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ligitek electronics co.,ltd. property of ligitek only pb lead-free parts surface mount led tape and reel data sheet doc. no : qw0905-lrgb 9553/s32 rev. : a date : 08 - aug. - 2016 lrgb9553/s32 l dcc
features: 1. top view white led. 2. white smt package. 3. leadframe package with indivi dual 4 pin. 4.wide viewing angle. 5.soldering methods:ir reflow soldering. 6.feature of the device:more light due to higher optical efficiency;extremely wide viewing angle;ideal for backlighting and coupling in light guide. descriptions: the lrgb9553 smd has wide viewing angle and optimized light coupling by inter reflector,the low current requirement makes this device i deal for portable equipment or any other application where power is at a premium. applications: 1. lcd back light. 2. mobile phones. 3. indicators. 4. switch lights. 5. lighting. page 1/13 ligitek electronics co.,ltd. property of ligitek only part no. lrgb9553/s32 device selection guide: color ingan algainp material part no blue red emitted water clear lens ingan green lrgb9553/s32
page 2/13 ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.2mm unless otherwise noted. 2.specifications are subject to change without notice. note : the tolerances unless mentioned is 0.1mm unit=mm. recommended soldering pad dimensions 4.9 1.6 0.65 1.6 0.85 0.85 0.70.05 0.70.05 2.7 0.8 0.8 3.2 0.8 4 1 3.5 3 1.9 2 2.2 soldering terminal 0.70.05 0.70.05 0.8 0.8 + - 1 - 2 - 3 4 rgb part no. lrgb9553/s32
page 3/13 ratings ma unit mw ma v a symbol pd i fp i f power dissipation forward current peak forward current duty 1/10@10khz parameter ir esd tstg t opr electrostatic discharge operating temperature reverse current @5v storage temperature ligitek electronics co.,ltd. property of ligitek only typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2.the luminous intensity data did not including 15% testing tolerance. 3.the color coordinates measurememt allowance is 0.01 testing tolerance. 2 1/2 d symbol forward voltage v f viewing angle dominant wavelength spectral line half-width luminous intensity items iv v deg min. typ. max. nm nm if=20ma condition mcd unit rg b if=20ma if=20ma if=20ma if=20ma part no. lrgb9553/s32 30 30 30 90 100 100 72 108 108 10 50 50 2000 500 500 -40 ~ + 85 -40 ~ + 100 r 125 ---- 320 g 320 ---- 800 b 125 ---- 320 r----630---- g----525---- b---- 470 ---- r---- 20 ---- g---- 36 ---- b ---- 30 ---- r1.5 ---- 2.4 g 2.8 ---- 3.6 b 2.8 ---- 3.6 r---- 120 ---- g---- 120 ---- b----120----
ligitek electronics co.,ltd. property of ligitek only page 4/13 luminous intensity classification part no. lrgb9553/s32 iv(mcd) at 20ma bin code min. max. iv(mcd) at 20ma bin code min. max. iv(mcd) at 20ma bin code min. max. r r 125 200 s 200 320 b r 125 200 s 200 320 g t 320 500 u 500 800
ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve page 5/13 fig.6 directive radiation -60 100% 50% 75% 25% -30 60 75% 0 25% 50% 100% 30 0 part no. lrgb9553/s32 relative intensity@20ma 600 wavelength (nm) 550 0 700 650 0.5 0.5 relative intensity@20ma normalize@25 forward voltage@20ma normalize @25 20 ambient temperature( ) fig.5 relative intensity vs. wavelength 1.0 ambient temperature( ) 0.8 -0 -20 -40 60 40 20 80 100 0 -40 -20 -0 60 40 80 100 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 100 relative intensity normalize @20ma forward current(ma) forward current(ma) forward voltage(v) 1.5 1.0 0.1 2.5 2.0 3.0 1.0 10 0 1.0 10 0.5 1.0 1.5 2.0 100 1000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 1000 3.5 2.5 3.0 hrf chip
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature relative intensity@20ma wavelength (nm) 450 0.0 0.5 500 550 600 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature forward voltage@20ma normalize @25 1.0 -40 0.8 -20 1.1 1.0 0.9 1.2 relative intensity@20ma normalize @25 20 060 40 100 80 ambient temperature( ) -40 -20 020 60 40 100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 forward current(ma) 1.0 0.1 1.0 10 dgm chip 1000 relative intensity normalize @20ma 3.0 4.0 5.0 1000 forward current(ma) 1.0 10 100 page 6/13 fig.6 directive radiation -60 100% 50% 75% 25% -30 60 75% 0 25% 50% 100% 30 0 part no. lrgb9553/s32
typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 0.5 relative intensity@20ma normalize @25 forward voltage@20ma normalize @25 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40 -20 100 80 60 40 20 0.0 60 100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 relative intensity normalize @20ma forward current(ma) 110 0.0 0.5 1.0 1.5 2.0 100 1000 fig.2 relative intensity vs. forward current 2.5 3.0 dbk chip fig.6 directive radiation 0 30 60 -30 -60 25% 100% 0 25% 50% 75% 75% 100% 50% fig.5 relative intensity vs. wavelength relative intensity@20ma wavelength (nm) 400 450 500 0.0 0.5 1.0 550 part no. lrgb9553/s32 page 7/13 forward current(ma) forward voltage(v) fig.1 forward current vs. forward voltage 2.0 100 1.0 0.1 10 1.0 1000 3.0 4.0 5.0
page 8/13 ligitek electronics co.,ltd. property of ligitek only carrier type dimensions description quantity/reel packing specifications ? part no. note : the tolerances unless mentioned is 0.1mm,angle 0.5. unit=mm. lrgb9553/s32 label 0.8 0.2 0.2 0.4 0.6 0.8 0.4 0.6 2000 pcs 8.0mm tape,7"reel aluminum moist-proof bag label part no. lrgb9553/s32 4.0 2.0 5.4 8.0 0.3 1.5 1.75 3.5 3.84 4.0 2.08 3.02
s-t-s 2000 gs11560168 lrgb9553/s32 bin/ hue : qty(pcs): lot : part : ligitek electronics co., ltd. pb page 9/13 ligitek electronics co.,ltd. property of ligitek only bin : luminous intensity label explanation reel dimensions part no. lrgb9553/s32 vf:2.8-3.6 vf : forward voltage vf:1.5-2.4 vf:2.8-3.6 13.5 1.0 0.2 0.4 0.6 0.6 0.4 0.8 0.2 2.0 0.5 60.0 1.0 178 1.5 9.0 1.0 12.0 1.0 0.8
page 10/13 box explanation ligitek electronics co.,ltd. property of ligitek only part no. lrgb9553/s32 3. 10 inner boxes / carton 4. carton size : l x w x h 58cm x 34cm x 35cm l w h 1. 5 bag / inner box 2. inner box size : l x w x h 23cm x 8.5cm x 26cm l h w
page 11/13 recommended soldering conditions 1. hand solder basic spec is Q 320 3 sec one time only. ligitek electronics co.,ltd. property of ligitek only part no. lrgb9553/s32 1~5c/sec 2 pb-free reflow solder 3.after soldering,do not warp the circuit board. 1.reflow soldering should not be done more than two times. 2.when soldering,do not put stress on the leds during heating. note: 120 sec.max. 260c max. 10sec.max 1~5c/sec preheat 180~200c 6c/sec above 220c 60 sec.max.
page 12/13 led led circuit model a ligitek electronics co.,ltd. property of ligitek only circuit model b drive method: led is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. part no. lrgb9553/s32 precautions for use: storage time: 1. calculated shelf life before opening is 12 months at < 30c and < 90% relative humidity (rh) 2. after bag is opened, devices which will be subjected to reflow soldering or other high temperature processes must be a) assemblied within 168 hours in an environment of Q 30c / 60% rh, or b) stored at ambient of 10% rh or less 3. devices are required baking before assembly if: a) humidity indicator card reads >10% (for level 2a -5a) or >60% (for level 2) at ambient temperature 23 5c b) 2.a) or 2.b) doesn't meet 4. if baking is required, devices should be baked for >24 hours at 605c.performing baking only once, and using the baked devices within 72 hours.
page 13/13 reliability test: ligitek electronics co.,ltd. property of ligitek only part no. lrgb9553/s32 environmental test 1.t=260c max. 10sec.max. 2. 6 min ir reflow 1.100c5c ~ -40c5c 30mins / 5mins / 30mins 2.100 cyeles temperature cycling endurance test classification 1.ta=85c 2.rh=85% 3.t=1000hrs(-24hrs,+72hrs) 1.ta=-40c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=100c5c ~ -40c5c 20min/ 10sec / 20min 2.total 100 cycles high temperature high humidity storage test thermal shock test low temperature storage test 1.ta=100c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=25c 2.if=20ma 3.t=1000 hrs (-24hrs,+72hrs) high temperature storage test test item operating life test test condition sample size 22 22 22 22 22 22 22

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