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| 1 BSC032N04LS rev.2.1,2016-06-09 final data sheet superso8 mosfet optimos tm power-mosfet ,40v features ?optimizedforhighperformancesmps,e.g.sync.rec. ?verylowon-resistance r ds(on) @ v gs =4.5v ?100%avalanchetested ?superiorthermalresistance ?n-channel ?qualifiedaccordingtojedec 1) fortargetapplications ?pb-freeleadplating;rohscompliant ?halogen-freeaccordingtoiec61249-2-21 table1keyperformanceparameters parameter value unit v ds 40 v r ds(on),max 3.2 m w i d 98 a q oss 22 nc q g (0v..10v) 25 nc type/orderingcode package marking relatedlinks BSC032N04LS pg-tdson-8 032n04ls - 1) j-std20 and jesd22 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4
2 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet tableofcontents description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 3 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet 1maximumratings at t a =25c,unlessotherwisespecified table2maximumratings values min. typ. max. parameter symbol unit note/testcondition continuous drain current i d - - - - - - - - - - 98 62 83 53 21 a v gs =10v, t c =25c v gs =10v, t c =100c v gs =4.5v, t c =25c v gs =4.5v, t c =100c v gs =10v, t a =25c, r thja =50k/w 1) pulsed drain current 2) i d,pulse - - 392 a t c =25c avalanche energy, single pulse 3) e as - - 30 mj i d =40a, r gs =25 w gate source voltage v gs -20 - 20 v - power dissipation p tot - - - - 52 2.5 w t c =25c t a =25c, r thja =50k/w 1) operating and storage temperature t j , t stg -55 - 150 c iec climatic category; din iec 68-1: 55/150/56 2thermalcharacteristics table3thermalcharacteristics values min. typ. max. parameter symbol unit note/testcondition thermal resistance, junction - case, bottom r thjc - 1.4 2.4 k/w - thermal resistance, junction - case, top r thjc - - 20 k/w - device on pcb, 6 cm 2 cooling area 1) r thja - - 50 k/w - 1) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. 2) see diagram 3 for more detailed information 3) see diagram 13 for more detailed information 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 4 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet 3electricalcharacteristics table4staticcharacteristics values min. typ. max. parameter symbol unit note/testcondition drain-source breakdown voltage v (br)dss 40 - - v v gs =0v, i d =1ma gate threshold voltage v gs(th) 1.2 - 2 v v ds = v gs , i d =250a zero gate voltage drain current i dss - - 0.1 10 1 100 a v ds =40v, v gs =0v, t j =25c v ds =40v, v gs =0v, t j =125c gate-source leakage current i gss - 10 100 na v gs =20v, v ds =0v drain-source on-state resistance r ds(on) - - 2.5 3.3 3.2 4.4 m w v gs =10v, i d =50a v gs =4.5v, i d =50a gate resistance 1) r g - 0.8 1.6 w - transconductance g fs 75 150 - s | v ds |>2| i d | r ds(on)max , i d =50a table5dynamiccharacteristics values min. typ. max. parameter symbol unit note/testcondition input capacitance 1) c iss - 1800 2520 pf v gs =0v, v ds =20v, f =1mhz output capacitance 1) c oss - 500 700 pf v gs =0v, v ds =20v, f =1mhz reverse transfer capacitance 1) c rss - 40 80 pf v gs =0v, v ds =20v, f =1mhz turn-on delay time t d(on) - 4 - ns v dd =20v, v gs =10v, i d =50a, r g,ext =1.6 w rise time t r - 4 - ns v dd =20v, v gs =10v, i d =50a, r g,ext =1.6 w turn-off delay time t d(off) - 19 - ns v dd =20v, v gs =10v, i d =50a, r g,ext =1.6 w fall time t f - 3 - ns v dd =20v, v gs =10v, i d =50a, r g,ext =1.6 w table6gatechargecharacteristics 2) values min. typ. max. parameter symbol unit note/testcondition gate to source charge q gs - 4.8 - nc v dd =20v, i d =50a, v gs =0to10v gate charge at threshold q g(th) - 2.8 - nc v dd =20v, i d =50a, v gs =0to10v gate to drain charge 1) q gd - 4.1 5.7 nc v dd =20v, i d =50a, v gs =0to10v switching charge q sw - 6.0 - nc v dd =20v, i d =50a, v gs =0to10v gate charge total 1) q g - 25 35 nc v dd =20v, i d =50a, v gs =0to10v gate plateau voltage v plateau - 2.7 - v v dd =20v, i d =50a, v gs =0to10v gate charge total 1) q g - 13 18 nc v dd =20v, i d =50a, v gs =0to4.5v gate charge total, sync. fet q g(sync) - 10 - nc v ds =0.1v, v gs =0to4.5v output charge 1) q oss - 22 31 nc v dd =20v, v gs =0v 1) defined by design. not subject to production test 2) see 2 gate charge waveforms 2 for parameter definition 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 5 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet table7reversediode values min. typ. max. parameter symbol unit note/testcondition diode continuous forward current i s - - 52 a t c =25c diode pulse current i s,pulse - - 392 a t c =25c diode forward voltage v sd - 0.88 1 v v gs =0v, i f =50a, t j =25c reverse recovery time 1) t rr - 23 46 ns v r =20v, i f =50a,d i f /d t =400a/s reverse recovery charge q rr - 52 - nc v r =20v, i f =50a,d i f /d t =400a/s 1) defined by design. not subject to production test 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 6 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet 4electricalcharacteristicsdiagrams diagram1:powerdissipation t c [c] p tot [w] 0 40 80 120 160 0 10 20 30 40 50 60 p tot =f( t c ) diagram2:draincurrent t c [c] i d [a] 0 40 80 120 160 