1. 2. 3. material content data sheet sales product name bsc12dn20ns3 g issued 29. august 2013 ma# MA000862670 package pg-tdson-8-5 weight* 116.56 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.374 1.18 1.18 11787 11787 leadframe non noble metal iron 7439-89-6 0.049 0.04 422 inorganic material phosphorus 7723-14-0 0.015 0.01 126 non noble metal copper 7440-50-8 49.082 42.10 42.15 421075 421623 wire non noble metal copper 7440-50-8 0.071 0.06 0.06 606 606 encapsulation organic material carbon black 1333-86-4 0.081 0.07 695 plastics epoxy resin - 5.753 4.94 49352 inorganic material silicondioxide 60676-86-0 34.678 29.75 34.76 297501 347548 leadfinish non noble metal tin 7440-31-5 1.452 1.25 1.25 12454 12454 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1420 1420 solder non noble metal tin 7440-31-5 0.030 0.03 261 noble metal silver 7440-22-4 0.038 0.03 327 non noble metal lead 7439-92-1 1.455 1.25 1.31 12485 13073 heat sink clip inorganic material phosphorus 7723-14-0 0.007 0.01 57 non noble metal iron 7439-89-6 0.022 0.02 191 non noble metal copper 7440-50-8 22.292 19.12 19.15 191241 191489 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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