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  TH5 www.vishay.com vishay sprague revision: 28-sep-16 1 document number: 40146 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum surface mount chip capacitors t antamount ?, molded case, hi-tmp ? , very high temperature 200 c performance / electrical characteristics operating temperature: -55 c to +200 c capacitance range: 4.7 f to 100 f capacitance tolerance: 10 %, 20 % voltage range: 5 v dc to 24 v dc features ? operating temperature up to +200 c ? category voltage at +200 c: same as rated voltage (rv) at 25 c to 85 c ? 500 h continuous operation at rv ? gold plated terminations ? 100 % surge current tested ? standard eia 535baac case sizes ? moisture sensitivity level 1 ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications ? oil and petroleum ? high temperature sens ing and drilling systems ? industrial ? safety critical indust rial tools and products ? high temperature ex tended activities ? high temperature engines ? electronic sensors note (1) other termination on request note ? glue pad (non-conductive, part of molded case) is dedicated for glue atta chment (as user option). note ? TH5 series capacitors ha ve been designed for, and tested at category voltage at +200 c for 500 h. ? as with all tantalum capacitors, reliability and life time may be extended by application of lower voltage. ordering information TH5 e 106 k 021 b 1000 type case code capacitance capacitance tolerance category voltage at -55 c to +200 c termination / packaging esr see ratings and case codes table this is expressed in picofarads. the first two digits are the significant figures. the third is the number of zeros to follow. k = 10 % m = 20 % this is expressed in v. to complete the three-digit block, zeros precede the voltage rating. gold a = 7" (178 mm) reel ? b = 13" (330 mm) reel ? g = 7" (178 mm) ? reel ? q = 7" (178 mm) partial reel other (1) maximum 100 khz esr 0500 = 500 m ? 5000 = 5 ? 10r0 = 10.0 ? dimensions in inches [millimeters] case code eia size l w h p t w t h (min.) d 7343-31 0.287 0.012 [7.3 0.30] 0.169 0.012 [4.3 0.30] 0.110 0.012 [2.8 0.30] 0.051 0.012 [1.3 0.30] 0.094 0.004 [2.4 0.10] 0.039 [1.0] e 7343-43 0.287 0.012 [7.3 0.30] 0.170 0.012 [4.3 0.30] 0.158 0.012 [4.0 0.30] 0.051 0.012 [1.3 0.30] 0.095 0.004 [2.4 0.10] 0.039 [1.0] h w t w p l t h (min.) g lue pad g lue pad
TH5 www.vishay.com vishay sprague revision: 28-sep-16 2 document number: 40146 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ?esr limit (in ? ) is shown in parenthesis. note ? part number definitions: (1) capacitance tolerance codes: k, m (2) terminations and packaging: a, b, g, q note ? TH5 series capacitors ha ve been designed for, and tested at category voltage at +200 c for 500 h. ? as with all tantalum capacitors, reliability and life time may be extended by application of lower voltage. ratings and case codes f 5 v 8 v 21 v 24 v 4.7 e (2.50) 10 e (1.00, 0.50) 22 d (0.50), e (0.50) 100 e (0.25) construction and marking marking: capacitor marking includes an anode (+) polarity band, capacitance in microfarads and the voltage rating. the vishay identification is included if space permits. a manufacturing date code is marked on all capacitors. call the factory for further explanation. standard ratings capacitance (f) case code part number max. dcl at +25 c (a) typical dcl at +200 c (a) max. df at +25 c (%) max. esr at +25 c 100 khz ( ? ) max. ripple 100 khz i rms (a) 5 v dc at +200 c 100 e TH5e107(1)005(2)0250 5.0 300 8 0.250 0.81 8 v dc at +200 c 22 d TH5d226(1)008(2)0500 6.0 360 6 0.500 0.55 22 e TH5e226(1)008(2)0500 6.0 360 6 0.500 0.57 21 v dc at +200 c 10 e TH5e106(1)021(2)1000 2.1 120 6 1.000 0.41 10 e TH5e106(1)021(2)0500 2.1 120 6 0.500 0.57 24 v dc at +200 c 4.7 e TH5e475(1)024(2)2500 1.1 60 10 2.500 0.26 standard packaging quantity case code units per reel 13" full reel 7" full reel 7" half reel 7" partial reel d 2500 500 250 100 e 1500 400 200 100 leadframe epoxy encap s ulation anode polarity bar s olderable cathode termination s ilver adhe s ive mno 2 / carbon / s ilver coating s olderable anode termination s intered tantalum 2 10u21 b1 date code vi s hay marking voltage capacitance polarity bar g ol d termination TH5 s tan d ar d markin g case s izes d an d e
