission is in invalid status, if start conditions are transmi tted again, it wi ll return to valid status. please consider the mpu interface characteristic such as inp ut rise time and setup/hold time when transferring command and data (refer to mpu interface). write display and transfer method set r/ bit to 0 to come into rite mode. this device has display data ram (ddram) of 364=144bit. the relationship between data input and display data, ddram data a nd address are as follows; 8 bit data will be stored in ddram. the address to be writte n is the address specified by adset command, and the address is automatically incremented in every 4bit data. data can be continuously written in ddram by transmitting data continuous ly. (when ram data is written successively after writing ram data to 23h (seg35), the address is returned to 00h (seg0) by the auto-increment function. ddram address 00 01 02 03 04 05 06 07 ??? 21h 22h 23h bit 0 a e i m com0 1 b f j n com1 2 c g k o com2 3 d h l p com3 seg0 seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg33 seg34 seg35 dat a transference to ddram will be executed in every 4bit data. so it will be finished to transfer with no need to wait ack. 0111110 a 1 s 1101 000 a a b c d display data slave address command 0 r/w=0 (write mode) a 0 0000000 command e f g h a i j k l m n o p a p downloaded from: http:///
8/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 read display data and transfer method if t he lsb of the slave address is 1 , it will be set read mode. the display data and command register value can be read duri ng read mode. the read mode sequence is shown below. during read mode, the display data can be read from the ddram thro ugh the sda line. the data will output with scl input synchronous. first it has to set address by write mode adset command to read display data. if ddram address does not specify before ddram read, the read add ress will be start from the current ddram address. address will be increment +2 addresses by 8bit data output automati cally. master side should be output ack output by each 8bit data output. it will be able to keep read mode and address increment by ack from master side. if there is no ack response, sda output status will be released, please transmit stop condition. read mode will be stopped by stop condition transfer. address will be set 00h automatically after 23h. (it does not increm ent to 24h or 25h address) an example of the display data read sequence is shown below. scl s da slave address (read) a d7 d6 d5 d4 d3 d2 d1 d0 a d7 d6 d5 d4 d3 d2 d1 d0 na s p 0111110 a 1 s 0000000 slave address command 0 r/w(write mode) a s 0111110 1 slave address r/w(read mode) a data a data na ... p a 1 1101000 command set icset [p2]=0 adset command downloaded from: http:///
9/ 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 read command register and transfer method also the command registers can be read during read mode. the sequence for the command register read is shown below and is similar to the display data read sequence. 0111110 a s adset slave address command 0 r/w a s 0111110 1 slave address r/w a data na p a 1 110 1100 command set icset [p2] =1 regarding address setting, please refer to adset command. it will be able to read register values if it set address 24h or 25h . address does not increment automatically after register value read. register d7 d6 d5 d4 d3 d2 d1 d0 address reg1 0 0 p5 p4 p3 p2 p1 p0 24h reg2 p7 p6 p5 p4 p3 p2 p1 p0 25h reg1: p5 = bias setting p4 = internal/external clock setting p3 = software reset setting p2 to p0 = blink setting reg2: p7 to p6 = frame frequency (fr) setting p5 to p4 = power save mode (sr) setting p3 = frame/line inversion setting p2 = display on/off setting p1 = apon setting p0 = apoff setting address map between adset and icset is shown as follows; write mode ram address adset icset d7 d6 d5 d[4:0] d7 d6 d5 d4 d3 d2 * d1 d0 00 0000 to 01 1111 (bin) 0 0 0 0 0000 to 1 1111 1 1 1 0 1 0 0 0 10 0000 to 10 0011 (bin) 0 0 0 0 0000 to 0 0011 1 1 1 0 1 1 0 0 read mode ram address adset icset d7 d6 d5 d[4:0] d7 d6 d5 d4 d3 d2 * d1 d0 00 0000 to 01 1111 (bin) 1 0 0 0 0000 to 1 1111 1 1 1 0 1 0 0 0 10 0000 to 10 0101 (bin) 1 0 0 0 0000 to 0 0101 1 1 1 0 1 1 0 0 (note) please take care icset [p2] setting. downloaded from: http:///
10 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 oscillator the clock signals for logic and analog circuit can be gene rated from internal oscillator or external clock. if internal oscillator circuit is used, oscin must be connected to vss lev el. when using external clock mode, input external clock from oscin termi nal after icset command setting. figure 10 . internal oscillator circuit mode figure 11. ext clock input mode lcd driver bias circuit this device generates lcd driving voltage with on -chip buffer amp. and it can drive lcd at low power consumption. 