AOD2910E general description product summary v ds i d (at v gs =10v) 37a r ds(on) (at v gs =10v) < 23m? r ds(on) (at v gs =4.5v) < 33m? typical esd protection hbm class 2 applications 100% uis tested 100% rg tested 100v n-channel mosfet orderable part number package type form minimum order quantity 100v ? trench power mv mosfet technology ? low r ds(on) ? low gate charge ? esd protected ? optimized for fast-switching applications absolute maximum ratings t =25c unless otherwise noted AOD2910E to-252 tape & reel 2500 ? synchronous rectification in dc/dc and ac/dc conv erters ? industrial and motor drive applications to252 dpak top view bottom view g s d g s d g d s symbol v ds v gs i dm i as avalanche energy l=0.1mh c e as v ds spike v spike t j , t stg symbol t 10s steady-state steady-state r q jc t a =25c t a =70c t c =25c t c =100c t c =25c avalanche current c continuous drain current thermal characteristics parameter max t a =70c 4.0 c units junction and storage temperature range -55 to 175 typ p dsm w t a =25c 6.2 power dissipation a maximum junction-to-ambient a c/w r q ja 15 40 20 w i d v a 14 a 70 i dsm 9 mj 10 11 37 va absolute maximum ratings t a =25c unless otherwise noted 20 v maximum units maximum junction-to-case c/w c/w maximum junction-to-ambient a d 1.7 50 2.1 power dissipation b 35.5 t c =100c 10s p d 100 120 71.5 gate-source voltage pulsed drain current c 26 parameter drain-source voltage continuous drain current rev.1.0: september 2015 www.aosmd.com page 1 of 6
AOD2910E symbol min typ max units bv dss 100 v v ds =100v, v gs =0v 1 t j =55c 5 i gss 10 a v gs(th) gate threshold voltage 1.6 2.15 2.7 v 18.5 23 t j =125c 33 42 23.5 33 m? g fs 40 s v sd 0.72 1 v i s 37 a c iss 1200 pf c oss 93 pf c rss 6.3 pf r g 0.5 1.0 1.5 ? q g (10v) 16.5 25 nc q g (4.5v) 8 14 nc q gs 3.5 nc q gd 2.5 nc t d(on) 6 ns t r 3 ns t d(off) 22 ns t f 3 ns m? v gs =10v, v ds =50v, i d =20a total gate charge electrical characteristics (t j =25c unless otherwise noted) static parameters parameter conditions gate resistance f=1mhz i dss a zero gate voltage drain current drain-source breakdown voltage i d =250 m a, v gs =0v r ds(on) static drain-source on-resistance gate source charge gate drain charge total gate charge switching parameters turn-on delaytime v ds =0v, v gs =20v maximum body-diode continuous current input capacitance gate-body leakage current turn-off delaytime turn-off fall time v gs =10v, v ds =50v, r l =2.5 w , r gen =3 w diode forward voltage dynamic parameters v gs =4.5v, i d =16a turn-on rise time reverse transfer capacitance v gs =0v, v ds =50v, f=1mhz v ds =v gs, i d =250 m a output capacitance forward transconductance i s =1a, v gs =0v v ds =5v, i d =20a v gs =10v, i d =20a t f 3 ns t rr 25 ns q rr 120 nc this product has been designed and qualified for th e consumer market. applications or uses as critical components in life support devices or systems are n ot authorized. aos does not assume any liability ar ising out of such applications or uses of its products. aos reserves the right to improve product design, functions and reliability without notice. body diode reverse recovery charge body diode reverse recovery time i f =20a, di/dt=500a/ m s turn-off fall time i f =20a, di/dt=500a/ m s a. the value of r q ja is measured with the device mounted on 1in 2 fr-4 board with 2oz. copper, in a still air environ ment with t a =25 c. the power dissipation p dsm is based on r q ja t 10s and the maximum allowed junction temperature of 150 c. the value in any given application depends on the user's specific board design, and th e maximum temperature of 175 c may be used if the pcb allows it. b. the power dissipation p d is based on t j(max) =175 c, using junction-to-case thermal resistance, and i s more useful in setting the upper dissipation limit for cases where additional heatsi nking is used. c. single pulse width limited by junction temperatu re t j(max) =175 c. d. the r q ja is the sum of the thermal impedance from junction t o case r q jc and case to ambient. e. the static characteristics in figures 1 to 6 are obtained using <300 m s pulses, duty cycle 0.5% max. f. these curves are based on the junction-to-case t hermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of t j(max) =175 c. the soa curve provides a single pulse rating. g. the maximum current rating is package limited. h. these tests are performed with the device mounte d on 1 in 2 fr-4 board with 2oz. copper, in a still air environ ment with t a =25 c. rev.1.0: september 2015 www.aosmd.com page 2 of 6
