page 1 of 5 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com the big deal ? high stopband rejection, up to 50 db ? patented design terminates stopband signals ? pass band cut-off up to 11 ghz ? stop band up to 26 ghz ? excellent repeatability through ipd* process product overview mini-circuits x-series of refectionless flters now includes 2- and 3-section models, giving you ultra-high rejection in the stopband C up to 50 db! refectionless flters employ a patented flter topology which absorbs and terminates stopband signals internally rather than refecting them back to the source. this new capability enables unique applications for flter circuits beyond those suited to traditional approaches. traditional flters are refective in the stopband, sending signals back to the source at 100% power. these refections interact with neighboring components and often result in intermodulation and other interfer - ences. by eliminating stopband refections, refectionless flters can readily be paired with sensitive devices and used in applications that otherwise require circuits such as isolation amplifers or attenuators. key features advantages easy integration with sensitive refective components, e.g. mixers, multipliers refectionless flters absorb unwanted signals, preventing refections back to the source. this reduces generation of additional unwanted signals without the need for extra components like attenuators, improving system dynamic range and sav- ing board space. high stopband rejection, up to 50 db ideal for applications where suppression of strong spurious signals and intermod- ulation products is needed. enables stable integration of wideband amplifers because refectionless flters maintain good impedance in the stopband; they can be integrated with high gain, wideband amplifers without the risk of creating instabilities in these out of band regions. cascadable refectionless flters can be cascaded in multiple sections to provide sharper and higher attenuation, while also preventing any standing waves that could affect passband signals. low & highpass flters can be cascaded to realize bandpass flters. excellent power handling in a tiny surface mount device up to 7w in passband high power handling extends the usability of these flters to the transmit path for inter-stage fltering. excellent repeatability of rf performance through semiconductor ipd process, x-series flters are inherently repeatable for large volume production. excellent stability over temperature with 0.3 db variation over temperature ideal for use in wide temperature range applications without the need for additional temperature compensation. operating temperature up to 105?c suitable for operation close to high power components. *ipd C integrated passive device, is a gaas semiconductor process 50? dc to 21 ghz reflectionless filters dice mmic new! two & three section models x-series available in low pass and high pass designs
page 2 of 5 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com rev. or m163578 XLF-362H-D+ wp/rs/cp 171109 XLF-362H-D+ 50 ? dc to 3910 mhz ordering information: refer to last page general description mini-circuits XLF-362H-D+ three-section refectionless flter die employs a novel flter topology which absorbs and terminates stop band signals internally rather than refecting them back to the source. this new capability enables unique applications for flter circuits beyond those suited to traditional approaches. traditional flters are refective in the stop band, sending signals back to the source at 100% of the power level. these refections interact with neighboring components and often result in inter-modulation and other interferences. refectionless flters eliminate stop band refections, allowing them to be paired with sensitive devices and used in applications that otherwise require circuits such as isolation amplifers or attenuators. applications ? ism applications ? mobile ? wimax ? radio location. features ? match to 50 ? in the stop band, eliminates undesired refections ? cascadable ? excellent stopband rejection, 48 db typ. ? temperature stable, up to 105c ? protected by us patents 8,392,495; 9,705,467, additional patent pending ? protected by china patent 201080014266.1 ? protected by taiwan patent i581494 simplifed schematic and pad description bonding pad position dimensions in m, typical l1 l2 l3 h1 h2 h3 h4 thickness bond pad size 80 1340 1420 265 365 465 800 100 78 x 78 pad# description 2 rf-in 5 rf-out 1,3,4,6 ground die bottom ground note: 1. bond pad material - gold 2. bottom of die - gold plated refectionless low pass filter die +rohs compliant the +suffix identifies rohs compliance. see our web site for rohs compliance methodologies and qualifications 0 l1 l2 l3 0 h3 h4 h2 h1 5 1 2 3 4 6