1/3 and 1/2bias can set in modeset command. line and frame inversion can set in disctl command. refer to the lcd driving waveform about each lcd driving waveform. blink timing generator this device has blink function. this device will be blink mode with blkctl command. blink frequency varies widely by characteristic of fclk, when intern al oscillation circuit. about the characteristics of f clk , refer to oscillation characteristics. reset initialize condition initial condition after execute software reset is as follows. ? display is off. ? ddram address is initialized (ddram data is not initialized). refer to command description about initialize value of register. command / function list description list of command / function no. command function 1 set ic operation (icset) software reset , internal/external clock setting 2 display control (disctl) frame frequency, power save mode setting 3 address set (adset) dram address setting (0 0h to 23h) register address setting (24 to 25h) 4 mode set (modeset) display on/off,1/2bias,1/3bias 5 blink control (blkctl) blink off/0.5s/1s/2s/3s/5s blink setting 6 all pixel control (apctl) all pixels on/off during dison oscin bu9797 vss oscin bu9797 vss clock downloaded from: http:///
11 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 detailed command description d7 (msb) is bit for command or data judgment. refer to command and data transfer method. c: 0: next byte is ram write data. 1: next byte is command. set ic operation (icset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 0 1 p2 p1 p0 p2: msb data of ddr am address. please refer to adset command. set software reset condition. setup p1 no operation 0 software reset 1 hen software reset is executed, this device is r eset to initial condition. (refer to reset initialize condition ) don?t set software re set (p1) with p2, p0 at the same time. switch between internal clock and external clock. setup p0 initial condition internal clock 0 external clock input 1 in internal clock mode: oscin must be connect to vss level. in external clock input mode:: input external clock from oscin terminal.. osc mode switch timing command icset oscin_en internal signal internal clock mode external clock mode internal oscillation internal signal external clock oscin downloaded from: http:///
12 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 display control (disctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 0 1 p4 p3 p2 p1 p0 set power save mode fr. setup p4 p3 reset initialize condition normal mode(80hz) 0 0 power save mode1(71hz) 0 1 power save mode2(64hz) 1 0 power save mode3(53hz) 1 1 (note) operation current decrease in order as normal mode > power save mode1 > power save mode2 > power save mode 3. set lcd drive waveform. setup p2 reset initialize condition line inversion mode 0 frame inversion mode 1 (note) operation current is line inversion > frame inversion regarding driving waveform, refer to lcd driving waveform. set power save mode sr. setup p1 p0 reset initialize condition power save mode 1 0 0 power save mode 2 0 1 normal mode 1 0 high power mode 1 1 (note1) operation current increase in order as power save mode 1 < power save mode 2 < normal mode < high power mode. (note2) please use vdd- vlcd 3.0v in high power mode condition. (reference current consumption data) setup current consumption power save mode 1 0.5 power save mode 2 0.67 normal mode 1.0 high power mode 1.8 (note) above current consumption data is reference value. change accord ing to panel load. power save mode fr / lcd drive waveform / power save mode sr will affect d isplay image. select the best setting in point of current consumption and d isplay image view using lcd panel. mode flicker display grade/contrast po wer save mode fr - lcd waveform power save mode sr - address set (adset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 0 0 p4 p3 p2 p1 p0 in the write mode, the range of address can be set from 000000 to 100011(bin). in the read mode, the range of address can be set from 000000 to 100101(bin). (note) address [5:0]: msb bit is specified in icset p2 and [4:0] are specifie d as adset p4 - p0. don?t specify another address, otherwise address will be set to 00000 0. downloaded from: http:///
13 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 mode set (mode set) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 0 * p3 p2 * * (* : don ? t care) set display on and off. setup p3 reset initialize condition display off (dispoff) 0 display on (dispon) 1 display off: despite of the contents of ddram, al l of segment and common output will stop after 1 frame period . display off mode will finish in display on (dispon). display on: segment and common output is active, start read operation to dis play from ddram. set bias level setup p2 reset initialize condition 1/3 bias 0 1/2 bias 1 regarding driving waveform, refer to lcd driving waveform. blin k control (blkctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 1 0 p2 p1 p0 set blink condition. setup p2 p1 p0 reset initialize condition off 0 0 0 0.5 hz 0 0 1 1 hz 0 1 0 2 hz 0 1 1 0.3 hz 1 0 0 0.2 hz 1 0 1 all pixel control (apctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 1 1 1 p1 p0 all display set on, off setup p1 reset initialize condition normal 0 all pixel on (apon) 1 setup p0 reset initialize condition normal 0 all pixel off (apoff) 1 all pixels on : all pixels are on regardless of ddram data. all pixels off : all pixels are off regardless of ddram data. (note) all pixels on/off is effective only at display on status. the content s of ddram do not change at this time. hen set p1 and p0=?1?, apoff is selected. apoff has higher priority th an apon. downloaded from: http:///