molded guide www.vishay.com vishay sprague revision: 12-sep-17 1 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide for molded tantalum capacitors introduction tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliab ility, and long service life are primary considerations. the stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for toda y's surface mount assembly technology. vishay sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. tantalum is not found in its pure state. rather, it is commonly found in a number of oxide minerals, often in combination with columbium ore. this combination is known as tantalite when its contents are more than one-half tantalum. important sources of tantalite include australia, brazil, canada, china, an d several african countries. synthetic tantalite concentrates produced from tin slags in thailand, malaysia, and brazil are also a significant raw ma terial for tantalum production. electronic applications, an d particularly capacitors, consume the largest share of world tantalum production. other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. vishay sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperatu re vacuum processing. the basics of tantalum capacitors most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. a few metals form dens e, stable, tightly adhering, electrically insulating oxid es. these are the so-called valvemetals and include tita nium, zirconium, niobium, tantalum, hafnium, and aluminum. only a few of these permit the accurate contro l of oxide thickness by electrochemical means. of these, the most valuable for the electronics industry are aluminum and tantalum. capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. their function is to store an electrical charge for later use. capacitors consist of two co nducting surfaces, usually metal plates, whose function is to conduct electricity. they are separated by an insulating material or dielectric. the dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. as capacitors are being manufactured, a film of tantalum pentox ide is applied to their electrodes by means of an electrolytic process. the film is applied in various thic knesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. this coloring occurs on the tantalum electrodes of all types of tantalum capacitors. rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. an approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. this, in addition to the fact that extremely thin films can be deposited du ring the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. th e capacitance of any capacitor is determined by the su rface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. in the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. as the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: ? ? where c = capacitance e = dielectric constant a = surface area of the dielectric t = thickness of the dielectric tantalum capacitors contain either liquid or solid electrolytes. in solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. a tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. the drawings show the construction details of the surface mount types of tantalum capacitors sh own in this catalog. comparison of capacitor ? dielectric constants dielectric e dielectric constant air or vacuum 1.0 paper 2.0 to 6.0 plastic 2.1 to 6.0 mineral oil 2.2 to 2.3 silicone oil 2.7 to 2.8 quartz 3.8 to 4.4 glass 4.8 to 8.0 porcelain 5.1 to 5.9 mica 5.4 to 8.7 aluminum oxide 8.4 tantalum pentoxide 26 ceramic 12 to 400k c ea t ------ - =
molded guide www.vishay.com vishay sprague revision: 12-sep-17 2 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid electrolyte tantalum capacitors solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. the pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. the pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. afte r assembly, the capacitors are tested and inspected to assure long life and reliability. it offers excellent reliability and high stability for consumer and commercial el ectronics with the added feature of low cost surface mount designs of so lid tantalum capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. tantalum capacitors for all design considerations solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. they will typically withstand up to about 10 % of the rated dc working voltage in a revers e direction. also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. vishay sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. vishay sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. data sheets covering the various types and styles of vishay sprague capacitors for consumer and entertainment electronics, industry, and milit ary applications are available where detailed performance characteristics must be specified. ? molded chip capacitor, all types except 893d / tf3 / t86 molded chip capacitor with built-in fuse, types 893d / tf3 / t86 leadframe epoxy encap s ulation anode polarity bar s olderable cathode termination s ilver adhe s ive mno 2 /carbon/ s ilver coating s olderable anode termination s intered tantalum s ilver adhe s ive s olderable cathode termination s intered tantalum pellet lead frame fu s ible wire s olderable anode termination anode polarity bar epoxy encap s ulation mno 2 /carbon/ s ilver coating