AOD2910E typical electrical and thermal characteristics 0 10 20 30 40 50 1 2 3 4 5 i d (a) v gs (volts) figure 2: transfer characteristics (note e) 10 15 20 25 30 0 5 10 15 20 25 30 r ds(on) (m w ) i d (a) figure 3: on - resistance vs. drain current and gate 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 25 50 75 100 125 150 175 200 normalized on-resistance temperature (c) figure 4: on - resistance vs. junction temperature v gs =4.5v i d =16a v gs =10v i d =20a 25 c 125 c v ds =5v v gs =4.5v v gs =10v 0 10 20 30 40 50 0 1 2 3 4 5 i d (a) v ds (volts) figure 1: on-region characteristics (note e) v gs =3v 3.5v 4.5v 10v 4v 6v d figure 3: on - resistance vs. drain current and gate voltage (note e) 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.2 0.4 0.6 0.8 1.0 i s (a) v sd (volts) figure 6: body-diode characteristics (note e) 25 c 125 c figure 4: on - resistance vs. junction temperature (note e) 10 20 30 40 50 2 4 6 8 10 r ds(on) (m w ) v gs (volts) figure 5: on-resistance vs. gate-source voltage (note e) i d =20a 25 c 125 c rev.1.0: september 2015 www.aosmd.com page 3 of 6
AOD2910E typical electrical and thermal characteristics 0 100 200 300 400 500 0.0001 0.001 0.01 0.1 1 10 100 power (w) pulse width (s) figure 10: single pulse power rating junction - to - 0 2 4 6 8 10 0 5 10 15 20 v gs (volts) q g (nc) figure 7: gate-charge characteristics 0 200 400 600 800 1000 1200 1400 1600 0 20 40 60 80 100 capacitance (pf) v ds (volts) figure 8: capacitance characteristics c iss c oss c rss v ds =50v i d =20a t j(max) =175 c t c =25 c 10 m s 0.0 0.1 1.0 10.0 100.0 0.01 0.1 1 10 100 1000 i d (amps) v ds (volts) v > or equal to 4.5v 10 m s 1ms dc r ds(on) limited t j(max) =175 c t c =25 c 100 m s 10ms figure 10: single pulse power rating junction - to - case (note f) 0.01 0.1 1 10 1e-05 0.0001 0.001 0.01 0.1 1 10 100 z q jc normalized transient thermal resistance pulse width (s) figure 11: normalized maximum transient thermal imp edance (note f) single pulse d=t on /t t j,pk =t c +p dm .z q jc .r q jc t on t p dm in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse v gs > or equal to 4.5v figure 9: maximum forward biased safe operating area (note f) r q jc =2.1 c/w rev.1.0: september 2015 www.aosmd.com page 4 of 6
AOD2910E typical electrical and thermal characteristics 0 20 40 60 80 100 0 25 50 75 100 125 150 175 power dissipation (w) t case ( c) figure 12: power de-rating (note f) 0 10 20 30 40 50 0 25 50 75 100 125 150 175 current rating i d (a) t case ( c) figure 13: current de-rating (note f) 1 10 100 1000 10000 1e-05 0.001 0.1 10 1000 power (w) pulse width (s) t a =25 c 0.001 0.01 0.1 1 10 0.0001 0.001 0.01 0.1 1 10 100 1000 z q ja normalized transient thermal resistance pulse width (s) figure 15: normalized maximum transient thermal imp edance (note h) single pulse d=t on /t t j,pk =t a +p dm .z q ja .r q ja t on t p dm in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse pulse width (s) figure 14: single pulse power rating junction-to-am bient (note h) r q ja =50 c/w rev.1.0: september 2015 www.aosmd.com page 5 of 6
AOD2910E - + vdc ig vds dut - + vdc vgs vgs 10v qg qgs qgd charge gate charge test circuit & waveform - + vdc dut vdd vgs vds vgs rl rg vgs vds 10% 90% resistive switching test circuit & waveforms t t r d(on) t on t d(off) t f t off l bv unclamped inductive switching (uis) test circuit & waveforms vds dss 2 e = 1/2 li ar ar figure a: gate charge test circuit & waveforms figure b: resistive switching test circuit & wavefor ms figure c: unclamped inductive switching (uis) test c ircuit & waveforms vdd vgs id vgs rg dut - + vdc vgs vds id vgs i ig vgs - + vdc dut l vgs vds isd isd diode recovery test circuit & waveforms vds - vds + i f ar di/dt i rm rr vdd vdd q = - idt t rr figure d: diode recovery test circuit & waveforms rev.1.0: september 2015 www.aosmd.com page 6 of 6
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