page 3 of 5 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com XLF-362H-D+ insertion loss (db) f r equenc y ( mhz) specification definition f5 f 4 f 2 f 1 f 3 dc 0 10 20 30 40 50 60 0 4400 8800 13200 17600 22000 insertion loss (db) frequency (mhz) xlf - 362h+ insertion loss 1.0 1.5 2.0 2.5 3.0 3.5 0 4400 8800 13200 17600 22000 vswr frequency (mhz) xlf - 362h+ vswr typical performance data at 25c frequency (mhz) insertion loss (db) vswr (:1) 10 0.81 1.08 100 0.83 1.09 500 0.91 1.21 1000 1.09 1.39 3000 1.60 1.27 3910 1.80 1.18 5000 2.15 1.19 6300 2.89 1.08 8000 5.87 1.19 9200 16.43 1.36 10000 29.34 1.21 10700 39.66 1.16 12000 40.37 1.14 15000 53.48 1.58 18000 48.52 1.58 18500 48.02 1.72 20000 47.32 2.28 21000 47.05 2.67 22000 45.88 3.03 electrical specifcations 1 at 25c absolute maximum ratings 4 parameter ratings operating temperature -55c to +105c storage temperature -65c to +150c rf power input, passband (dc-f1) 2 4w at 25c rf power input, stopband (f2-f5) 3 1.6w at 25c 2 passband rating derates linearly to 2w at 105c ambient 3 stopband rating derates linearly to 0.8w at 105c ambient 4 permanent damage may occur if any of these limits are exceeded. parameter f# frequency (mhz) min. typ. max. unit pass band insertion loss dc - f1 dc - 3910 1.3 db frequency cut-off f2 6300 3.0 vswr dc - f1 dc - 3910 1.3 :1 stop band rejection f3 - f3 9200 - 10700 28 db f3 - f4 10700 - 18500 48 f4 - f5 18500 - 21000 50 vswr f3 - f3 9200 - 10700 1.2 :1 f3 - f4 10700 - 18500 1.4 f4 - f5 18500 - 21000 2.2 f5 f 4 f 2 f 1 f 3 insertion loss (db) f r equenc y ( mhz) dc f 3? specification definition 1 measured on mini-circuits characterization test board. die packaged in 3x3mm, 12-lead mclp package and soldered on tb-844-362h+. mmic refectionless low pass filter die
page 4 of 5 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com XLF-362H-D+ assembly diagram assembly and handling procedure 1. storage dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. esd mmic gallium arsenide (gaas) flter dice are susceptible to electrostatic and mechanical damage. die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta tion. devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter esd damage to dice. 3. die attach the die mounting surface must be clean and fat. using conductive silver flled epoxy, recommended epoxies are diemat dm6030hk-pt/h579/h579 or ablestik 84-1lmisr4. apply suffcient epoxy to meet required epoxy bond line thickness, epoxy fllet height and epoxy coverage around total die periphery. parts shall be cured in a nitrogen flled atmosphere per manufac turers cure condition. it is recommended to use antistatic die pick up tools only. 4. wire bonding bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. thermosonic bonding is used with minimized ultrasonic content. bond force, time, ultrasonic power and temperature are all critical parameters. suggested wire is pure gold, 1 mil diameter. bonds must be made from the bond pads on the die to the package or substrate. all bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. note: ground bond wires are optional. mmic refectionless low pass filter die ground rf - in rf - out
page 5 of 5 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com XLF-362H-D+ performance data data table swept graphs s-parameter (s2p files) data set with and without port extension (.zip fle) case style die die ordering and packaging information quantity, package model no. small, gel - pak: 5,10,50,100 kgd* medium ? , partial wafer: kgd*<650 XLF-362H-Dg+ XLF-362H-Dp+ ? available upon request contact sales representative refer to an-60-067 environmental ratings env-80 additional notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp d. mini-circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an as is basis, with all faults. e. purchasers of this part are solely responsible for proper storing, handling, assembly and processing of known good dice (including, without limitation, proper esd preventative measures, die preparation, die attach, wire bond ing and related assembly and test activities), and mini-circuits assumes no responsibility therefor or for environmental effects on known good dice. f. mini-circuits and the mini-circuits logo are registered trademarks of scientifc components corporation d/b/a mini- circuits. all other third-party trademarks are the property of their respective owners. a reference to any third-party trademark does not constitute or imply any endorsement, affliation, sponsorship, or recommendation by any such third-party of mini-circuits or its products. esd rating** human body model (hbm): class 1a (pass 250v) in accordance with ansi/esd stm 5.1 - 2001 additional detailed technical information additional information is available on our dash board. *known good dice (kgd) means that the dice are taken from pcm good wafer and visually inspected in question have been subjected to mini-cir - cuits while this is not defnitive, it does help to provide a higher degree of confdence that dice are capable of meeting typical rf electrical parameters specifed by mini-circuits. ** tested in industry standard mclp 3x3mm, 12-lead package. mmic refectionless low pass filter die
|
