- patented trench schottky technology - low power loss, high efficiency - ideal for automated placement - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol unit v rrm v i f(av) a t j = 25c v f t j = 125c v f t j = 25c a t j = 125c ma t j c t stg c document number: ds_d1412013 version: j15 storage temperature range - 55 to +150 500 50 100 a typical thermal resistance r jl r ja 27 70 c/w i r - polarity: indicated by cathode band taiwan semiconductor TSSA3U45 v 0.30 0.40 note 1: pulse test with pulse width=300 s, 1% duty cycle marking code 50 operating temperature range - 55 to +150 maximum instantaneous reverse current at rated reverse voltage maximum instantaneous forward voltage (note 1) i f = 3a maximum average forward rectified current 3 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm typ max 0.42 0.48 mechanical data case: do-214ac (sma) features 3a, 45v trench schottk y rectifier do-214ac (sma) - moisture sensitivity level: level 1, per j-std-020 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec weight: 0.06g (approximately) 45 maximum repetitive peak reverse voltage maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter TSSA3U45 3u45
(t a =25c unless otherwise noted) document number: ds_d1412013 version: j15 g green compound part no. packing code preferred part no. part no. packing code packing code suffix description example ratings and chatacteristics curves ordering information packing code suffix package packing TSSA3U45 g TSSA3U45 e3g TSSA3U45 e3 TSSA3U45 taiwan semiconductor e3 clip sma 1,800 / 7" plastic reel e2 clip sma 7,500 / 13" plastic reel 0 0.5 1 1.5 2 2.5 3 3.5 0 25 50 75 100 125 150 average forward current (a) case temperature ( o c) fig.1 forward current derating curve with heatsink 5mm x 5mm pad pcb 0.01 0.1 1 10 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 instantaneous forward current (a) forward voltage (v) fig. 2 typical forward characteristics per leg t j =25 o c t j =100 o c t j =125 o c t j =150 o c 0.01 0.1 1 10 100 1000 10 20 30 40 50 60 70 80 90 100 instantaneous reverse current (ma) percent of rated peak reverse voltage (%) fig. 3 typical reverse characteristics per leg t j =25 o c t j =100 o c t j =125 o c 10 100 1000 10000 0.1 1 10 100 junction capacitance (pf) a reverse voltage (v) fig. 4 typical junction capacitance per leg f=1.0mhz vsig=50mvp-p
min max min max a 1.27 1.58 0.050 0.062 b 4.06 4.60 0.160 0.181 c 2.29 2.83 0.090 0.111 d 1.99 2.50 0.078 0.098 e 0.90 1.41 0.035 0.056 f 4.95 5.33 0.195 0.210 g 0.10 0.20 0.004 0.008 h 0.15 0.31 0.006 0.012 p/n = marking code g = green compound yw = date code f = factory code document number: ds_d1412013 version: j15 2.41 0.060 0.155 marking diagram e 3.93 5.45 0.095 0.215 unit (inch) suggested pad layout c d a b1.52 unit (inch) 0.066 symbol do-214ac (sma) TSSA3U45 taiwan semiconductor unit (mm) 1.68 package outline dimensions dim. unit (mm)
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1412013 version: j15 TSSA3U45 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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