1/5 BYT03-400 october 2001 - ed: 2a high efficiency ultrafast diode ? the BYT03-400 which is using sts 400v planar technology, is specially suited for switching mode base drive & transistor circuits. the device, which is available in axial (do-201ad) package, is also intended for use as a free wheeling diode in power supplies and other power switching applications. description n very low conduction losses n negligible switching losses n low forward & reverse recovery times features and benefits do-201ad BYT03-400 symbol parameter value unit v rrm repetive peak reverse voltage 400 v i f (av) average forward current ti = 55c d = 0.5 3a i fsm surge non repetitive forward current tp = 10ms sinusoidal 60 a t stg storage temperature range - 65 to +150 c t j maximum operating junction temperature 150 c absolute ratings (limiting values) i f(av) 3a v rrm 400 v t j (max) 150c v f (max) 1.4 v trr (max) 25 ns main product characteristics obsolete product(s) - obsolete product(s)
BYT03-400 2/5 symbol parameter value unit r th(j-a) junction to ambient* 20 c/w * on infinite heatsink with 10mm lead length. thermal parameters symbol parameters test conditions min. typ. max. unit i r * reverse leakage current t j = 25c v r =v rrm 20 m a t j = 100c 0.2 0.5 ma v f ** forward voltage drop t j =25 ci f =3a 1.5 v t j = 100c 1.0 1.4 static electrical characteristics symbol parameter test conditions min. typ. max. unit trr reverse recovery time t j =25 ci f = 0.5a i r =1a i rr = 0.25a 16 25 ns i f =1a di f /dt = - 15a/ m s v r = 30v 55 tfr forward recovery time t j =25 ci f =3a di f /dt = 50a/ m s vfr=1.1xv f max 75 ns v fp forward recovery voltage t j =25 ci f =3a di f /dt = 50a/ m s 7.0 v dynamic electrical characteristics pulse test: * tp = 5ms, d <2% ** tp = 380s, d <2% to evaluate the maximum conduction losses use the following equation: p=1.1xi f(av) + 0.08 i f 2 (rms) obsolete product(s) - obsolete product(s)
BYT03-400 3/5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 if(av)(a) pf(av)(w) d = 0.05 d = 0.1 d = 0.2 d = 0.5 d = 1 t d =tp/t tp fig. 1: average forward power dissipation versus average forward current. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 tamb(c) rth(j-a)=rth(j-l) rth(j-a)=75c/w if(av)(a) fig. 2: average forward current versus ambient temperature ( d = 0.5) 0 10 20 30 40 50 60 70 80 90 5 10152025 lleads(mm) rth(j-a) rth(j-l) rth(c/w) fig. 3: thermal resistance versus lead length. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 tp(s) zth(j-a)/rth(j-a) d = 0.5 d = 0.2 d = 0.1 single pulse t d =tp/t tp fig. 4: relative variation of thermal impedance junction ambient versus pulse duration (printed circuit board epoxy fr4, lleads = 10mm). 0.1 1.0 10.0 100.0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 vfm(v) tj=25c (maximum values) tj=100c (typical values) tj=100c (typical values) tj=100c (maximum values) tj=100c (maximum values) ifm(a) fig. 5: forward voltage drop versus forward current. 0 2 4 6 8 10 12 14 16 18 20 1 10 100 1000 vr(v) f=1mhz vosc=30mv tj=25c c(pf) fig. 6: junction capacitance versus reverse voltage applied (typical values). obsolete product(s) - obsolete product(s)
BYT03-400 4/5 0 20 40 60 80 100 120 140 160 180 200 0 102030405060708090100 dif/dt(a/s) if=3a tj=100c tfr(ns) fig. 7: forward recovery time versus dif/dt (90% confidence). 0 2 4 6 8 10 12 0 102030405060708090100 dif/dt(a/s) if=3a tj=100c vfp(v) fig. 8. transient peak forward voltage versus dif/dt (90% confidence). 0.0 0.5 1.0 1.5 2.0 2.5 1 10 100 dif/dt(a/s) if=3a vr=200v tj=100c tj=25c irm(a) fig. 9: peak reverse recovery current versus dif/dt (90% confidence). 100 150 200 250 300 25 50 75 100 125 150 tj(c) irm qrr trr if=3a dif/dt=-50a/s vr=30v % fig. 10: dynamic parameters versus junction temperature. 0 5 10 15 20 25 30 35 40 45 50 55 60 65 1 10 100 1000 number of cycles tj initial=25c ifsm(a) fig. 11: non repetitive surge peak current versus number of cycles. obsolete product(s) - obsolete product(s)
BYT03-400 5/5 package mechanical data do-201ad ba e e ?d ?d ?c b note 2 note 1 note 1 ref. dimensions notes millimeters inches min. max. min. max. a 9.50 0.374 1 - the lead diameter ? d is not controlled over zone e 2 - the minimum length which must stay straight between the right angles after bending is 0.59"(15 mm) b 25.40 1.000 c 5.30 0.209 d 1.30 0.051 e 1.25 0.049 ordering code marking package weight base qty delivery mode BYT03-400 BYT03-400 do-201ad 1.16 g 600 ammopack BYT03-400rl BYT03-400 do-201ad 1.16 g 1900 tape & reel n cooling method: by conduction (method a) n epoxy meets ul 94,v0 n bending method: application note an1471. information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2001 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia -malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com obsolete product(s) - obsolete product(s)
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