q?v~zy??q?v?_ra]?????qcabeq HFC2N60U 2 1 3 bv dss = 600 v r ds(on) typ =
i d =2a ? originative new design ? superior avalanche rugged technology ? robust gate oxide technology ? very low intrinsic capacitances ? excellent switching characteristics ? unrivalled gate charge : 5.5 nc (typ.) ? extended safe operating area ? lower r ds(on) :4
7 \ s # 9 gs =10v ? 100% avalanche tested features absolute maximum ratings t c =25 e unless otherwise specified HFC2N60U 600v n-channel mosfet symbol parameter value units v dss drain-source voltage 600 v i d drain current ? continuous (t c = 25 e ) 2.0 * a drain current ? continuous (t c = 100 e ) 1.3 * a i dm drain current ? pulsed (note 1) 8.0 * a v gs gate-source voltage 30 v e as single pulsed avalanche energy (note 2) 116 mj i ar avalanche current (note 1) 2.0 a e ar repetitive avalanche energy (note 1) 5.4 mj dv/dt peak diode recovery dv/dt (note 3) 4.5 v/ns p d power dissipation (t c = 25 e ) - derate above 25 e 10 w 12.5 w/ e t j , t stg operating and storage temperature range -55 to +150 e t l maximum lead temperature for soldering purposes, 1/8? from case for 5 seconds 300 e 1.gate 2. drain 3. source thermal resistance characteristics symbol parameter typ. max. units r jc junction-to-case -- 13 e /w r ja junction-to-ambient -- 62.5 november 2014 to-126 * drain current limited by junction temperature
q?v~zy??q?v?_ra]?????qcabeq HFC2N60U notes ; 1. repetitive rating : pulse width limited by maximum junction temperature 2. l=53mh, i as =2a, v dd =50v, r g =25 : , starting t j =25 q c 3. i sd ? $ di/dt ? $ v , v dd ? % 9 dss , starting t j =25 q c 4. pulse test : pulse width ? v ' x w \ & |