molded guide www.vishay.com vishay sprague revision: 12-sep-17 3 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 commercial products solid tantalum capacitors - molded case series 293d 793dx-ctc3- ctc4 593d tr3 tp3 tl3 product image type surface mount t antamount ?, molded case features standard industrial grade cecc approved low esr low esr high performance, automotive grade very low dcl temperature range -55 c to +125 c capacitance range 0.1 f to 1000 f 0.1 f to 100 f 1 f to 470 f 0.47 f to 1000 f 0.1 f to 470 f 0.1 f to 470 f voltage range 4 v to 75 v 4 v to 50 v 4 v to 50 v 4 v to 75 v 4 v to 50 v 4 v to 50 v capacitance tolerance 10 %, 20 % leakage current 0.01 cv or 0.5 a, whichever is greater 0.005 cv or 0.25 a, whichever is greater dissipation factor 4 % to 30 % 4 % to 6 % 4 % to 15 % 4 % to 30 % 4 % to 15 % 4 % to 15 % case codes a, b, c, d, e, v a, b, c, d a, b, c, d, e a, b, c, d, e, v, w a, b, c, d, e a, b, c, d, e termination 100 % matte tin standard , tin / lead available solid tantalum capacitors - molded case series th3 th4 TH5 893d tf3 product image type surface mount t antamount ?, molded case features high temperature +150 c, automotive grade high temperature +175 c, automotive grade very high temperature +200 c built-in fuse built-in fuse, low esr temperature range -55 c to +150 c -55 c to +175 c -55 c to +200 c -55 c to +125 c capacitance range 0.33 f to 220 f 10 f to 100 f 4.7 f to 100 f 0.47 f to 680 f 0.47 f to 470 f voltage range 6.3 v to 50 v 6.3 v to 35 v 5 v to 24 v 4 v to 50 v 4 v to 50 v capacitance tolerance 10 %, 20 % leakage current 0.01 cv or 0.5 a, whichever is greater dissipation factor 4 % to 8 % 4.5 % to 8 % 6 % to 10 % 6 % to 15 % 6 % to 15 % case codes a, b, c, d, e b, c, d, e d, e c, d, e c, d, e termination 100 % matte tin standard, tin / lead and gold plated available 100 % matte tin gold plated 100 % matte tin standard
molded guide www.vishay.com vishay sprague revision: 12-sep-17 4 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 high reliability products solid tantalum capacitors - molded case series tm3 t83 t86 cwr11 95158 product ? image type t antamount ?, molded case, hi-rel. t antamount ?, molded case, hi-rel. cots t antamount ?, molded case, dla approved features high reliability, for medical instruments high reliability, standard and low esr high reliability, built-in fuse, standard and low esr mil-prf-55365/8 qualified low esr temperature ? range -55 c to +125 c capacitance ? range 1 f to 220 f 0.1 f to 470 f 0.47 f to 330 f 0.1 f to 100 f 4.7 f to 220 f voltage range 4 v to 20 v 4 v to 63 v 4 v to 50 v capacitance ? tolerance 10 %, 20 % 5 %, 10 %, 20 % 10 %, 20 % leakage ? current 0.005 cv or 0.25 a, whichever is greater 0.01 cv or 0.5 a, whichever is greater dissipation ? factor 4 % to 8 % 4 % to 15 % 6 % to 16 % 4 % to 6 % 4 % to 12 % case codes a, b, c, d, e a, b, c, d, e c, d, e a, b, c, d c, d, e termination 100 % matte tin; tin / lead 100 % matte tin; tin / lead; tin / lead solder fused 100 % matte tin tin / lead; tin / lead solder fused tin / lead solder plated; gold plated
molded guide www.vishay.com vishay sprague revision: 12-sep-17 5 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? metric dimensions will govern . dimensions in inches are rounded and for reference only. (1) a 0 , b 0 , k 0 , are determined by the maximum dimensions to the ends of the terminals extending fr om the component body and / or the body dimensions of the component. the clearance between the ends of the terminals or body of the co mponent to the sides and depth of the cavity (a 0 , b 0 , k 0 ) must be within 0.002" (0.05 mm) minimum and 0.020" (0. 