|
|
![](images/bg04.gif) |
Amphenol Cables on Demand |
Part No. |
SF-NDYYYF0004-001.5M
|
Description |
Amphenol SF-NDYYYF0004-001.5M 1.5m (4.9') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
78511-426HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
78511-428HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
10136647-051142LF
|
Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Posts, Tray packing.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
78511-425HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
78511-421HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
10137785-051142LF
|
Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Post, Tray packing.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
78511-422HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
78511-429HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-5114-21D
|
Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
![](images/bom2buy.png)
Bom2Buy.com
![](images/findchips_sm.gif)
Price and Availability
|