1. 2. 3. material content data sheet sales product name btt6050-2eka issued 22. may 2015 ma# MA001369076 package pg-dso-14-40 weight* 149.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.421 2.28 2.28 22813 22813 leadframe inorganic material phosphorus 7723-14-0 0.017 0.01 116 non noble metal zinc 7440-66-6 0.070 0.05 464 non noble metal iron 7439-89-6 1.392 0.93 9281 non noble metal copper 7440-50-8 56.512 37.68 38.67 376838 386699 wire non noble metal copper 7440-50-8 1.065 0.71 0.71 7101 7101 encapsulation organic material carbon black 1333-86-4 0.168 0.11 1117 plastics epoxy resin - 7.708 5.14 51396 inorganic material silicondioxide 60676-86-0 75.903 50.61 55.86 506144 558657 leadfinish non noble metal tin 7440-31-5 1.241 0.83 0.83 8278 8278 plating noble metal silver 7440-22-4 1.417 0.95 0.95 9452 9452 glue plastics epoxy resin - 0.184 0.12 1225 noble metal silver 7440-22-4 0.866 0.58 0.70 5775 7000 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
