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CSFR104 MC33346 08400 6656RQ M5000 HY57V2 BLF574XR 2SC5840
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  1 pulseelectronics.com/products/antennas ideal for board-to-antenna applications spring contact for positive connection surface mount technology; solder refowable features - pwb footprint 3.2 x 1.7 mm - nominal contact height 1 mm - tape & reel packaging - rohs compliant product applications - antenna contacts l163.b (12/14) c-clip connector pulse part number W9908 san diego, ca 858 674 8100 vancouver, wa 360 944 7551 europe 49 7032 7806 0 asia 86 755 33966678 north asia 886 3 4356768 china 86 512 6807 9998
2 pulseelectronics.com/products/antennas 2 pulseelectronics.com/products/antennas W9908 c-clip confguration and dimensions pwb footprint dimensions and c-clip position for W9908 ground clearance area for W9908 c-clip pwb layouts c-clip connector pulse part number W9908 l163.b (12/14)
3 pulseelectronics.com/products/antennas 3 pulseelectronics.com/products/antennas c-clip connector pulse part number W9908 l163.b (12/14)
4 pulseelectronics.com/products/antennas 4 pulseelectronics.com/products/antennas c-clip connector pulse part number W9908 l163.b (12/14)
5 pulseelectronics.com/products/antennas 5 pulseelectronics.com/products/antennas recommendation for refow soldering process printing stencil thickness 0.15 to 0.25 mm is recommended for the solder paste. the maximum soldering temperature should not exceed 260 c. the temperature profle recommendations for refow solder process are presented in figure 1 and 2. the refow profle presented in figure 2 describes maximum refow temperatures. w0 connector soldering figure 1 - minimum temperature profle recommendation for refow soldering process c-clip connector pulse part number W9908 l163.b (12/14)
6 pulseelectronics.com/products/antennas 6 pulseelectronics.com/products/antennas figure 2 - maximum temperature profle recommendation for refow soldering process c-clip connector pulse part number W9908 l163.b (12/14)


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