50 mm) maximum. the clearance allo wed must also prevent rotation of the component within the cavity of not more than 20. (2) tape with components shall pass around radius r without damage . the minimum trailer length may require additional length to p rovide r minimum for 12 mm embossed tape for reels with hub diameters approaching n minimum. (3) this dimension is the flat area from the edge of the sprocket hole to either outward deformatio n of the carrier tape between th e embossed cavities or to the edge of the cavity whichever is less. (4) this dimension is the flat area from the edge of the carrier ta pe opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cav ity or to the edge of the cavity whichever is less. (5) the embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. dimensions of embossement location shall be a pplied independent of each other. (6) b 1 dimension is a reference dimension tape feeder clearance only. plastic tape and reel packaging in inches [millimeters] tape and reel specifications: all case sizes are available on plastic em bossed tape per eia- 481. standard reel diameter is 7" [178 mm], 13" [ 330 mm] reels are available and recommended as the most cost effective packaging method. the most efficient packaging quantities are full reel increments on a given reel diameter. the quantities shown allow for the sealed empty pockets required to be in conformance with eia-481. reel size and packaging orientation must be specified in the vishay sprague part number. case code tape size b 1 (max.) d 1 (min.) f k 0 (max.) p 1 w molded chip capacitors; all types a 8 mm 0.165 [4.2] 0.039 [1.0] 0.138 0.002 [3.5 0.05] 0.094 [2.4] 0.157 0.004 [4.0 1.0] 0.315 0.012 [8.0 0.30] b c 12 mm 0.32 [8.2] 0.059 [1.5] 0.217 0.00 [5.5 0.05] 0.177 [4.5] 0.315 0.004 [8.0 1.0] 0.472 0.012 [12.0 0.30] d e v w 0.004 [0.1] max. k 0 tape thickness b 1 max. (note 6) 0.014 [0.35] max. 0.008 [0.200] embossment 0.069 0.004 [1.75 0.10] d 1 min. for components 0.079 x 0.047 [2.0 x 1.2] and larger . (note 5) maximum cavity size (note 1) user direction of feed center lines of cavity a 0 p 1 f w 0.030 [0.75] min. (note 4) 0.030 [0.75] min. (note 3) 0.079 0.002 [2.0 0.05] 0.157 0.004 [4.0 0.10] 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] b 0 maxim um component rotation (side or front sectional view) 20 for tape feeder reference only including draft. concentric around b 0 (note 5) deformation between embossments to p cover tape to p cover tape 10 pitches cumulative tolerance on tape direction of feed anode (+) cathode (-) 20 maximum component rotation typical component cavity center line typical component center line a 0 b 0 (top view) 0.9843 [250.0] tape 3.937 [100.0] 0.039 [1.0] max. 0.039 [1.0] max. camber (top view) allowable camber to be 0.039/3.937 [1/100] non-cumulative over 9.843 [250.0]
molded guide www.vishay.com vishay sprague revision: 12-sep-17 6 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 recommended reflow profiles capacitors should withstand reflow profile as per j-std-020 standard, three cycles. profile feature snpb eutectic assembly lead (pb)-free assembly preheat / soak temperature min. (t s min. ) 100 c 150 c temperature max. (t s max. ) 150 c 200 c time (t s ) from (t s min. to t s max. ) 60 s to 120 s 60 s to 120 s ramp-up ramp-up rate (t l to t p ) 3 c/s max. 3 c/s max. liquidus temperature (t l ) 183 c 217 c time (t l ) maintained above t l 60 s to 150 s 60 s to 150 s peak package body temperature (t p ) depends on case size - see table below time (t p ) within 5 c of the specified ? classification temperature (t c ) 20 s 30 s time 25 c to peak temper ature 6 min max. 8 min max. ramp-down ramp-down rate (t p to t l ) 6 c/s max. 6 c/s max. 25 temperature (c) time (s) t s t l time 25 c to peak t l t p t c - 5 c t p t s max. t s min. preheat area max. ramp-up rate = 3 c/s max. ramp-down rate = 6 c/s peak package body temperature (t p ) case code peak package body temperature (t p ) snpb eutectic process lead (pb)-free process a, b, c, v 235 c 260 c d, e, w 220 c 250 c pad dimensions in inches [millimeters] case code a (min.) b (nom.) c (nom.) d (nom.) molded chip capacitors, all types a 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] b 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] c 0.118 [3.00] 0.094 [2.40] 0.118 [3.00] 0.307 [7.80] d 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] e 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] v 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] w 0.185 [4.70] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] a b c d
