tpcm? 780 is a high performance, inherently tacky, easy to rework phase change thermal interface material. developed specifcally to meet the high ther mal conductivity and low thermal resistance requirements of todays demanding processors. this silicone-free material is so soft that it begins to fow as the temperature is elevated by just a small amount. also, since no tabs are required, tpcm? 78 0 eliminates the need for expensive converting. ? minimizes contact thermal resistance by flling the microscopic irregularities of the components it contacts. begins to soften and fow at approximately 45oc ? designed to minimize migration (pump out) at cpu operating temperatures using a unique material formulation that softens, but does not fully change phase ? silicone-free for applications that are silicone sensitive ? outstanding thermal performance helps to ensure cpu/application reliability ? no mess due to thixotropic characteristics which prevent fow outside of interface ? very soft at room temperature, therefore less stress on board during assembly ? tabless parts make for easier handling in the manufacturing environment ? rohs compliant ? 94v0 ul flammability rating ? naturally tacky at room temperature, requiring no adhesive ? heat sink preheating not required ? exceptionally high reliability during storage and after installation features and benefits tpcm tm 780 phase change material applications ? graphics cards ? notebooks ? desktops ? servers ? memory modules ? automotive ? igbts tabless parts tabbed parts easy handling in manufacturing environment/rapid handling marked tab reduces risk of top tab being left in place during assembly eliminating risk of top tab being left in place during assembly tab provides protection from dust and other contamination during application of pads and shipping of applied pads minimum part size is 8mm x 8mm (smaller size may be available via engineering approval) minimum part size is 10mm x 10mm (smaller size may be available via engineering approval) thicknesses are 0.016 inch (0.406mm) and 0.025 inch (0.635mm) thicknesses are 0.008 inch (0.203mm) and 0.010 inch (0.254mm) americas: +1.800.323.3757 lhp.sales@lairdtech.com europe: +46.8.555.722.00 lhp.sales@lairdtech.com asia: +86.10.5933.3682 lhp-chinasales@lairdtech.com www.lairdtech.com
properties tpcm tm 780 test method color grey visual thickness, inches (mm) 0.008 (0.203), 0.010 (0.254) 0.016 (0.406), 0.025 (0.635) thickness tolerance, inches (mm) 0.0008 (0.0203), 0.0010 (0.0254) 0.0016 (0.0406), 0.0025 (0.0635) construction & composition non-reinforced film specifc gravity, g/cc 2.48 helium pycnometer phase change softening range, c ~45c to 70c thermal conductivity, w/mk 5.4 hot disk thermal constants analyzer hardness (shore 00) 85 3 sec @ 21 c astm d2240 thermal resistance 70c, 345 kpa, c-cm 2 /w (50 psi, c-in 2 /w) 0.025 (0.004) astm d5470 (modifed) outgassing tml 0.51% astm e595 outgassing cvcm 0.20% astm e595 bond line thickness vs pressure at 70 c pressure (psi) thickness (inches) tpcm tm 780 phase change material pressure (psi) pressure (psi) thermal resistance thickness (inches) thermal resistance vs pressure pressure (psi) thickness (inches) thr-ds-tpcm -780 0613 any information furnished by laird technologies, inc. and its agents is believed to be accurate and reliable. all specifcations are subject to change without notice. responsibility for the use and application of laird technologies materials rests with the end user, since laird technologies and its agents cannot be aware of all potential uses. laird technologies makes no warranties as to the ftness, merchantability or suitability of any laird technologies materials or products for any specifc or general uses. laird technologies shall not be liable for incidental or consequential damages of any kind. all laird technologies products are sold pursuant to the laird technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. ? copyright 2013 laird technologies, inc. all rights reserved. laird, laird technologies, the laird technologies logo, and other marks are trade marks or registered trade marks of laird technolo - gies, inc. or an affliate company thereof. other product or service names may be the property of third parties. nothing herein provides a license under any laird technologies or any third party intellectual property rights. document a15585-00 rev c 06/2013
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