14 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 1frame c o m 0 c o m 1 c o m 2 c o m 3 s e g n s e g n + 1 s e g n + 2 s e g n + 3 s t a t e a ( c o m 0 - s e g n ) s t a t e b ( c o m 1 - s e g n ) s e g n+2 s e g n+3 c o m 3 s t a t e a s e g n s e g n+1 c o m 0 c o m 1 c o m 2 s t a t e b vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd 1frame c o m 0 c o m 1 c o m 2 c o m 3 s e g n s e g n + 1 s e g n + 2 s e g n + 3 s t a t e a ( c o m 0 - s e g n ) s t a t e b ( c o m 1 - s e g n ) c o m 2 c o m 3 c o m 0 s t a t e a c o m 1 s t a t e b s e g n s e g n+1 s e g n+2 s e g n+3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd lcd driving waveform (1/3bias) line inversion frame inversion fi gure 12. lcd waveform at line inversion (1/3bias) figure 13. lcd waveform at frame inversion (1/3bias) downloaded from: http:///
15 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 1frame s t a t e a ( c o m 0 - s e g n ) s t a t e b ( c o m 1 - s e g n ) c o m 2 c o m 3 c o m 0 s t a t e a c o m 1 s t a t e b s e g n s e g n+1 s e g n+2 s e g n+3 s e g n s e g n + 1 s e g n + 2 s e g n + 3 c o m 0 c o m 1 c o m 2 c o m 3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd 1frame s t a t e a ( c o m 0 - s e g n ) s t a t e b ( c o m 1 - s e g n ) c o m 1 s t a t e b c o m 2 c o m 3 s e g n+2 s e g n+3 c o m 0 s t a t e a s e g n s e g n+1 s e g n s e g n + 1 s e g n + 2 s e g n + 3 c o m 0 c o m 1 c o m 2 c o m 3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd (1/2bias) line inversion frame inversion fi gure 14. lcd waveform in line inversion (1/2bias) figure 15. lcd waveform in frame inversion (1 /2bias) downloaded from: http:///
16 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 example of display data if lcd layout pattern is like as figure 16 , figure 17, and display pattern is like as figure 18. display data will be shown as follows; figure 16. e.g. com line pattern figure 17. e.g. seg line pattern figure 18. e.g. display pattern s e g 0 s e g 1 s e g 2 s e g 3 s e g 4 s e g 5 s e g 6 s e g 7 s e g 8 s e g 9 s e g 10 s e g 11 s e g 12 s e g 13 s e g 14 s e g 15 s e g 16 s e g 17 s e g 18 s e g 19 com0 d0 0 1 1 0 1 1 1 1 0 1 1 0 0 0 0 0 0 0 0 0 com1 d1 0 0 1 1 1 0 0 1 1 1 0 0 0 0 0 0 0 0 0 0 com2 d2 0 0 0 1 0 1 0 0 1 0 1 0 0 0 0 0 0 0 0 0 com3 d3 0 0 1 1 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0ah 0bh 0ch 0dh 0eh 0fh 10h 11h 12h 13h seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg8 seg9 seg10 com1 com2 com3 com0 downloaded from: http:///
17 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 initialize sequence please follow below sequence after power-on to set this lsi to initi al conditio n. power on stop condition start condition issue slave address execute software reset by sending icset command. (note) each register value and ddram address, ddram data are random con dition after power on till initialize sequence is executed. start sequence start sequence example1 no. input d7 d6 d5 d4 d3 d2 d1 d0 descriptions 1 power on vdd=05v (tr : max 5 ms) 2 wait 100s initialize ic 3 stop stop condition 4 start start condition 5 slave address 0 1 1 1 1 1 0 0 issue slave address 6 icset 1 1 1 0 1 0 1 0 software reset 7 blkctl 1 1 1 1 0 0 0 0 blink off 8 disctl 1 0 1 0 0 1 0 0 80hz, frame inv., power save mode1 9 icset 1 1 1 0 1 0 0 1 external clock input 10 adset 0 0 0 0 0 0 0 0 ram address set 11 display data * * * * * * * * address 00h to 01h display data * * * * * * * * address 02h to 03h display data * * * * * * * * address 22h to 23h 12 stop stop condition 13 start start condition 14 slave address 0 1 1 1 1 1 0 0 issue slave address 15 modeset 1 1 0 * 1 0 * * display on, 1/3bias 16 stop stop condition *: don ? t care downloaded from: http:///
18 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 start sequence example2 abnormal operation may occur in bu9797fuv due to the effect of noise or other external factor. to avoid this phenomenon, please input command according to sequence described above during initializ ation, display on/off and refresh of ram data. initialize sequence d7 d6 d5 d4 d3 d2 d1 d0 power on wait 100us stop start slave address 0 1 1 1 1 1 0 0 7c apoff 1 1 1 1 1 1 0 1 set all pixel off modeset 1 1 0 * 0 0 * * set display off icset 1 1 1 0 1 0 1 0 software reset disctl 1 0 1 1 0 1 1 0 set disctl setting icset 1 1 1 0 1 0 0 0 set msb of ram address adset 0 0 0 0 0 0 0 0 set ram address display data * * * * * * * * stop dispon sequence d7 d6 d5 d4 d3 d2 d1 d0 start slave address 0 1 1 1 1 1 0 0 7c disctl 1 0 1 1 0 1 1 0 set disctl setting blkctl 1 1 1 1 0 0 0 0 set blink setting apctl 1 1 1 1 1 1 0 0 close all pixel on/off function modeset 1 1 0 * 1 0 * * set display on stop ram write sequence d7 d6 d5 d4 d3 d2 d1 d0 start slave address 0 