page 1 of 4 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com product overview mini-circuits EP2K-D+ is a mmic splitter/combiner die designed for wideband operation from 2 to 26.5 mhz. this model provides excellent power ratings up to 2.5w power handling (as a splitter) and up to 1.2a dc current handling. manufactured using gaas ipd technology, it provides a high level of esd protection and excellent reliability. feature advantages wideband, 1.8 to 28 ghz one power splitter can be used in many applications, saving component count. also ideal for wideband applications such as military and instrumentation. excellent power handling 2.5w as a splitter 1.7w internal dissipation as a combiner in power combiner applications, half the power is dissipated internally. EP2K-D+ is designed to handle 1.7w internal dissipation as a combiner allowing reliable operation without excessive temperature rise. similar splitters implemented as wilkinson splitters on pcb require big resistors and additional heat sinking. as a splitter, EP2K-D+ can handle up to 2.5w in a very small package. dc passing up to 1.2a dc current passing is helpful in applications where both rf & dc need to pass through the dut, such as antenna mounted hardware. unpackaged die enables user to integrate it directly into hybrids. EP2K-D+ the big deal ? ultra-wide bandwidth, usable over 1.8 to 28 ghz ? high power handling, 2.5w as a splitter 2 way-0 50 ? 2 to 26.5 ghz key features mmic power splitter/combiner die
page 2 of 4 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com rev. or m153146 EP2K-D+ rs/cp/am 160510 EP2K-D+ features ? wide bandwidth, 2 to 26.5 ghz, usable over 1.8 to 28 ghz ? excellent amplitude unbalance, 0.1 db typ. ? good phase unbalance, 1.5 to 8.5 deg. typ. ? high esd level* ? dc passing applications ? wimax ? ism ? instrumentation ? radar ? wlan ? satellite communications ? lt e 2 way-0 50 ? 2 to 26.5 ghz electrical specifcations at 25c 1 parameter frequency (ghz) min. typ. max. unit frequency range 2 26.5 ghz insertion loss, above 3.0 db 2 2 - 5 0.8 db 5 - 10 0.9 10 - 18 1.6 18 - 26.5 2.1 isolation 2 - 5 9.5 db 5 - 10 18.0 10 - 18 18.9 18 - 26.5 15.9 phase unbalance 2 - 5 1.5 degree 5 - 10 2.9 10 - 18 6.0 18 - 26.5 8.5 amplitude unbalance 2 - 5 0.1 db 5 - 10 0.1 10 - 18 0.2 18 - 26.5 0.3 vswr (port s) 2 - 5 1.6 :1 5 - 10 1.2 10 - 18 1.3 18 - 26.5 1.5 vswr (port 1-2) 2 - 5 1.7 :1 5 - 10 1.2 10 - 18 1.4 18 - 26.5 1.6 simplifed electrical schematic maximum ratings 2,3 parameter ratings operating temperature -40c to 85c power input (as a splitter) 2.5w max. at 25c. derate linearly to 1.25w at 85c internal dissipation 1.7w max. at 25c. derate linearly to 1.1w at 85c dc current 1.2a max. at 25c. derate linearly to 0.6a at 85c 2. permanent damage may occur if any of these limits are exceeded. 3. die performance is measured in industry standard 4x4mm 24-lead mclp package. * esd rating human body model (hbm): class 2(1800 to <4000 v) in accordance with ansi/esd 5.1-2007 machine model (mm): class m3 (200 to <400 v) in accordance with ansi/esd 5.2-2009 1. tested on mini-circuits die characterization test board. pad connections pad description rf in rf-in as splitter / rf-out as combiner rf out1 rf-out1 as splitter / rf-in1 as combiner rf out2 rf-out1 as splitter / rf-in1 as combiner ordering information: refer to last page mmic power splitter/combiner die +rohs compliant the +suffix identifies rohs compliance. see our web site for rohs compliance methodologies and qualifications
page 3 of 4 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com EP2K-D+ die layout critical dimensions parameter values die thickness, m 200 die width, m 2650 die length, m 1880 bond pad size, m 150 x 150 bonding pad position (dimensions in m, typical) fig 2. die layout fig 3. bonding pad positions assembly diagram assembly and handling procedure 1. storage dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. esd mmic amplifer dice are susceptible to electrostatic and mechanical damage. die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta tion. devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter esd damage to dice. 3. die attach the die mounting surface must be clean and fat. using conductive silver flled epoxy, recommended epoxies are diemat dm6030hk-pt/h579 or ablestik 84-1lmisr4. apply suffcient epoxy to meet required epoxy bond line thickness, epoxy fllet height and epoxy coverage around total die periphery. parts shall be cured in a nitrogen flled atmosphere per manufacturers cure condition. it is recommended to use antistatic die pick up tools only. 4. wire bonding bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. thermosonic bonding is used with minimized ultrasonic content. bond force, time, ultrasonic power and temperature are all critical parameters. suggested wire is pure gold, 1 mil diameter. bonds must be made from the bond pads on the die to the package or substrate. all bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. recommended wire length, typical wire wire length (mm) wire loop height (mm) rf in, rf out1, rf out2 0.40 0.15 four 1 mil bond wires should be used for rf input and rf output. mmic power splitter/combiner die
page 4 of 4 notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com performance data data table swept graphs s-parameter (s3p files) data set with and without port extension (.zip fle) case style die die ordering and packaging information (note 3) quantity, package model no. small, gel - pak: 5,10,50 medium ? , partial wafer: 350 large ? , full wafer EP2K-Dg+ EP2K-Dp+ EP2K-Df+ ? refer to an-60-067 environmental ratings env-80 additional notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp d. mini-circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an as is basis, with all faults. e. purchasers of this part are solely responsible for proper storing, handling, assembly and processing of known good dice (including, without limitation, proper esd preventative measures, die preparation, die attach, wire bond ing and related assembly and test activities), and mini-circuits assumes no responsibility therefor or for environmental effects on known good dice. f. mini-circuits and the mini-circuits logo are registered trademarks of scientifc components corporation d/b/a mini- circuits. all other third-party trademarks are the property of their respective owners. a reference to any third-party trademark does not constitute or imply any endorsement, affliation, sponsorship, or recommendation by any such third-party of mini-circuits or its products. additional detailed technical information additional information is available on our dash board. EP2K-D+ esd rating** human body model (hbm): class 2 (1800 to <4000v) in accordance with ansi/esd stm 5.1 - 2007 machine model (mm): class m3 (200 to <400v) in accordance with ansi/esd stm5.2-1999 ** tested in industry standard 4x4mm, 24-lead mclp package. 3. dice taken from pcm good wafer. no rf or dc test performed. mmic power splitter/combiner die
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