0 20 40 60 80 100 120 i d =f( t c ); v gs 3 10v diagram3:safeoperatingarea v ds [v] i d [a] 10 -1 10 0 10 1 10 2 10 -1 10 0 10 1 10 2 10 3 1 s 10 s 100 s 1 ms 10 ms dc i d =f( v ds ); t c =25c; d =0;parameter: t p diagram4:max.transientthermalimpedance t p [s] z thjc [k/w] 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 -3 10 -2 10 -1 10 0 10 1 0.5 0.2 0.1 0.05 0.02 0.01 single pulse z thjc =f( t p );parameter: d = t p / t 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 7 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet diagram5:typ.outputcharacteristics v ds [v] i d [a] 0 1 2 0 50 100 150 200 250 300 350 400 10 v 5 v 4.5 v 4 v 3.5 v 3.2 v 3 v 2.8 v i d =f( v ds ); t j =25c;parameter: v gs diagram6:typ.drain-sourceonresistance i d [a] r ds(on) [m w ] 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 6 7 2.8 v 3 v 3.2 v 3.5 v 4 v 4.5 v 5 v 10 v r ds(on) =f( i d ); t j =25c;parameter: v gs diagram7:typ.transfercharacteristics v gs [v] i d [a] 0 1 2 3 4 5 0 80 160 240 320 400 150 c 25 c i d =f( v gs );| v ds |>2| i d | r ds(on)max ;parameter: t j diagram8:typ.forwardtransconductance i d [a] g fs [s] 0 20 40 60 80 100 0 50 100 150 200 250 g fs =f( i d ); t j =25c 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 8 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet diagram9:drain-sourceon-stateresistance t j [c] r ds(on) [m w ] -60 -20 20 60 100 140 180 0 1 2 3 4 5 6 max typ r ds(on) =f( t j ); i d =50a; v gs =10v diagram10:typ.gatethresholdvoltage t j [c] v gs(th) [v] -60 -20 20 60 100 140 180 0.0 0.5 1.0 1.5 2.0 2.5 250 a v gs(th) =f( t j ); v gs = v ds ; i d =250a diagram11:typ.capacitances v ds [v] c [pf] 0 10 20 30 40 10 1 10 2 10 3 10 4 ciss coss crss c =f( v ds ); v gs =0v; f =1mhz diagram12:forwardcharacteristicsofreversediode v sd [v] i f [a] 0.0 0.5 1.0 1.5 10 0 10 1 10 2 10 3 25 c 150 c 25 c, max 150 c, max i f =f( v sd );parameter: t j 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 9 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet diagram13:avalanchecharacteristics t av [s] i av [a] 10 0 10 1 10 2 10 3 10 0 10 1 10 2 25 c 100 c 125 c i as =f( t av ); r gs =25 w ;parameter: t j(start) diagram14:typ.gatecharge q gate [nc] v gs [v] 0 5 10 15 20 25 0 2 4 6 8 10 12 32 v 20 v 8 v v gs =f( q gate ); i d =50apulsed;parameter: v dd diagram15:drain-sourcebreakdownvoltage t j [c] v br(dss) [v] -60 -20 20 60 100 140 180 30 32 34 36 38 40 42 44 46 v br(dss) =f( t j ); i d =1ma 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 gate charge waveforms 10 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet 5packageoutlines figure1outlinepg-tdson-8,dimensionsinmm 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 gate charge waveforms ? 11 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet figure2outlinetape(tdson-8) 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 gate charge waveforms ? dimension in mm 12 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet figure3outlinefootprint(tdson-8) 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 gate charge waveforms ? dimension in mm 13 optimos tm power-mosfet ,40v BSC032N04LS rev.2.1,2016-06-09 final data sheet revisionhistory BSC032N04LS revision:2016-06-09,rev.2.1 previous revision revision date subjects (major changes since last revision) 2.1 2016-06-09 insert max values and update footnotes trademarksofinfineontechnologiesag aurix?,c166?,canpak?,cipos?,coolgan?,coolmos?,coolset?,coolsic?,corecontrol?,crossave?,dave?,di-pol?,drblade?, easypim?,econobridge?,econodual?,econopack?,econopim?,eicedriver?,eupec?,fcos?,hitfet?,hybridpack?,infineon?, isoface?,isopack?,i-wafer?,mipaq?,modstack?,my-d?,novalithic?,omnitune?,optiga?,optimos?,origa?,powercode?, primarion?,primepack?,primestack?,profet?,pro-sil?,rasic?,real3?,reversave?,satric?,sieget?,sipmos?,smartlewis?, solidflash?,spoc?,tempfet?,thinq?,trenchstop?,tricore?. trademarksupdatedaugust2015 othertrademarks allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners. welistentoyourcomments anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.pleasesendyourproposal(includingareferencetothisdocument)to: erratum@infineon.com publishedby infineontechnologiesag 81726mnchen,germany ?2016infineontechnologiesag allrightsreserved. legaldisclaimer theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.with respecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplication ofthedevice,infineontechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout limitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. information forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestinfineon technologiesoffice( www.infineon.com ). warnings duetotechnicalrequirements,componentsmaycontaindangeroussubstances.forinformationonthetypesinquestion, pleasecontactthenearestinfineontechnologiesoffice. theinfineontechnologiescomponentdescribedinthisdatasheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofinfineontechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 8 d 7 d 6 d 5 d s 1 s 2 s 3 g 4 gate charge waveforms ? dimension in mm |
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