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  51142-0400 Datasheet PDF File

For 51142-0400 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    A-70400-0845

Molex Electronics Ltd.
Part No. A-70400-0845
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 26, 0.38μm (15μ) Gold (Au), 6 Circuits

File Size 165.83K  /  3 Page

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Amphenol Cables on Demand

Part No. SF-NDYYYF0004-001.5M
Description Amphenol SF-NDYYYF0004-001.5M 1.5m (4.9') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70400-0846

Molex Electronics Ltd.
Part No. A-70400-0846
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 26, 0.38μm (15μ) Gold (Au)

File Size 165.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-426HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    70400-3140 A-70400-3140

Molex Electronics Ltd.
Part No. 70400-3140 A-70400-3140
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnPb

File Size 162.49K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-428HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    70400-3150 A-70400-3150

Molex Electronics Ltd.
Part No. 70400-3150 A-70400-3150
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnP

File Size 162.49K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136647-051142LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Posts, Tray packing.
Tech specs    

Official Product Page

    70400-3151 A-70400-3151

Molex Electronics Ltd.
Part No. 70400-3151 A-70400-3151
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnP

File Size 162.49K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-425HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    70400-3153 A-70400-3153

Molex Electronics Ltd.
Part No. 70400-3153 A-70400-3153
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnP

File Size 162.49K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137785-051142LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    70400-3156 A-70400-3156

Molex Electronics Ltd.
Part No. 70400-3156 A-70400-3156
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnP

File Size 162.50K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-422HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    70400-0844 A-70400-0844

Molex Electronics Ltd.
Part No. 70400-0844 A-70400-0844
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 26, 0.38μm (15μ) Gold (Au)

File Size 165.83K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-429HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    70400-0847 A-70400-0847

Molex Electronics Ltd.
Part No. 70400-0847 A-70400-0847
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 26, 0.38μm (15μ) Gold (Au)

File Size 165.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-421HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70400-0750

Molex Electronics Ltd.
Part No. A-70400-0750
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 26, 0.38μm (15μ) Gold (Au), 16 Circuits

File Size 161.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-5114-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 51142-0400 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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