molded guide www.vishay.com vishay sprague revision: 12-sep-17 7 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide to application 1. ac ripple current: the maximum allowable ripple current shall be determi ned from the formula: where, p = power dissipation in w at +25 c as given in the tables in the product datasheets (power dissipation). r esr = the capacitor equivalent series resistance at the specified frequency 2. ac ripple voltage: the maximum allowable ripple voltage shall be determi ned from the formula: or, from the formula: where, p = power dissipation in w at +25 c as given in the tables in the product datasheets (power dissipation). r esr = the capacitor equivalent series resistance at the specified frequency z = the capacitor impedance at the specified frequency 2.1 the sum of the peak ac voltage plus the applied dc voltage shall not exceed the dc voltage rating of the capacitor. 2.2 the sum of the negative peak ac voltage plus the applied dc voltage shall not allow a voltage reversal exceeding 10 % of the dc working voltage at +25 c. 3. reverse voltage: solid tantalum capacitors are not intended for use with re verse voltage applied. however, they have been shown to be capable of withstanding momentary reverse voltage peaks of up to 10 % of the dc rating at 25 c and 5 % of the dc rating at +85 c. 4. temperature derating: if these capacitors are to be operated at temperatures above +25 c, the permissible rms ripple curre nt shall be calculated using the derating factors as shown: note (1) applicable for dedicated high temperature product series 5. power dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. non-sinusoidal ripple current may produce heating effects which differ from those shown. it is important that the equivalent i rms value be established when calculating permissible operating levels. (power dissipation calculated using +25 c temperature rise). 6. printed circuit board materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina su bstrates, fr4, fr5, g10, ptfe-fluorocarbon and porcelanized steel). 7. attachment: 7.1 solder paste: the recommended thickness of the solder paste after application is 0.007" 0.001" [0.178 mm 0.025 mm]. care should be exercised in selecting the solder paste. the metal purity should be as high as practical. the fl ux (in the paste) must be active enough to remove th e oxides formed on the metallization prior to the exposure to soldering heat. in practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering, and hot plate methods. the soldering profile charts show recommended time / temperature conditions for soldering. preheating is recommended. the recommended maximum ramp rate is 2 c per s. attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. the soldering iron must never come in contact with the capacitor. 7.2.1 backward and forward compatibility: capacitors with snpb or 100 % tin termination finishes can be soldered using snpb or lead (pb)-free soldering processes. 8. cleaning (flux removal) after soldering: molded capacitors are compatible with all commonly used solvents such as tes, tms, prelete, chlorethane, terpene and aqueous clea ning media. however, cfc / ods products are not used in the production of these devices and are not recommended. solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 when using ultrasonic cleaning, the board may resonate if the output power is too high. this vibration can cause cracking or a decrease in the adherence of the termination. do not exceed 9w/l at 40 khz for 2 min. 9. recommended mounting pad geometries: proper mounting pad geometries are essential for successful solder connections. these dimensions are highly process sensitive and should be designed to minimize component re work due to unacceptable solder joints. the dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. these dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. temperature (c) derating factor +25 1.0 +85 0.9 +125 0.4 +150 (1) 0.3 +175 (1) 0.2 +200 (1) 0.1 i rms p r esr ------------ = v rms i rms x z = v rms z p r esr ------------ =
typical performance characteristics www.vishay.com vishay sprague revision: 19-jul-17 1 document number: 40206 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 TH5 tantalum capacitors note ? all measurements to be performed after 24 h conditioning at room temperature note ? all measurements to be performed after 24 h conditioning at room temperature electrical performance characteristics item performance characteristics category temperature range -55 c to +200 c category voltage category voltage is the same within entire temperature range and is equal to rated voltage capacitance tole rance 20 %, 10 %, tested vi a bridge method, at 25 c, 120 hz dissipation factor limits per standard ratings table. tested via bridge method, at 25 c, 120 hz esr limits per standard rati ngs table. tested via bridge method, at 25 c, 100 khz leakage current after application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k