1 1 1 1 1 0 0 7c disctl 1 0 1 1 0 1 1 0 set disctl setting blkctl 1 1 1 1 0 0 0 0 set blink setting apctl 1 1 1 1 1 1 0 0 close all pixel on/off function modeset 1 1 0 0 1 0 0 0 set display on icset 1 1 1 0 1 0 0 0 set msb of ram address adset 0 0 0 0 0 0 0 0 set ram address display data * * * * * * * * stop dispoff sequence d7 d6 d5 d4 d3 d2 d1 d0 start slave address 0 1 1 1 1 1 0 0 7c modeset 1 1 0 0 0 0 0 0 set display off stop input data description description description description input data input data input data *: don ? t care initialize sequence dispon sequence ram write sequence dispoff sequence this lsi is initialized with initialize sequence. and start to display with disp on sequence. this lsi will update display data with ram write sequence. and stop the display with dispoff sequence. if you want to restart to display, this lsi will restart to display with dispon sequence. initialize ram write dispoff dispon downloaded from: http:///
19 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 disctl setup flow chart start power save fr = normal mode line inversion power save sr = high power mode power consumption picture quality reduce power consumption or best picture image quality yes display flicker exist? no power save fr = save mode3 frame inversion power save sr = save mode1 disctl setting "10111100" power save fr = save mode2 frame inversion power save sr = save mode1 disctl setting "10110100" yes display flicker exist? no power save fr = save mode1 frame inversion power save sr = save mode1 disctl setting "10101100" yes display flicker exist? no power save fr = normal frame inversion power save sr = save mode1 disctl setting "10100100" power save fr = save mode3 frame inversion power save sr = save mode1 power save fr = save mode2 frame inversion power save sr = save mode1 power save fr = save mode1 line inversion power save sr = save mode1 disctl setting "10100011" disctl setting "10111100" disctl setting "10110100" disctl setting "10101100" downloaded from: http:///
20 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 vdd tf tr toff vbot cautions in power on/off this device has p.o.r (power -on reset) circuit and software reset function. please keep the following recommended power-on conditions in ord er to power up properly. please set power up conditions to meet the recommended tr, tf, toff, a nd vbot spec below in order to ensure p.o.r operation recommended condition of tr, tf, toff, vbot (ta=25c) tr tf toff vbot max 5ms max 5ms min 20ms less than 0. 3v figure 19. power on/off waveform if it is difficult to meet above conditions, execute the follo wing sequence after power-on. 1. generate stop condition figure 20 . stop condition 2. generate start condition. figure 21. start condition 3. issue slave address 4. execute software reset (icset) command downloaded from: http:///
21 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic ? s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current gr ound traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short a nd thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the pd stated in this specification is whe n the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum ra ting, increase the board size and copper area to prevent exceed ing the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the cond itions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and de lays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stres s. always discharge capacitors completely after each p rocess or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as met al particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
22 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutu al interference among circuits, operational faults, or physi cal damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoid ed. furthermore, do not apply a voltage to the input pin s when no power supply voltage is applied to the ic. even i f the power supply voltage is applied, make sure that th e input pin s have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however t he rating is exceeded for a continued period, the junc tion temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. downloaded from: http:///
23 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ordering information b u 9 7 9 7 f u v - me 2 part number package packaging and forming specification e2: embossed tape and reel (tssop-c48v) fuv : tssop-c48v lineup package orderable part number tssop-c48v reel of 2000 BU9797FUV-Me2 marking diagram tssop-c48v (top view) b u 9 7 9 7 part number marking lot number 1pin mark downloaded from: http:///
24 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimension tape and reel information package name tssop-c48v downloaded from: http:///
25 / 25 BU9797FUV-M max 144 segment s (seg 36 com4) datasheet tsz02201-0p4p0d300430-1-2 26.aug.2013 rev.001 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 26.aug.2013 001 new release downloaded from: http:///
datasheet datasheet notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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