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Amphenol Cables on Demand |
| Part No. |
SF-NDYYYF0004-001.5M
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| Description |
Amphenol SF-NDYYYF0004-001.5M 1.5m (4.9') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-426HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70400-0857 A-70400-0857
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 26, 0.38μm (15μ) Gold (Au)
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 26, 0.38μm (15μ) Gold (Au)
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| File Size |
165.82K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
78511-428HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136647-051142LF
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| Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Posts, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-425HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-421HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137785-051142LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Post, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-422HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-429HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-5114-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Official Product Page
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Bom2Buy.com
Price and Availability
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