resistor in series with the capacitor under test, leakage current at 25 c is not more than described in standard ratings table. note that the leakage current varies with temperature and applied voltage. environmental performance characteristics item condition post test performance life test 500 h applicatio n of rated voltage at 200 c capacitance change dissipation factor esr leakage current -30 % / +10 % of initially specified value not to exceed 150 % of initial not to exceed 125 % of initial not to exceed 1 ma (at 200 c) moisture resistance cycled, 20 cycles, mil-std-202, method 106 capacitance change dissipation factor leakage current 15 % of initially specified value not to exceed 150 % of initial not to exceed 200 % of initial surge voltage 85 c, 1000 cycles at 1.3 rated volt age in series with 33 resistor, mil-prf-55365 capacitance change dissipation factor leakage current 5 % of initially specified value initial specified value or less initial specified value or less mechanical performance characteristics item condition post test performance terminal strength / shear force test apply a pressure load of 17.7 n for 60 s horizontally to the center of capacitor side body. capacitance change dissipation factor leakage current within 10 % of initial value initial specified limit initial specified limit there shall be no mechanical or visual damage to capacitors post-conditioning. vibration mil-std-202, method 204, condition d, 10 hz to 2000 hz, 20 g peak there shall be no mechanical or visual damage and the components shall meet the original electrical requirements resistance to solder heat mil-std-202, method 210, cond ition k capacitance change dissipation factor leakage current 5 % of initially specified value initial specified value or less initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. solderability mil-std-202, method 208, ansi / j-std-002, test b applies only to solder and tin plated terminations. does not apply to gold terminations. all terminations shall exhibit a cont inuous solder co ating free from defects for a minimum of 95 % of the critical area of any individual termination resistance to solvents mil-std-202, method 215 marking has to remain legible, no degradat ion of encapsulation material flammability encapsulation materials meet ul 94 v-0 with an oxygen index of 32 %
legal disclaimer notice www.vishay.com vishay revision: 08-feb-17 1 document number: 91000 disclaimer ? all product, product specifications and data ar e subject to change with out notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, vishay), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, representation or guarantee regarding the suitability of th e products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, vi shay disclaims (i) any and all liability arising out of the application or use of any product , (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all implied warranties, includ ing warranties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain types of applicatio ns are based on vishays knowledge of typical requirements that are often placed on vishay products in generic applications. such statements are not binding statements about the suitability of products for a particular applic ation. it is the customers responsibility to validate tha t a particular product with the prope rties described in the product sp ecification is suitable for use in a particular application. parameters provided in datasheets and / or specifications may vary in different ap plications and perfor mance may vary over time. all operating parameters, including ty pical parameters, must be va lidated for each customer application by the customer s technical experts. product specifications do not expand or otherwise modify vishays term s and conditions of purchase, including but not limited to the warranty expressed therein. except as expressly indicated in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vishay product could result in personal injury or death. customers using or selling vishay product s not expressly indicated for use in such applications do so at their own risk. please contact authorized vishay personnel to obtain writ ten terms and conditions rega rding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is gran ted by this document or by any conduct of vishay. product names and markings noted herein may be trademarks of their respective owners. ? 2017 vishay intertechnology, inc. all rights reserved


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